DOWNLOAD Sony DAV-JZ8888K / HCD-JZ8888K Service Manual ↓ Size: 4.8 MB | Pages: 96 in PDF or view online for FREE

2009F04-1

© 

2009.06

•  HCD-JZ8888K is the amplifi er, DVD/CD 

and tuner section in DAV-JZ8888K.

Stereo mode (rated) 

108 W + 108 W (at 3 ohms,

 

1 kHz, 1% THD)

Surround mode (reference) RMS output power
 FL/FR/C/SL/SR*: 

144

 

watts (per channel at 3

 

ohms, 1 kHz, 10% THD)

 Subwoofer 

L/Subwoofer

 

R*: 140 watts (at 3 ohms, 

 

80 Hz, 10% THD)

Inputs (Analog)
TV (AUDIO IN) 

Sensitivity: 450/250 mV

SAT/CABLE (AUDIO IN) Sensitivity: 450/250 mV
AUDIO IN/MIC 

Sensitivity: AUDIO IN

 

250/125 mV/MIC 1 mV

Inputs (Digital)
TV (COAXIAL IN/OPTICAL IN)
 

Impedance: 75 ohms/-

 

Input Stream: Dolby

 

Digital 5.1ch/DTS 5.1ch/

 

Linear PCM 2ch

 

(Sampling Frequency: less

 

than 48 kHz)

Outputs (Analog)
Phones 

Accepts low- and high-

 impedance 

headphones.

Laser Diode Properties 

Emission Duration:

 Continuous
 

Laser Output: Less than

 44.6

μW

* This output is the value measurement at a distance
  of 200mm from the objective lens surface on the
  Optical Pick-up Block with 7mm aperture.

Signal format system
Mexican and Latin American models:
 NTSC
Other models: 

NTSC/PAL

 (USB) port:

Maximum current: 

500 mA

System 

PLL quartz-locked digital

 synthesizer
FM Tuner section
Tuning range
North American models:  87.5 MHz - 108.0 MHz
 

(100 kHz step)

Other models: 

87.5 MHz - 108.0 MHz 

 

(50 kHz step)

Antenna (aerial) 

FM wire antenna (aerial)

Antenna (aerial) terminals  75 ohms, unbalanced
Intermediate frequency 

10.7 MHz

Outputs 

VIDEO: 1 Vp-p 75 ohms

 COMPONENT:
 

Y: 1 Vp-p 75 ohms

 

P

B

/C

B

, P

R

/C

R

: 0.7 Vp-p

 75 

ohms

 

HDMI OUT: Type A (19 pin)

Power requirements
Mexican models: 

120 V AC, 60 Hz

Latin American models: 

110 V - 240 V AC,

 50/60 

Hz

Other models: 

220 V - 240 V AC,

 50/60 

Hz

Power consumption 

On: 185 W

 

Standby: 0.3 W (at the

 

Power Saving mode)

Output voltage (DIGITAL MEDIA PORT)
 DC 

5 

V

Output current (DIGITAL MEDIA PORT)
 700 

mA

Dimensions (approx.) 

430 mm 

× 66 mm × 390 mm 

 

(w/h/d) incl. projecting parts

Mass (approx.) 

4.3 kg

This system incorporates with Dolby* Digital and Dolby Pro 
Logic (II) adaptive matrix surround decoder and the DTS** Digital 
Surround System.
*  Manufactured under license from Dolby Laboratories.
 

Dolby, Pro Logic, and the double-D symbol are trademarks of 
Dolby Laboratories.

**  Manufactured under license under U.S. Patent #’s:
 

5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,487,535 & other 
U.S. and worldwide patents issued & pending. DTS and DTS 
Digital Surround are registered trademarks and the DTS logos 
and Symbol are trademarks of DTS, Inc. © 1996-2008 DTS, Inc. 
All Rights Reserved.

– Continued on next page –

Model Name Using Similar Mechanism

HCD-DZ290K/DZ295K/DZ390K/
 DZ590K/DZ690K/DZ790K

Mechanism Type

CDM85-DVBU102

Optical Pick-up Name

KHM-313CAA

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

Laser component in this product is capable of emitting radiation 
exceeding the limit for Class 1.

This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear or bottom exterior.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

SPECIAL  COMPONENT  NOTICE
The components identifi ed by mark 

9 contain confi dential infor-

mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.

• Abbreviation
  E32 

: 110 – 240V AC area in E model

  MX 

: Mexican model

  SP 

: Singapore model

E32 model

4-122-169-0[]

MX model

4-122-169-1[]

SP model

4-122-169-3[]

File Extension: 

mp3

Bitrate: 

32 kbps - 320 kbps

Sampling frequencies: 

32/44.1/48 kHz

File Extension: 

wma

Bitrate: 

48 kbps - 192 kbps

Sampling frequencies: 

44.1 kHz

File Extension: 

m4a

Bitrate: 

48 kbps - 320 kbps

Sampling frequencies: 

44.1 kHz

File Extension: 

avi/divx

Video codec: 

DivX video

Bitrate: 

8 Mbps (MAX)

Frame rate: 

30 fps

Resolution: 720 

× 576

Audio codec: 

MP3

File format: 

MP4 File Format

File Extension: 

mp4/m4v

Video codec: 

MPEG4 Simple Profi le

 

(AVC is not compatible.)

Bitrate: 4 

Mbps

Frame rate: 

30 fps

Resolution: 720 

× 576

Audio codec: 

AAC-LC (HE-AAC is not

 compatible.)
DRM: Not 

compatible

Design and specifi cations are subject to change
without notice.

