Sony DAV-SR1W / TA-SR1WR Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
Taiwan Model
SURROUND AMPLIFIER
9-879-327-01
2004K16-1
© 2004.11
© 2004.11
Ver. 1.0 2004.11
SPECIFICATIONS
TA-SR1WR
Power requirements
120 V AC, 50/60 Hz
Power consumption
36 W
Dimensions (approx.)
386
× 108 × 85 mm (w/h/d)
incl. projecting parts
Mass (approx.)
3.3 kg
• TA-SR1WR is surround amplifier section in
DAV-SR1W.
DAV-SR1W.
2
TA-SR1WR
TABLE OF CONTENTS
1.
GENERAL
...................................................................
3
2.
DISASSEMBLY
2-1.
Disassembly Flow ...........................................................
4
2-2.
Front Cover Assy .............................................................
4
2-3.
Cabinet (Front) Assy, DIAT BUILT PD Board ...............
5
2-4.
SPK (L), (R) Board, JACK Board ...................................
5
2-5.
Shield Case ......................................................................
6
2-6.
DIAT POWER Board ......................................................
6
2-7.
DIAT AMP Board ............................................................
7
3.
DIAGRAMS
3-1.
Block Diagram ................................................................ 10
3-2.
Printed Wiring Board – DIAT AMP Board (Side A) – .... 11
3-3.
Printed Wiring Board – DIAT AMP Board (Side B) – .... 12
3-4.
Schematic Diagram – DIAT AMP Board (1/3) – ............ 13
3-5.
Schematic Diagram – DIAT AMP Board (2/3) – ............ 14
3-6.
Schematic Diagram – DIAT AMP Board (3/3) – ............ 15
3-7.
Printed Wiring Board – DIAT POWER Board – ............. 16
3-8.
Schematic Diagram – DIAT POWER Board – ................ 17
3-9.
Printed Wiring Board – DIAT BUILT PD Section – ....... 18
3-10. Schematic Diagram – DIAT BUILT PD Section – .......... 19
4.
EXPLODED VIEWS
4-1.
Front Cabinet Section ...................................................... 24
4-2.
Rear Cabinet Section ....................................................... 25
5.
ELECTRICAL PARTS LIST
.................................. 26
Microsoft, Windows and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United States
and/or other countries.
US and foreign patents licensed from Dolby Laboratories.
All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.
registered trademarks of Microsoft Corporation in the United States
and/or other countries.
US and foreign patents licensed from Dolby Laboratories.
All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
3
TA-SR1WR
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
Surround Amplifier
A
POWER switch (29)
B
POWER/ON LINE indicator (29)
C
IR receiver (29)
D
SPEAKER SURROUND L jack (14, 18)
E
DIR-R2 jack (30)
F
SPEAKER SURROUND R jack (14, 18)
POWER/ON LINE
SURROUND L
SPEAKER
DIR-R2
SURROUND R
SPEAKER
Front panel
Rear panel
4
TA-SR1WR
SECTION 2
DISASSEMBLY
Note:
Follow the disassembly procedure in the numerical order given.
Note:
Disassemble the unit in the order as shown below.
2-2. FRONT COVER ASSY
2-1. DISASSEMBLY FLOW
2-7.
DIAT AMP BOARD
(Page 7)
SET
2-2. FRONT COVER ASSY
(Page 4)
2-3.
CABINET (FRONT) ASSY,
DIAT BUILT PD BOARD
(Page 5)
2-4.
SPK (L), (R) BOARD,
JACK BOARD
(Page 5)
2-5.
SHIELD CASE
(Page 6)
2-6.
DIAT POWER BOARD
(Page 6)
4
front cover assy
3
connector (2p)
1
two screws
(+K 3
×
8)
2
two screws
(+K 3
×
8)
