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NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear or bottom exterior.

  .............................................   4

2-1.   Disassembly Flow ...........................................................   11
2-2.   Case (EZ) ........................................................................   11
2-3.   MB-134 Board ................................................................   12
2-4.   Bracket (MB) Block ........................................................   13
2-5.   Fuse (F901), POWER Board ..........................................   13
2-6.   Front Panel Block ...........................................................   14
2-7.   BD Drive (BPX-5) ..........................................................   14
2-8.   INCLUDE Board ............................................................   15
2-9.   Back Panel Block ............................................................   15
2-10.  MAIN Board ...................................................................   16
2-11.  AUDIO Board .................................................................   16
2-12.  Optical Device (KEM-460AAA), Wire (Flat Type) .......   17

TEST  MODE 

 ............................................................   18

ELECTRICAL  CHECK 

 .........................................   27

5-1.  Block Diagram - SERVO Section - ................................   28
5-2.  Block Diagram - MEMORY Section - ............................   29
5-3.  Block Diagram - TUNER, S-AIR Section - ....................   30
5-4.  Block Diagram - AUDIO Section - .................................   31
5-5.  Block Diagram - REGULATOR Section - ......................   32
5-6.  Block Diagram 

- PANEL, POWER SUPPLY Section - ...........................   33

5-7.  Schematic Diagram - MB-134 Board (1/13) - ................   35
5-8.  Schematic Diagram - MB-134 Board (2/13) - ................   36
5-9.  Schematic Diagram - MB-134 Board (3/13) - ................   37
5-10.  Schematic Diagram - MB-134 Board (4/13) - ................   38
5-11.  Schematic Diagram - MB-134 Board (5/13) - ................   39
5-12.  Schematic Diagram - MB-134 Board (6/13) - ................   40
5-13.  Schematic Diagram - MB-134 Board (7/13) - ................   41
5-14.  Schematic Diagram - MB-134 Board (8/13) - ................   42
5-15.  Schematic Diagram - MB-134 Board (9/13) - ................   43
5-16.  Schematic Diagram - MB-134 Board (10/13) - ..............   44

5-17.  Schematic Diagram - MB-134 Board (11/13) - ..............   45
5-18.  Schematic Diagram - MB-134 Board (12/13) - ..............   46
5-19.  Schematic Diagram - MB-134 Board (13/13) - ..............   47
5-20.  Printed Wiring Board 

- MB-134 Board (Component Side) - .............................   48

5-21.  Printed Wiring Board 

- MB-134 Board (Conductor Side) - ...............................   49

5-22.  Printed Wiring Board - AUDIO Board - .........................   50
5-23.  Schematic Diagram - AUDIO Board - ............................   51
5-24.  Printed Wiring Board 

- MAIN Board (Component Side) - ................................   52

5-25.  Printed Wiring Board 

- MAIN Board (Conductor Side) - ..................................   53

5-26.  Schematic Diagram - MAIN Board (1/5) - .....................   54
5-27.  Schematic Diagram - MAIN Board (2/5) - .....................   55
5-28.  Schematic Diagram - MAIN Board (3/5) - .....................   56
5-29.  Schematic Diagram - MAIN Board (4/5) - .....................   57
5-30.  Schematic Diagram - MAIN Board (5/5) - .....................   58
5-31.  Printed Wiring Boards - KEY Section - ..........................   59
5-32.  Schematic Diagram - KEY Section - ..............................   59
5-33.  Printed Wiring Board - REG Board - ..............................   60
5-34.  Schematic Diagram - REG Board - ................................   61
5-35.  Printed Wiring Board - INCLUDE Board - ....................   62
5-36.  Schematic Diagram - INCLUDE Board - .......................   63
5-37.  Printed Wiring Board - FL Board - .................................   64
5-38.  Schematic Diagram - FL Board - ....................................   65
5-39.  Printed Wiring Board - POWER Board - ........................   66
5-40.  Schematic Diagram - POWER Board - ..........................   67

6-1.  Case, Front Panel Section ...............................................   92
6-2.  MB-134 Board Section ...................................................   93
6-3.  Back Panel Section .........................................................   94
6-4.  MAIN Board Section ......................................................   95
6-5.  BD Drive Section (BPX-5) .............................................   96

   ..............................   97

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• 

Strong viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

J-6090-199-A

BLX-104

Single Layer

J-6090-200-A

BLX-204

Dual Layer

J-2501-307-A

CD (HLX-A1)

J-2501-305-A

HLX-513

Single Layer (NTSC)

J-2501-306-A

HLX-514

Dual Layer (NTSC)

J-6090-077-A

HLX-506

Single Layer (PAL)

J-6090-078-A

HLX-507

Dual Layer (PAL)

Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-

989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.

