Sony FST-ZX6 / FST-ZX8 / HCD-ZX6 / HCD-ZX8 / LBT-ZX6 / LBT-ZX8 Service Manual ▷ View online
29
29
HCD-ZX6/ZX8
HCD-ZX6/ZX8
7-2. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
Note on Schematic Diagram:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
Indication of transistor.
•
A
: B+ Line.
•
B
: B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
<
no mark : FM
<
> : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
f
: TUNER
E
: TAPE PLAY (DECK A)
d
: TAPE PLAY (DECK B)
G
: TAPE REC (DECK B)
J
: CD PLAY
• Abbreviation
E2
: 120 V AC area in E model
E51
: Chilean and Peruvian model
MX
: Mexican model
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
be added to ordinary solder.
7-3. WAVEFORMS
16MHz
IC401
qd
(X-OUT)
— MAIN Board —
1
2
32.768kHz
IC401
qa
(XC-OUT)
0.5Vp-p
2.8Vp-p
— PANEL Board —
1
4MHz
IC901
is
(XOUT)
2.6Vp-p
• Abbreviation
E2
: 120 V AC area in E model
E51
: Chilean and Peruvian model
MX
: Mexican model
Ver 1.1
30
30
HCD-ZX6/ZX8
HCD-ZX6/ZX8
7-4. PRINTED WIRING BOARD — BD SECTION — • Refer to page 28 for Circuit Boards Location.
: Uses unleaded solder.
1
A
B
C
D
E
F
G
H
2
3
4
5
6
7
8
9
10
11
12
13
14
C10
C260
C14
C15
C16
C18
C11
R405
C316
R354
R353
R352
R351
R302
R253
C315
R191
R172
R171
R162
R313
X171
R121
R12
R11
R10
Q10
C116
C312
C184
C183
C303
C305
C259
C258
C257
C255
C203
C196
C195
C201
C182
C171
C172
C308
C151
C134
C125
C314
C123
R165
R13
C17
FB301
C318
C174
R173
R205
C209
C210
C302
R201
R419
R412
R411
R410
R409
R408
R407
R406
R404
R403
R402
R401
R305
R303
R301
R252
R251
R182
R181
R163
R151
R143
R142
R141
R133
R132
R131
R114
R113
R112
R111
R307
C311
C310
C309
C307
C306
IC251
C252
C251
C194
C181
IC101
C163
C162
C143
C142
C141
C133
C132
C131
C124
C111
C122
C115
C114
C113
C112
IC301
C185
C186
R306
CN101
CN201
C317
R202
R203
R161
C161
C211
C212
R204
C213
IC303
C313
C320
M101
M102
S101
MAIN
BOARD
CN501
(Page 38)
Ref. No.
Location
IC101
F-11
IC251
D-8
IC301
D-11
IC303
B-12
Q10
G-6
• Semiconductor
Location
31
31
HCD-ZX6/ZX8
HCD-ZX6/ZX8
• Refer to page 56 for IC Block Diagrams.
7-5. SCHEMATIC DIAGRAM — BD SECTION — • Refer to page 57 for IC Pin Description of IC101.
IC B/D
IC B/D
TP165
TP166
TP178
TP186
TP187
TP167
TP177
T
P
1
2
1
TP
12
2
TP
12
3
C305
JPO004
JPO10
TP250
TP301
TP302
TP303
TP304
TP103
R163
R352
R353
R354
R401
R402
R403
R404
R405
R406
R407
R408
R409
R411
R412
R419
R11
R132
R251
R253
R12
R10
JPO102
JPO103
M101
C17
C151
C201
C203
C308
CN101
R
12
1
C183
C184
TP420
TP421
TP422
TP423
TP424
R252
TP425
TP426
TP427
TP428
TP429
TP431
TP432
R13
Q10
R313
TP433
TP436
TP401
TP407
TP406
TP405
TP404
TP403
TP402
TP408
TP410
TP434
TP417
TP416
TP415
TP414
TP413
TP412
TP419
TP411
TP409
TP19
TP18
TP16
TP15
TP102
TP14
TP13
TP12
TP11
TP10
R
1
3
1
R301
R303
R173
R203
R302
R162
R205
R410
C320
C163
C
1
9
6
M102
T
P
253
TP
25
2
TP
25
1
R112
R114
R111
R113
R305
IC301
R
14
1
R307
TP
1
25
T
P
1
24
T
P
1
4
2
T
P
1
4
9
C307
C309
C310
C311
C316
C315
C317
C312
C302
FB301
CN201
C212
C213
TP435
C211
C314
R306
C313
C318
C306
R351
C161
C174
C162
R161
TP104
TP105
C181
R181
R182
C182
IC101
C194
C143
C134
C
1
33
C
1
3
1
C124
C
1
2
3
C122
C125
C
1
3
2
C209
C210
T
P
1
4
8
T
P
1
4
5
T
P
1
4
4
TP
1
4
7
TP
1
53
T
P
1
46
T
P
1
6
0
T
P
1
6
2
S101
C195
C115
C114
C112
C16
C15
C10
C11
TP430
C251
C252
C255
C257
C260
IC303
R204
R201
R165
R151
R143
C171
R171
R172
C172
C186
C185
C14
TP17
C258
C259
IC251
C303
R191
R133
C141
R142
C142
X171
C111
C113
C116
C18
(Page 36)
32
32
HCD-ZX6/ZX8
HCD-ZX6/ZX8
7-6. PRINTED WIRING BOARDS — LOADING SECTION — • Refer to page 28 for Circuit Boards Location.
: Uses unleaded solder.
SE-130 BOARD
MD-94 BOARD
(13)
13
(13)
13
MAIN BOARD
CN509
B
M
M902
TURN TABLE
MOTOR
M
LOADING
MOTOR
ROTARY
ENCODER
1
A
B
C
D
E
F
2
3
4
5
6
M901
RE901
(Page 38)
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