DOWNLOAD Sony DAV-EA20 / HCD-EA20 Service Manual ↓ Size: 9.72 MB | Pages: 101 in PDF or view online for FREE

Model
DAV-EA20 HCD-EA20
Pages
101
Size
9.72 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
dav-ea20-hcd-ea20.pdf
Date

Sony DAV-EA20 / HCD-EA20 Service Manual ▷ View online

HCD-EA20
AEP Model
UK Model
SERVICE MANUAL
CD/DVD RECEIVER
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
9-961-254-03
2004J16-1
© 2004.10
HCD-EA20 is the amplifier, DVD/CD
and tuner section in DAV-EA20.
Ver 1.2  2004.10
SPECIFICATIONS
Amplifier section
Stereo mode (rated)
25 W + 25 W (6 ohms at 1 
kHz, THD 10 %)
Surround mode (reference) Front: 25 W + 25 W
Center*: 25 W
Surround*: 25 W + 25 W 
(6 ohms at 1 kHz, THD 
10 %) 
Subwoofer*: 50 W 
(8 ohms at 100 Hz, THD 
10 %)
* Depending on the sound field settings and the source, 
there may be no sound output.
Inputs
VIDEO:
Sensitivity: 150 mV
Impedance: 50 kilohms
SAT:
Sensitivity: 300 mV
Impedance: 50 kilohms
AUDIO IN:
sensitivity: 150 mV
Impedance: 50 kilohms
Outputs
VIDEO (AUDIO OUT):
Voltage: 1 V
Impedance: 1 kilohm
Phones
Accepts low-and high-
impedance headphones.
DVD system
Laser Semiconductor 
laser
(DVD: 
λ = 650 nm)
(CD: 
λ = 780 nm)
Emission duration: 
continuous
Signal format system
NTSC or NTSC/PAL
Frequency response (at 2CH STEREO mode)
DVD (PCM): 2 Hz to 22 
kHz (
±1.0 dB)
CD: 2 Hz to 20 kHz (
±1.0 
dB)
Harmonic distortion
Less than 0.03 %
Tuner section
System
PLL quartz-locked digital 
synthesizer system
FM tuner section
Tuning range
87.5 – 108.0 MHz (50 kHz 
step)
Aerial
FM wire aerial
Aerial terminals
75 ohms, unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
531 – 1,602 kHz (with the 
interval set at 9 kHz)
Aerial
AM loop aerial
Intermediate frequency
450 kHz
Video section
Inputs
Video: 1 Vp-p 75 ohms
Outputs
Video: 1 Vp-p 75 ohms
General
Power requirements
230 V AC, 50/60 Hz
Power consumption
130 W (230 V AC)
0.3 W (230 V AC) (at the 
Power Saving Mode) 
Dimensions (approx.)
355 
× 80 × 395 mm (w/h/d) 
incl. projecting parts
Mass (approx.)
6.4 kg
Operating temperature
5
°C to 35°C
Operating humidity
5 % to 90 %
Design and specifications are subject to change 
without notice.
Model Name Using Similar Mechanism
HCD-SA30
Mechanism Type
CDM77A-DVBU20
Optical Pick-up Name
DBU-1
2
HCD-EA20
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
 damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
 circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
 or unsoldering.
NOTES ON DMB03 BOARD EXCHANGE
If a DMB03 board is exchanged, “DRIVE AUTO ADJUSTMENT”
may be unable to be performed. In this case, initialize a memory in
the following procedure.
1. Starting Test  Mode (see page 19).
2. Press the 2  button of remote commander to set the Drive
Manual Operation (see page 22).
3. Press the 6 button of remote commander to set the Memory
Check (see page 24).
4. Press the [CLEAR] button of remote commander to initialize
a memory.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 
0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Ver 1.2
3
HCD-EA20
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 4
2. GENERAL
·········································································· 7
3. DISASSEMBLY
································································ 9
3-1. CASE ··········································································· 10
3-2. FRONT PANEL SECTION ········································· 11
3-3. PANEL BOARD, STANDBY BOARD ······················· 11
3-4. UCOM BOARD ··························································· 12
3-5. DMB03 BOARD ·························································· 12
3-6. I/O BOARD ································································· 13
3-7. AMP BOARD, SUB TRANSFORMER BOARD ······· 14
3-8. DVD MECHANISM (CDM77A-DVBU20) ··············· 15
3-9. TRAY (AU) ·································································· 15
3-10. MS-128 BOARD ························································ 16
3-11. BASE UNIT ······························································· 16
3-12. OPTICAL PICK-UP (TDP022W) ····························· 17