1. BLX-104
Procedure:
1.  Select 23.976Hz/1080p.
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not.
4.  Check each outputs.
 Video:
 

Composite/S Video/component/HDMI.

 Audio:
 

Speaker out.

*  When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz) 

can use instead of 1080/24p.

 

However this is temporary correspondence.

2. BLX-204
Procedure:
1.  Select 1080i (59.94Hz or 50Hz).
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not (Check the picture 

and sound output).

3.  CD (HLX-A1)
Procedure:
Check whether player can play back or not (Check the sound out-
put).

4.  HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1.  After displayed Main Menu, select “1.Video Signal”.
2.  Play “1.Color bar 100%” (Check the picture and sound out-

put).

3.  Return to Menu.
4.  Play “Demonstration 4:3” or “Demonstration 16:9” (Check the 

picture and sound output).

NOTE  THE  IC101,  IC104,  IC105,  IC204,  IC205,  IC307,  
IC311,  IC501  AND  IC502  ON  THE  MB-134  BOARD  
REPLACING
IC101, IC104, IC105, IC204, IC205, IC307, IC311, IC501 and  
IC502 on the MB-134 board cannot exchange with single. When 
these parts are damaged, exchange the entire mounted board.

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn on the system.

2.  Press the [FUNCTION] button to select “BD/DVD”.
3.  Press the [

x

] and [

Z

] buttons simultaneously and hold down 

unit “DEMO OFF” displayed on the fluorescent indicator tube 
(around 5 seconds).

Note: When “DEMO ON” is displayed, the disc tray lock is not released 

by turning power on/off with the [?/1] button.

ABOUT  THE  LENS  CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the 
trouble. 

CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention.
Connect the resistors referring to the fi gure below.

• 

MAIN board (C3115, C3125, C3215, C3315)

 

Both ends of CN3001.

:/2 W

• 

POWER board (C903, C932, C933)

 

Both ends of respective capacitors.

:/2 W

:/2 W

:/2 W

NOTE  OF  REPLACING  THE  OPTICAL  DEVICE (KEM-
460AAA)  OR  MB-134  BOARD
Optical device (KEM-460AAA) for BD requires precise read out 
functions and secure contents protection system for more than past 
DVD/CD.
Therefore, in the case repaired as follows, the writing work of the 
OP data is necessary.

•  When the optical device (KEM-460AAA) is replaced (The 

MB-134 board doesn’t replace).

•  When both the optical device (KEM-460AAA) and MB-134 

board are replaced.

•  When the MB-134 board is replaced (The optical device 

 

(KEM-460AAA) doesn’t replace) (In this case, do the work of 
“3. Optical device (KEM-460AAA) replacement” other than 
the replacement of new optical device).

Note: The servo adjustment is done while writing the OP data. The manual 

adjustment is unnecessary.

 

  LD ON TIME history doesn’t carry over.

 

  Do not touch any optical block parts, turn table and during replac-

ing. BD laser diode is very sensitive.

1. Preparation
1-1.  ESD Countermeasure
It is necessary to confi rm the state of static electricity in the work 
space before the repair is started.
The static electricity resistance of the BD laser is weaker than that 
of the DVD/CD laser.
Do work space and worker’s ESD countermeasures to prevent de-
struction by ESD.

1-2. Jig
• 

Digital camera (Recommend with macro mode)

• 

USB memory

• PC
• 

Barcode decoder (Refer to “1-3. Barcode decoder 
(BDBUDEC)”)

1-3. Barcode decoder (BDBUDEC)
Part No.  : J-6090-212-A
Jig name  : BDBUDec.exe
Release  : 2009.02.19
Version  : 1.0.0.0
Software contents  :
 

• BDBUDec.exe 

: Barcode decoder software

 

• SavePath.ini 

: Decoded fi le destination setting fi le (Ini-

tial destination is “C:\BuData.txt”)

 

• TasmanBars.dll  : Decode dll

 

• Uninst.exe 

: Uninstall the “BDBUDec.exe” from PC

Install procedure:
1.  Unzip the barcode decoder fi les to any PC folder.
2.  Check the taken barcode photo click & drop onto “BDBUDec.

exe”.

 

When the barcode decoder is used for the fi rst time, the pass-
word is necessary. It is unnecessary since the second times.

Note 1: The password will be supplied to only service headquarters, and 

service center name/q’ty/all of software registered information 
should be maintained by service headquarters.

Note 2: Do not change the decoded fi le name “BuData.txt”.

3.  When “.NET frame work requirements” is displayed, down-

load following applications from Microsoft download site.

• 

Microsoft .NET Framework Version 2.0 Redistributable Pack-
age (x86) 

 http://www.microsoft.com/downloads/details.aspx?displaylan

g=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5 

• 

Microsoft .NET Framework 2.0 Service Pack 1 (x86) 

 http://www.microsoft.com/downloads/details.aspx?displaylan

g=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5