Sony DAV-TZ530 / HBD-TZ530 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HBD-TZ530
SPECIFICATIONS
DVD RECEIVER
9-893-135-01
2011C04-1
©
2011.03
South African Model
Mexican Model
Ver. 1.0 2011.03
• HBD-TZ530 is the amplifi er, DVD/CD and tuner
section in DAV-TZ530.
Model Name Using Similar Mechanism
HBD-TZ135
DVD Drive Mechanism Type
CDM85
Optical Pick-up Name
KHM-313
This system incorporates with Dolby* Digital and Dolby Pro Logic
adaptive matrix surround decoders.
* Manufactured under license from Dolby Laboratories.
adaptive matrix surround decoders.
* Manufactured under license from Dolby Laboratories.
Dolby, Pro Logic, and the double-D symbol are trademarks of
Dolby Laboratories.
Dolby Laboratories.
This system incorporates High-Defi nition Multimedia Interface
(HDMI™) technology.
HDMI, the HDMI logo and High-Defi nition Multimedia Interface are
trademarks or registered trademarks of HDMI Licensing LLC.
“BRAVIA” is a trademark of Sony Corporation.
MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
Windows Media is a registered trademark of Microsoft Corporation in
the United States and/or other countries.
(HDMI™) technology.
HDMI, the HDMI logo and High-Defi nition Multimedia Interface are
trademarks or registered trademarks of HDMI Licensing LLC.
“BRAVIA” is a trademark of Sony Corporation.
MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
Windows Media is a registered trademark of Microsoft Corporation in
the United States and/or other countries.
– Continued on next page –
Amplifi er Section
POWER OUTPUT (rated):
Front L + Front R
POWER OUTPUT (rated):
Front L + Front R
32 W + 32 W (at 3
ohms, 1 kHz, 1% THD)
POWER OUTPUT (reference):
Front L/Front R/
Surround
L/Surround
R: 43 watts (per channel
at 3 ohms, 1 kHz)
Center: 89 watts (per
channel at 6 ohms, 1 kHz)
Subwoofer: 89 watts (at
6 ohms, 100 Hz)
Inputs
TV/CABLE :
TV/CABLE :
Pin jack
CD/DVD System
Laser Diode Properties
Emission
Laser Diode Properties
Emission
Duration:
Continuous
Laser Output*: Less
than
1,000
μW
* This output is the value measurement at a dis-
tance of 200 mm from the objective lens sur-
face on the Optical Pick-up Block with 7 mm
aperture.
face on the Optical Pick-up Block with 7 mm
aperture.
USB Section
(USB) port:
Maximum current:
500 mA
Tuner Section
System PLL
System PLL
quartz-locked
digital
synthesizer
Tuning range
North American models:
North American models:
87.5 MHz - 108.0 MHz
(100 kHz step)
Other models:
87.5 MHz - 108.0 MHz
(50 kHz step)
Antenna (aerial) terminals
75 ohms, unbalanced
Intermediate frequency
10.7
10.7
MHz
HBD-TZ530
2
Video Section
Outputs
Outputs
VIDEO: Pin jack
HDMI OUT: HDMI
19-pin
General
Power requirements
North American models: 120 V AC, 60 Hz
Latin American and Mexican models:
Power requirements
North American models: 120 V AC, 60 Hz
Latin American and Mexican models:
110 V - 240 V AC,
50/60 Hz
Argentine models:
220 V - 240 V AC,
50/60 Hz
Other models:
220 V - 240 V AC,
50/60 Hz
Power consumption
On: 67 W
Standby: <1 W*
* Valid when the system is in the following status:
– [Control for HDMI] is set to [Off].
Dimensions (approx.)
– [Control for HDMI] is set to [Off].
Dimensions (approx.)
360 mm
× 56 mm × 342 mm (w/h/d)
Mass (approx.)
2.6 kg
Design and specifi cations are subject to
change without notice.
change without notice.
SPECIAL COMPONENT NOTICE
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
HBD-TZ530
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior of unit.
a CLASS 1 LASER product.
This marking is located on the
rear exterior of unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
• Abbreviation
MX
MX
: Mexican model
SAF : South African model
Model
Part No.
MX model
GSE200276-0006
SAF model
GSE200276-0014
MODEL IDENTIFICATION
– Back Cabinet –
– Back Cabinet –
Parts No.
HBD-TZ530
4
TABLE OF CONTENTS
1.
SERVICING NOTES
............................................. 5
2. DISASSEMBLY
2-1. Top Cover ....................................................................... 9
2-2. Door ................................................................................ 10
2-3. Front Cabinet Section ..................................................... 10
2-4. CONTROL Board, STANDBY Board ............................ 11
2-5. USB Board ...................................................................... 11
2-6. MAIN Board ................................................................... 12
2-7. POWER Board ................................................................ 12
2-8. DVD Mechanism Deck Section ...................................... 13
2-9. Optical Pick-up ............................................................... 13
2-2. Door ................................................................................ 10
2-3. Front Cabinet Section ..................................................... 10
2-4. CONTROL Board, STANDBY Board ............................ 11
2-5. USB Board ...................................................................... 11
2-6. MAIN Board ................................................................... 12
2-7. POWER Board ................................................................ 12
2-8. DVD Mechanism Deck Section ...................................... 13
2-9. Optical Pick-up ............................................................... 13
3. DIAGRAMS
3-1. Block Diagram ................................................................ 15
3-2. Printed Wiring Board –Main Section (1/2)– ................... 16
3-3. Printed Wiring Board –Main Section (2/2)– ................... 17
3-2. Printed Wiring Board –Main Section (1/2)– ................... 16
3-3. Printed Wiring Board –Main Section (2/2)– ................... 17
3-4. Schematic Diagram –Main Section (1/2)– ...................... 18
3-5. Schematic Diagram –Main Section (2/2)– ...................... 19
3-6. Printed Wiring Boards –Display Section– ...................... 20
3-7. Schematic Diagram –Display Section– .......................... 21
3-8. Printed Wiring Board –Power Section– .......................... 22
3-9. Schematic Diagram –Power Section– ............................. 23
3-5. Schematic Diagram –Main Section (2/2)– ...................... 19
3-6. Printed Wiring Boards –Display Section– ...................... 20
3-7. Schematic Diagram –Display Section– .......................... 21
3-8. Printed Wiring Board –Power Section– .......................... 22
3-9. Schematic Diagram –Power Section– ............................. 23
4.
EXPLODED VIEWS
4-1. Overall Section ............................................................... 24
4-2. Front Cabinet Section ..................................................... 25
4-3. Chassis Section ............................................................... 26
4-4. DVD Mechanism Deck Section ...................................... 27
4-2. Front Cabinet Section ..................................................... 25
4-3. Chassis Section ............................................................... 26
4-4. DVD Mechanism Deck Section ...................................... 27