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2012E08-1

© 

2012.05

•  SA-WGTK2i is the 
  subwoofer section in FST-GTK2i.

Subwoofer
SA-WGTK2i (for FST-GTK2i)
Subwoofer system
 

1-way, 1-driver, Bass refl ex

Speaker unit
 

Subwoofer: 200 mm (8 in), cone type

Rated impedance
 8 

ohms

Power requirements   

AC 127 V, 60 Hz

Power consumption   

200 W

Dimensions (w/h/d) (Approx.) 

320 mm × 435 mm × 420 mm

 

 

 

(12 5/8 in × 17 1/4 in × 16 5/8 in)

Mass (Approx.) 

 

11.5 kg (25 lb 6 oz)

Design and specifi cations are subject to change without notice.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

 ......................................................   3

2-1. Rear 

Cover 

Assy 

.............................................................   4

2-2. Front 

Panel 

Assy 

.............................................................   5

3-1. Block 

Diagram 

................................................................   7

3-2.  Printed Wiring Board – SUBWOOFER, SW SPK LED 
 

and SW VOL Board – .....................................................   9

3-3.  Schematic Diagram – SUBWOOFER, SW SPK LED 
 

and SW VOL Board – .....................................................   10

3-4.  Printed Wiring Board – SW TRANS and 
 

SW SWITCH Board – ....................................................   11

3-5.  Schematic Diagram – SW TRANS and 
 

SW SWITCH Board – ....................................................   12

4-1.  Back Panel Section .........................................................   13
4-2.  Front Panel Section .........................................................   14

ELECTRICAL PARTS LIST ..............................   15

•  JIG
  When disassembling the set, use the following jig 
  (for speaker removal).
  Part No. J-2501-238-A JIG FOR SPEAKER REMOVAL

Note  for  Repairing  of  the  SA-WGTK2i
The SA-WGTK2i has power switch but cannot be operated on its own. Be sure to connect the set to the HCD-GTK2i only when 
performing service and inspection.

Note: Follow the disassembly procedure in the numerical order given.

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