Sony DAV-SR1 / DAV-SR2 / DAV-SR3 / HCD-SR1 / HCD-SR2 / HCD-SR3 Service Manual ▷ View online
9
9
HCD-SR1/SR2/SR3
HCD-SR1/SR2/SR3
For Schematic Diagrams.
Note:
• All capacitors are in
Note:
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
• f
: internal component.
• C : panel designation.
• A : B+ Line.
• B : B– Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground un-
der no-signal (detuned) conditions.
• Voltages and waveforms are dc with respect to ground in
service mode.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
no mark : DVD STOP
tolerances.
no mark : DVD STOP
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
J
: CD PLAY
c
: DVD PLAY
d
: TUNER
L
: VIDEO
i
: OPTICAL DIGITAL IN
h
: VIDEO IN
a
: CHROMA
E
: Y
r
: COMPONENT VIDEO
e
: AUX IN
I
: SACD PLAY
q
: R, G, B
• Abbreviation
AUS
: Australian model
HK
: Hong Kong model
KR
: Korean model
MX
: Mexican model
RU
: Russian model
SP
: Singapore model
For Printed Wiring Boards.
Note:
• X : parts extracted from the component side.
• a
Note:
• X : parts extracted from the component side.
• a
: Through hole.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side A)
Pattern face side: Parts on the pattern face side seen from
(Side A)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side B)
the parts face are indicated.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
Replace only with part number specified.
C E
B
These are omitted
Q
C
E
B
These are omitted
MEMO
10
10
HCD-SR1/SR2/SR3
HCD-SR1/SR2/SR3
3-1. PRINTED WIRING BOARD — RF BOARD —
•
See page 8 for Circuit Boards Location.
:Uses unleaded solder.
C023
C028
C040
C037
R004
R005
C038
C022
C020
R016
R003
R018
R014
R012
C027
C041
C010
Q002
Q001
R007
C039
R001
C021
C013
R009
R008
R008
C008
C017
C015
C011
C009
R021
CN003
CN001
CN002
C049
IC003
R033
R034
R047
R046
C050
C052
R091
R024
R025
R023
C029
C026
R026
C024
R027
R017
R015
C042
R013
R019
L002
L001
C003
D002
D001
R022
R020
C031
R011
C006
C005
C034
R006
R028
R029
C036
C032
C035
C033
C004
C012
C025
R010
C002
C030
C018
C016
C014
C019
R035
C001
R041
R031
C051
IC001
1
3
5
4
(SIDE A)
RF BOARD
1-684-822-
12
(12)
1-684-822-
12
(12)
(SIDE B)
RF BOARD
B
E
C
B
E
C
A
DMB08 BOARD
CN401
(Page 13)
OPTICAL
TRAVERSE
UNIT
(DBU-1)
1
2
3
4
5
6
7
8
9
10
11
12
13
A
B
C
D
E
F
1
16
48
33
17
32
64
49
• Semiconductor
Location
Ref. No.
Location
D001
C-10
D002
B-10
IC001
D-11
IC003
D-3
Q001
B-3
Q002
B-3
Ver. 1.4
11
11
HCD-SR1/SR2/SR3
HCD-SR1/SR2/SR3
3-2. SCHEMATIC DIAGRAM — RF BOARD —
JL005
C011
C039
C038
C040
JL007
C003
R010
R008
R007
IOP1
C004
R006
C001
C010
R004
R003
IOP2
C002
R022
R025
R023
C016
C015
C014
R014
R013
R012
R011
R018
R017
R016
R015
C042
C020
C021
C022
C023
R024
R026
C027
C028
C029
C018
C024
C033
C012
C005
R029
R028
R027
JL002
JL001
C032
C034
C049
C009
C035
CN003
CN001
CN002
C025
C006
C013
R005
R009
R035
R019
R020
C041
R001
Q001
Q002
C008
R041
JL004
C030
C019
C017
IC001
JL003
JL006
R031
C037
R021
C052
C051
C050
R034
C036
R033
R047
R046
IC003
R091
C031
C026
D001
D002
1000p
0.033
0.033
0.1
100
6.3V
470
33
33
10
16V
470
100
6.3V
1000p
L001
47
µ
H
L002
47
µ
H
33
33
10
16V
220
100
820
2200p
2200p
2200p
0
0
0
0
0
0
0
0
180p
22p
22p
22p
22p
0
12k
0.1
0.1
0.01
5600p
0.01
0.1
0.1
22
10V
0
0
0
0.047
0.1
0.1
0.1
0.1
9P
24P
29P
0.1
22
10V
0.1
47k
47k
0
0
0
0.1
100
2SB1132-T100-QR
2SB1132-T100-QR
0.1
1k
0.01
5600p
2200p
SP3723CAF0PM
100
680p
0
0.1
0.47
3300p
470
0.47
100k
33k
10k
TL343IDBVR
560k
1000p
0.1
1SS355TE
1SS355TE
MIRR
CD_LD
DVD_LD
SDEN
DATA_RF
CLK_RF
SDEN
DATA_RF
CLK_RF
LDON
A
B
E
F
TE
FE
TE
FE
PD
RFMON
RFMON
F
D
C
RFP
E
CD_LD
DVD_LD
PD
FD-
FD+
TD-
TD+
FD+
FD-
TD+
TD-
SLB-
SLB+
SLA-
SLA+
PI/CE
PI/CE
L
D
O
N
M
IR
R
SLA+
SLB+
SLB-
SLA-
RFP
D
C
A
B
B
A
F
RF
GND
VC
VCC
C
D
E
PD
VR
SW
LD GND
DVD LD
CD LD
N.C
FCS+
FCS-
TRK+
TRK-
AGND
RFAC
AGND
AVC
AVC
MIRR
TE
FE
A5V
A5V
SDEN
DATA_RF
CLK_RF
LDON
A3V
RFMON
INLIM
LDSEL
VCC
SPDL+
SPDL-
SLEDA+
SLEDA-
SLEDB+
SLEDB-
TD+
TD-
FD+
FD-
SLEDA+
SLEDB+
SLEDA-
SLEDB-
LED
GND
INLIM
SPDL-
SPDL+
INLIM
INLIM_3V
{LIMIT-SW(A)}
{LIMIT-SW(B)}
{LIMIT-SW(B)}
PI
FOCUS/TRACKING ERROR AMP
AUTOMATIC POWER
CONTROL
(FOR DVD)
AUTOMATIC POWER
CONTROL
(FOR CD)
VCC
VEE
COMPARATOR
CD/DVD RF AMP,
1
4
3
2
(Page 15)
OPTICAL
PICK-UP
BLOCK
(DBU-1)
DMB08 BOARD
(1/10)
CN401
Ver. 1.4
12
12
HCD-SR1/SR2/SR3
HCD-SR1/SR2/SR3
3-3. PRINTED WIRING BOARD — DRIVER BOARD —
•
See page 8 for Circuit Boards Location.
:Uses unleaded solder.
3-4. SCHEMATIC DIAGRAM — DRIVER BOARD —
IC701
G
DMB08 BOARD
CN007
(Page 13)
M701
(LOADING)
(TRIGGER) (DISC IN/OUT)
(CHUKING)
1
9
M
1
2
A
B
C
3
4
No mark : DVD STOP
+7V
G
DMB08 BOARD (10/10)
CN007
(Page 24)
IC B/D
IC701
CN701
R702
R701
C711
C705
D701
S703
S701
S702
M701
BA6956AN
7P
CT-L
100
680
10
50V
0.01
MTZJ-T-77-4.7C
(TRIGGER)
(DISC IN/OUT)
(CHUKING)
(LOADING)
Ver 1.2
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