Sony DHC-FL3 / HCD-FL3 Service Manual ▷ View online
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
E Model
Australian Model
SPECIFICATIONS
HCD-FL3
Ver 1.3 2003.10
9-873-937-04
Sony Corporation
2003J05-1
Home Audio Company
C
2003.10
Published by Sony Engineering Corporation
– Continued on next page –
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM53M-30BD60
Section
Base Unit Name
BU-30BD60
Optical Pick-up Name
A-MAX.3
TAPE
Model Name Using Similar Mechanism
HCD-RG77
Section
Tape Transport Mechanism Type
TCM-230AWR41CS
HCD-FL3 are the amplifier, CD player,
tape deck and tuner section in DHC-FL3.
tape deck and tuner section in DHC-FL3.
Amplifier section
The following measured at AC 120, 220, 240 V,
50/60 Hz
50/60 Hz
MULTI mode
DIN power output at stereo mode (rated)
45 + 45 watts
(8 ohms at 1 kHz, DIN)
(8 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
Front speaker:
Front speaker:
60 + 60 watts
(8 ohms at 1 kHz, 10%
THD)
(8 ohms at 1 kHz, 10%
THD)
Center speaker:
60 watts
(16 ohms at 1 kHz, 10%
THD)
(16 ohms at 1 kHz, 10%
THD)
Rear speakers:
60 + 60 watts
(8 ohms at 1 kHz, 10%
THD)
(8 ohms at 1 kHz, 10%
THD)
Sub woofer:
100 watts
(8 ohms at 100 Hz, 10%
THD)
(8 ohms at 100 Hz, 10%
THD)
2.1CH mode
DIN power output at stereo mode (rated)
70 + 70 watts
(8 ohms at 1 kHz, DIN)
(8 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
Front speaker:
Front speaker:
120 + 120 watts
(8 ohms at 1 kHz, 10%
THD)
(8 ohms at 1 kHz, 10%
THD)
Sub woofer:
240 watts
(8 ohms at 100 Hz, 10%
THD)
(8 ohms at 100 Hz, 10%
THD)
Inputs
MD (VIDEO) IN:
MD (VIDEO) IN:
voltage 450 mV/250 mV,
(phono jacks)
impedance 47 kilohms
OPTICAL DIGITAL IN:
(Square optical connector jacks, rear panel)
wavelength
(Square optical connector jacks, rear panel)
wavelength
——
MIC:
sensitivity 1 mV,
(phone jack)
impedance 10 kilohms
Outputs
MD (VIDEO) OUT:
MD (VIDEO) OUT:
voltage 250 mV
(phono jacks)
impedance 1 kilohms
PHONES:
accepts headphones of
(stereo mini jack)
8 ohms or more
FRONT L/R:
Use only the supplied
speaker SS-FL7
speaker SS-FL7
REAR L/R:
Use only the supplied
speaker SS-RS7
speaker SS-RS7
CENTER:
Use only the supplied
speaker SS-CT7
speaker SS-CT7
S.WOOFER:
Use only the supplied
speaker SS-WG7
speaker SS-WG7
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ=795 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
OPTICAL CD DIGITAL OUT
(Square optical connector jack, rear panel)
wavelength
(Square optical connector jack, rear panel)
wavelength
660 nm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassette
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
2
HCD-FL3
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The following caution label is located inside the apparatus.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
General
Power requirements
Australian model:
Australian model:
230 – 240V AC, 50/60Hz
Argentine model:
220 V AC, 50/60 Hz
Mexican model:
120 V AC, 60 Hz
Other models:
120 V, 220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
Power consumption
400 watts
Dimensions (w/h/d)
Approx. 245 x 410 x 400 mm
Mass
Approx. 15 kg
Supplied accessories:
AM loop antenna (1)
FM lead antenna (1)
Remote commander (1)
Batteries (3)
Speaker cord (6)
Speaker support (2)
Screw 3 3 x 10 (8)
FM lead antenna (1)
Remote commander (1)
Batteries (3)
Speaker cord (6)
Speaker support (2)
Screw 3 3 x 10 (8)
Design and specifications are subject to change
without notice.
without notice.
AM tuner section
Tuning range
Pan American model:
Pan American model:
530 – 1,710 kHz
(with the interval set at
10 kHz)
531 – 1,710 kHz
(with the interval set at
9 kHz)
(with the interval set at
10 kHz)
531 – 1,710 kHz
(with the interval set at
9 kHz)
Other models:
531 – 1,602 kHz
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
3
HCD-FL3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
5
Setting the Clock .............................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
7
3-2. Top Panel Assy ................................................................
8
3-3. Back Cover ......................................................................
8
3-4. Side Panel (A)/(B) ...........................................................
9
3-5. Case .................................................................................