  .............................................   4

2-1.   Case  ................................................................................   7
2-2.  Front Panel Section .........................................................   7
2-3.   Back Panel Section .........................................................   8
2-4.   DVD Mechanism Deck ...................................................   8
2-5.  POWER Board, USB Board ...........................................   9
2-6.  MAIN Board, SP Board, DSP Board ..............................   9
2-7. IO-COMPONENT 

Board 

...............................................  10

2-8. Tray 

.................................................................................  10

2-9. Belt 

..................................................................................  11

2-10. MS-203 Board .................................................................   11
2-11. Base Unit .........................................................................  12
2-12. Optical Pick-up ...............................................................   12

  ............................................................   13

  ........................   19

5-1.  Block Diagram –RF Section– .........................................   21
5-2.  Block Diagram –VIDEO Section– .................................   22
5-3.  Block Diagram –AUDIO Section– .................................   23
5-4.  Block Diagram –DSP Section– .......................................   24
5-5.  Block Diagram –AMP Section– .....................................   25
5-6.  Block Diagram –POWER Section– ................................   26
5-7.  Printed Wiring Board –MAIN Section (1/2)– .................   28
5-8.  Printed Wiring Boards –MAIN Section (2/2)– ...............   29
5-9.  Schematic Diagram –MAIN Section (1/10)– .................   30
5-10.  Schematic Diagram –MAIN Section (2/10)– .................   31

5-11.  Schematic Diagram –MAIN Section (3/10)– .................   32
5-12.  Schematic Diagram –MAIN Section (4/10)– .................   33
5-13.  Schematic Diagram –MAIN Section (5/10)– .................   34
5-14.  Schematic Diagram –MAIN Section (6/10)– .................   35
5-15.  Schematic Diagram –MAIN Section (7/10)– .................   36
5-16.  Schematic Diagram –MAIN Section (8/10)– .................   37
5-17.  Schematic Diagram –MAIN Section (9/10)– .................   38
5-18.  Schematic Diagram –MAIN Section (10/10)– ...............   39
5-19.  Printed Wiring Board –IO-COMPONENT Section– ......   40
5-20.  Schematic Diagram –IO-COMPONENT Section– ........   41
5-21.  Printed Wiring Board –DSP Section (1/2)– ....................   42
5-22.  Printed Wiring Board –DSP Section (2/2)– ....................   43
5-23.  Schematic Diagram –DSP Section– ................................   44
5-24.  Printed Wiring Board –SCORE Section– .......................   45
5-25.  Schematic Diagram –SCORE Section– ..........................   46
5-26. Printed Wiring Boards –FL-JACK, KEY-SW Section– ..   47
5-27.  Schematic Diagram –FL-JACK Section– .......................   48
5-28.  Printed Wiring Boards –LED Section– ...........................   49
5-29.  Schematic Diagram –LED Section– ...............................   50
5-30.  Printed Wiring Boards –SP, USB Section– .....................   51
5-31.  Schematic Diagram –SP, USB Section– .........................   52
5-32.  Printed Wiring Board –POWER Section– ......................   53
5-33.  Schematic Diagram –POWER Section– .........................   54

6-1. Overall 

Section 

...............................................................  73

6-2.  Front Panel Section .........................................................   74
6-3. Chassis 

Section 

...............................................................  75

6-4.  DVD Mechanism Deck Section (CDM85-DVBU102) ..   76

  ..............................   77

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

How to open the disc table when power switch turns off 
Insert a tapering driver into the aperture of the unit bottom, and 
slide it in the direction of the arrow.

When installing a new OP unit, be sure to connect the fl exible 
printed circuit board fi rst of all before removing the static electricity 
prevention solder bridge by unsoldering. 
Remove the static electricity prevention solder bridge by 
unsoldering after the fl exible printed circuit board has already been 
connected. 
(Do not remove nor unsolder the solder bridge as long as the OP 
unit is kept standalone.)

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

On cleaning discs, disc/lens cleaners
•   Do not use cleaning discs or disc/lens cleaners (including wet 

or spray types). These may cause the apparatus to malfunction.

IMPORTANT  NOTICE
Caution: This system is capable of holding a still video image or 
on-screen display image on your television screen indefi nitely. 
If you leave the still video image or on-screen display image 
displayed on your TV for an extended period of time you risk 
permanent damage to your television screen.
Projection televisions are especially susceptible to this.

Attention when transported
Use this mode when returning the set to the customer after repair.
Procedure:
1.   Press the [

?/1

] button to turn the set on.

2.   Press the [FUNCTION] button to set the function “DVD”.
3.   Remove all discs, and then press two buttons [

N

] and [

?/1

] 

simultaneously.

4.  After a message “MECHA LOCK” is displayed on the 

fl uorescent indicator tube, pull out the AC plug.

5.  To exit from this mode, press the [

?/1

] button to turn the set 

on.

DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Setting Procedure :
1.  Press the [

?/1

] button to turn the set on.

2.  Press the [FUNCTION] button to set DVD function.
3.  Insert a disc.
4.  Press the [

x

] button and the [

Z

] button simultaneously for fi ve 

seconds.

5.  The message “LOCKED” is displayed and the tray is locked.
Releasing Procedure :
1.  Press the [

x

] button and the [Z] button simultaneously for fi ve 

seconds again.

2.  The message “UNLOCKED” is displayed and the tray is 

unlocked.

Note: When “LOCKED” is displayed, the tray lock is not released by 

turning power on/off with the [?/1] button.

LASER DIODE  AND  FOCUS  SEARCH
1.  Open the case and turn POWER on with no disc inserted.
2. Confi rm that the following operation is performed while 

observing the objecting lens from the clearance of DVD 
mechanism deck.
1)  Confi rm that laser beam is spread.
2)  Up and down motion of the objective lens. (2 times)