4. TEST MODE
···································································· 18
5. ELECTRICAL ADJUSTMENT
·································· 26
6. DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION ······························· 27
6-2. BLOCK DIAGRAMS – RF/SERVO SECTION – ······ 29
– VIDEO SECTION – ················································· 30
– AUDIO SECTION – ················································· 31
– AMP SECTION – ····················································· 32
– POWER SUPPLY SECTION – ································ 33
6-3. PRINTED WIRING BOARD – RF SECTION – ········ 34
6-4. SCHEMATIC DIAGRAM – RF SECTION – ············· 35
6-5. PRINTED WIRING BOARD
– LOADING SECTION – ··········································· 36
6-6. SCHEMATIC DIAGRAM
– LOADING SECTION – ··········································· 36
6-7. PRINTED WIRING BOARD
– DMB SECTION (SIDE A) – ···································· 37
6-8. PRINTED WIRING BOARD
– DMB SECTION (SIDE B) – ···································· 38
6-9. SCHEMATIC DIAGRAM
 – DMB SECTION (1/8) – ·········································· 39
6-10. SCHEMATIC DIAGRAM
– DMB SECTION (2/8) – ··········································· 40
6-11. SCHEMATIC DIAGRAM
– DMB SECTION (3/8) – ··········································· 41
6-12. SCHEMATIC DIAGRAM
– DMB SECTION (4/8) – ··········································· 42
6-13. SCHEMATIC DIAGRAM
– DMB SECTION (5/8) – ··········································· 43
6-14. SCHEMATIC DIAGRAM
– DMB SECTION (6/8) – ··········································· 44
6-15. SCHEMATIC DIAGRAM
– DMB SECTION (7/8) – ··········································· 45
6-16. SCHEMATIC DIAGRAM
– DMB SECTION (8/8) – ··········································· 46
6-17. PRINTED WIRING BOARD
– UCOM SECTION – ················································· 47
6-18. SCHEMATIC DIAGRAM
– UCOM SECTION – ················································· 48
6-19. PRINTED WIRING BOARD
– I/O SECTION – ························································ 49
6-20. SCHEMATIC DIAGRAM
– I/O SECTION (1/2) – ··············································· 50
6-21. SCHEMATIC DIAGRAM
– I/O SECTION (2/2) – ··············································· 51
6-22. PRINTED WIRING BOARD
– AMP/SUB TRANSFORMER SECTION – ············· 52
6-23. SCHEMATIC DIAGRAM
– AMP/SUB TRANSFORMER SECTION (1/2) – ···· 53
6-24. SCHEMATIC DIAGRAM
– AMP/SUB TRANSFORMER SECTION (2/2) – ···· 54
6-25. PRINTED WIRING BOARD
– PANEL SECTION – ················································· 55
6-26. SCHEMATIC DIAGRAM
– PANEL SECTION – ················································· 56
6-27. IC BLOCK DIAGRAMS ············································ 59
6-28. IC PIN FUNCTION DESCRIPTION ························· 68
7. EXPLODED VIEWS
7-1. CASE SECTION ························································· 80
7-2. FRONT PANEL SECTION ········································· 81
7-3. CHASSIS SECTION ··················································· 82
7-4. DVD MECHANISM SECTION
(CDM77A-DVBU20) ·················································· 83
8. ELECTRICAL PARTS LIST
······································· 84
4
HCD-EA20
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
JIG ON REPAIRING
When repairing this set, etc., connect the extension cable as the
figure shown below.
 Service position of mechanism block
MODEL IDENTIFICATION
— BACK PANEL —
Part No.
Model
AEP, UK models
Russian model
PARTS No.
4-249-697-0
s
4-249-697-1
s
SECTION 1
SERVICING NOTE
MS-128 board
 J-2501-212-A (1mm/5P/L300)
DVD mechanism section
(CDM77A-DVBU20)
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Sony DAV-EA20 / HCD-EA20 Service Manual ▷ Download

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  • Here you can View online or download the Service Manual for the Sony DAV-EA20 / HCD-EA20 in PDF for free, which will help you to disassemble, recover, fix and repair Sony DAV-EA20 / HCD-EA20 Audio. Information contained in Sony DAV-EA20 / HCD-EA20 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.