9
3-6. Front Panel Assy ............................................................. 10
3-7. GC Board ......................................................................... 10
3-8. Tape Mechanism assy ..................................................... 11
3-9. Belt .................................................................................. 11
3-10. SW Board, HEAD (A) Board, HEAD (B) Board .......... 12
3-11. CD Mechanism Block ..................................................... 12
3-12. CD Mechanism Deck (CDM53M-30BD60) .................. 13
3-13. Fitting Base Assy, Bracket (Chassis), Magnet Assy ...... 13
3-14. Base Unit (BU-30BD60) ................................................ 14
3-15. Tray (Sub) ........................................................................ 14
3-16. Chassis (Mold B) Section, Stocker Section,
3-7. GC Board ......................................................................... 10
3-8. Tape Mechanism assy ..................................................... 11
3-9. Belt .................................................................................. 11
3-10. SW Board, HEAD (A) Board, HEAD (B) Board .......... 12
3-11. CD Mechanism Block ..................................................... 12
3-12. CD Mechanism Deck (CDM53M-30BD60) .................. 13
3-13. Fitting Base Assy, Bracket (Chassis), Magnet Assy ...... 13
3-14. Base Unit (BU-30BD60) ................................................ 14
3-15. Tray (Sub) ........................................................................ 14
3-16. Chassis (Mold B) Section, Stocker Section,
Slider (Selection) ............................................................ 15
3-17. SUB TRANS Board ........................................................ 15
3-18. Back Cover Section ......................................................... 16
3-19. TRANS Board ................................................................. 16
3-20. SP RELAY Board ............................................................ 17
3-18. Back Cover Section ......................................................... 16
3-19. TRANS Board ................................................................. 16
3-20. SP RELAY Board ............................................................ 17
4.
ASSEMBLY
4-1. Assembly Flow ................................................................ 18
4-2. Gears Installation ............................................................ 18
4-3. Slider (Selection) Installation ......................................... 19
4-4. Stocker Section Installation ............................................ 19
4-5. Chassis (Mold B) Section Installation ............................ 20
4-2. Gears Installation ............................................................ 18
4-3. Slider (Selection) Installation ......................................... 19
4-4. Stocker Section Installation ............................................ 19
4-5. Chassis (Mold B) Section Installation ............................ 20
5.
TEST MODE
.............................................................. 21
6.
MECHANICAL ADJUSTMENTS
....................... 25
7.
ELECTRICAL ADJUSTMENTS
......................... 25
Deck Section ................................................................... 25
CD Section ...................................................................... 28
CD Section ...................................................................... 28
8.
DIAGRAMS
8-1. Block Diagram – CD SERVO Section – ....................... 30
8-2. Block Diagram – TUNER/TAPE DECK Section – ...... 31
8-3. Block Diagram – AUDIO DSP Section – ...................... 32
8-4. Block Diagram – POWER AMP Section – ................... 33
8-5. Block Diagram
8-2. Block Diagram – TUNER/TAPE DECK Section – ...... 31
8-3. Block Diagram – AUDIO DSP Section – ...................... 32
8-4. Block Diagram – POWER AMP Section – ................... 33
8-5. Block Diagram
– DISPLAY/POWER SUPPLY Section – ...................... 34
8-6. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 35
8-7. Printed Wiring Board – BD Board – ............................. 36
8-8. Schematic Diagram – BD Board – ................................ 37
8-9. Printed Wiring Boards – CHANGER Section – ............ 38
8-10. Schematic Diagram – CHANGER Section – ................ 39
8-11. Printed Wiring Boards – CD DOOR Section – ............. 40
8-12. Schematic Diagram – CD DOOR Section – ................. 41
8-13. Printed Wiring Board – SW Board – ............................. 42
8-14. Schematic Diagram – SW Board – ................................ 43
8-15. Printed Wiring Boards – TC DOOR Section – ............. 44
8-16. Schematic Diagram – TC DOOR Section – .................. 45
8-8. Schematic Diagram – BD Board – ................................ 37
8-9. Printed Wiring Boards – CHANGER Section – ............ 38
8-10. Schematic Diagram – CHANGER Section – ................ 39
8-11. Printed Wiring Boards – CD DOOR Section – ............. 40
8-12. Schematic Diagram – CD DOOR Section – ................. 41
8-13. Printed Wiring Board – SW Board – ............................. 42
8-14. Schematic Diagram – SW Board – ................................ 43
8-15. Printed Wiring Boards – TC DOOR Section – ............. 44
8-16. Schematic Diagram – TC DOOR Section – .................. 45
8-17. Printed Wiring Board – MC Board – ............................. 46
8-18. Schematic Diagram – MC Board – ............................... 47
8-19. Printed Wiring Board
8-18. Schematic Diagram – MC Board – ............................... 47
8-19. Printed Wiring Board
– DSP Board (Component Side) – .................................. 48
8-20. Printed Wiring Board
– DSP Board (Conductor Side) – ................................... 49
8-21. Schematic Diagram – DSP Board (1/3) – ..................... 50
8-22. Schematic Diagram – DSP Board (2/3) – ..................... 51
8-23. Schematic Diagram – DSP Board (3/3) – ..................... 52
8-24. Printed Wiring Board
8-22. Schematic Diagram – DSP Board (2/3) – ..................... 51
8-23. Schematic Diagram – DSP Board (3/3) – ..................... 52
8-24. Printed Wiring Board
– FRONT REAR AMP Board – ...................................... 54
8-25. Schematic Diagram
– FRONT REAR AMP Board – ...................................... 55
8-26. Printed Wiring Board
– CENTER SW AMP Board – ........................................ 56
8-27. Schematic Diagram
– CENTER SW AMP Board – ........................................ 57
8-28. Printed Wiring Boards – SPEAKER Section – ............. 58
8-29. Schematic Diagram – REGULATOR Board – .............. 59
8-30. Schematic Diagram – SPEAKER Section (1/2) – ......... 60
8-31. Schematic Diagram – SPEAKER Section (2/2) – ......... 61
8-32. Printed Wiring Board – GC Board – ............................. 62
8-33. Schematic Diagram – GC Board – ................................ 63
8-34. Printed Wiring Boards – PANEL Section – .................. 64
8-35. Schematic Diagram – PANEL Section – ....................... 65
8-36. Printed Wiring Board – MIC Board – ........................... 66
8-37. Schematic Diagram – MIC Board – .............................. 67
8-38. Printed Wiring Board – SUB TRANS Board – ............. 68
8-39. Schematic Diagram – SUB TRANS Board – ................ 69
8-40. Printed Wiring Board – TRANS Board – ...................... 70
8-41. Schematic Diagram – TRANS Board – ......................... 71
8-42. IC Pin Function Description ........................................... 75
8-29. Schematic Diagram – REGULATOR Board – .............. 59
8-30. Schematic Diagram – SPEAKER Section (1/2) – ......... 60
8-31. Schematic Diagram – SPEAKER Section (2/2) – ......... 61
8-32. Printed Wiring Board – GC Board – ............................. 62
8-33. Schematic Diagram – GC Board – ................................ 63
8-34. Printed Wiring Boards – PANEL Section – .................. 64
8-35. Schematic Diagram – PANEL Section – ....................... 65
8-36. Printed Wiring Board – MIC Board – ........................... 66
8-37. Schematic Diagram – MIC Board – .............................. 67
8-38. Printed Wiring Board – SUB TRANS Board – ............. 68
8-39. Schematic Diagram – SUB TRANS Board – ................ 69
8-40. Printed Wiring Board – TRANS Board – ...................... 70
8-41. Schematic Diagram – TRANS Board – ......................... 71
8-42. IC Pin Function Description ........................................... 75
9.
EXPLODED VIEWS
9-1. Case Section .................................................................... 83
9-2. Front Panel Section-1 ...................................................... 84
9-3. Front Panel Section-2 ...................................................... 85
9-4. Front Panel Section-3 ...................................................... 86
9-5. Front Panel Section-4 ...................................................... 87
9-6. Chassis Section-1 ............................................................ 88
9-7. Chassis Section-2 ............................................................ 89
9-8. Chassis Section-3 ............................................................ 90
9-9. Chassis Section-4 ............................................................ 91
9-10. CD Mechanism Deck Section-1
9-2. Front Panel Section-1 ...................................................... 84
9-3. Front Panel Section-2 ...................................................... 85
9-4. Front Panel Section-3 ...................................................... 86
9-5. Front Panel Section-4 ...................................................... 87
9-6. Chassis Section-1 ............................................................ 88
9-7. Chassis Section-2 ............................................................ 89
9-8. Chassis Section-3 ............................................................ 90
9-9. Chassis Section-4 ............................................................ 91
9-10. CD Mechanism Deck Section-1
(CDM53M-30BD60) ...................................................... 92
9-11. CD Mechanism Deck Section-2
(CDM53M-30BD60) ...................................................... 93
9-12. CD Mechanism Deck Section-3
(CDM53M-30BD60) ...................................................... 94
9-13. CD Mechanism Deck Section-4
(CDM53M-30BD60) ...................................................... 95
9-14. Base Unit Section (BU-30BD60) ................................... 96
9-15. Tape Mechanism Deck Section
9-15. Tape Mechanism Deck Section
(TCM-230AWR41CS) .................................................... 97
10. ELECTRICAL PARTS LIST
............................... 98
4
HCD-FL3
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
• RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Releasing Procedure :
Press two buttons of
Press two buttons of
Z
(CD) and
[GROOVE]
simultaneously for
five seconds. The message “UNLOCKED” is displayed and the
tray is unlocked.
tray is unlocked.
Note:
When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the
turning power on/off with the
[I/ ]
button.
SERVICE POSITION
In checking the DSP/MC board, prepare jig (extension cable J-
2501-208-A: 1.25 mm Pitch, 21 cores, Length 370 mm).
2501-208-A: 1.25 mm Pitch, 21 cores, Length 370 mm).
SECTION 1
SERVICING NOTES
• MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
Singapore model
4-239-008-0
[]
120 V AC area in E model
4-239-008-2
[]
Mexican model
4-239-008-3
[]
Chilean and Peruvian models
4-239-008-4
[]
Argentina model
4-239-008-5
[]
Australian model
4-239-008-6
[]
PART No.
Connect jig (extension cable J-2501-208-A)
to the MC board (CN106) and BD board (CN101).
to the MC board (CN106) and BD board (CN101).
MC board (CN106)
MC board
DSP board
Any board to put
BD board (CN101)
1
Ver 1.2
