Sony DAV-DZ910W / HBD-DZ910W Service Manual ▷ View online
HBD-DZ910W
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HBD-DZ910W
4
• Abbreviation
CH
CH
: Chinese model
E3
: 240V AC area in E model
E15
: Iranian model
EA
: Saudi Arabia model
SP
: Singapore model
TH :
Thai
model
Model
Part No.
E3 model
4-159-515-0[]
E15, EA models
4-159-515-1[]
SP model
4-159-515-2[]
CH model
4-159-515-3[]
TH model
4-159-515-4[]
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
(When letters/numbers appear in the
display)
display)
When the self-diagnosis function is activated to
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the TV screen or front panel display. In this case,
check the following table.
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the TV screen or front panel display. In this case,
check the following table.
When the version number
appears on the TV screen
When you turn on the system, the version
number [VER.X.XX] (X is a number) may
appear on the TV screen. Although this is not a
malfunction and for Sony service use only,
normal system operation will not be possible.
Turn off the system, and then turn on the system
again to operate.
number [VER.X.XX] (X is a number) may
appear on the TV screen. Although this is not a
malfunction and for Sony service use only,
normal system operation will not be possible.
Turn off the system, and then turn on the system
again to operate.
Self-diagnosis Function
First 3
characters of
the service
number
characters of
the service
number
Cause and/or corrective action
C 13
The disc is dirty.
,Clean the disc with a soft cloth
,Clean the disc with a soft cloth
E XX
(XX is a
number)
number)
To prevent a malfunction, the
system has performed the self-
diagnosis function.
,Contact your nearest Sony
system has performed the self-
diagnosis function.
,Contact your nearest Sony
dealer or local authorized Sony
service facility and give the 5-
character service number.
service facility and give the 5-
character service number.
Example: E 61 10
C:13:50
VER.X.XX
Parts No.
HBD-DZ910W
5
TABLE OF CONTENTS
1.
SERVICING NOTES
............................................. 6
2. DISASSEMBLY
2-1. Case ................................................................................ 9
2-2. Loading
2-2. Loading
Panel
................................................................. 10
2-3. Front Panel Section ......................................................... 10
2-4. FL Board, ENCODER Board, JACK Board,
2-4. FL Board, ENCODER Board, JACK Board,
USB Board, LED Board ................................................. 11
2-5. KEY-SW Board, P-SW Board ........................................ 12
2-6. Back Panel Section ......................................................... 13
2-7. MAIN
2-6. Back Panel Section ......................................................... 13
2-7. MAIN
Board
................................................................... 14
2-8. IO
Board
......................................................................... 15
2-9. POWER
Board
................................................................ 15
2-10. DVD Mechanism Deck Section ...................................... 16
2-11. Tray ................................................................................. 16
2-12. Belt .................................................................................. 17
2-13. MS-203 Board ................................................................. 17
2-14. Base Unit ......................................................................... 18
2-15. Optical Pick-up ............................................................... 18
2-11. Tray ................................................................................. 16
2-12. Belt .................................................................................. 17
2-13. MS-203 Board ................................................................. 17
2-14. Base Unit ......................................................................... 18
2-15. Optical Pick-up ............................................................... 18
3.
TEST MODE
............................................................ 19
4. ELECTRICAL
ADJUSTMENTS
........................ 23
5. DIAGRAMS
5-1. Block Diagram –RF Section– ......................................... 27
5-2. Block Diagram –VIDEO Section– ................................. 28
5-3. Block Diagram –AUDIO Section– ................................. 29
5-4. Block Diagram –AMP Section– ..................................... 30
5-5. Block Diagram –DIR/S-AIR Section– ........................... 31
5-6. Block Diagram –POWER Section– ................................ 32
5-7. Printed Wiring Board –MAIN Section (1/2)– ................. 33
5-8. Printed Wiring Board –MAIN Section (2/2)– ................. 34
5-9. Schematic Diagram –MAIN Section (1/8)– ................... 35
5-2. Block Diagram –VIDEO Section– ................................. 28
5-3. Block Diagram –AUDIO Section– ................................. 29
5-4. Block Diagram –AMP Section– ..................................... 30
5-5. Block Diagram –DIR/S-AIR Section– ........................... 31
5-6. Block Diagram –POWER Section– ................................ 32
5-7. Printed Wiring Board –MAIN Section (1/2)– ................. 33
5-8. Printed Wiring Board –MAIN Section (2/2)– ................. 34
5-9. Schematic Diagram –MAIN Section (1/8)– ................... 35
5-10. Schematic Diagram –MAIN Section (2/8)– ................... 36
5-11. Schematic Diagram –MAIN Section (3/8)– ................... 37
5-12. Schematic Diagram –MAIN Section (4/8)– ................... 38
5-13. Schematic Diagram –MAIN Section (5/8)– ................... 39
5-14. Schematic Diagram –MAIN Section (6/8)– ................... 40
5-15. Schematic Diagram –MAIN Section (7/8)– ................... 41
5-16. Schematic Diagram –MAIN Section (8/8)– ................... 42
5-17. Printed Wiring Board –IO Section– ................................ 43
5-18. Schematic Diagram –IO Section– ................................... 44
5-19. Printed Wiring Boards
5-11. Schematic Diagram –MAIN Section (3/8)– ................... 37
5-12. Schematic Diagram –MAIN Section (4/8)– ................... 38
5-13. Schematic Diagram –MAIN Section (5/8)– ................... 39
5-14. Schematic Diagram –MAIN Section (6/8)– ................... 40
5-15. Schematic Diagram –MAIN Section (7/8)– ................... 41
5-16. Schematic Diagram –MAIN Section (8/8)– ................... 42
5-17. Printed Wiring Board –IO Section– ................................ 43
5-18. Schematic Diagram –IO Section– ................................... 44
5-19. Printed Wiring Boards
–JACK, KEY-SW, P-SW, LED Section– ........................ 45
5-20. Schematic Diagram –JACK Section– ............................. 46
5-21. Schematic Diagram –KEY-SW, P-SW, LED Section– ... 47
5-22. Printed Wiring Boards –USB, MS-203 Section– ............ 48
5-23. Schematic Diagram –USB Section– ............................... 48
5-24. Printed Wiring Boards –FL, ENCODER Section– ......... 49
5-25. Schematic Diagram –FL Section– .................................. 50
5-26. Schematic Diagram –ENCODER Section– .................... 51
5-27. Printed Wiring Board –S-AIR-INCLUDE Section– ....... 52
5-28. Schematic Diagram –S-AIR-INCLUDE Section– ......... 53
5-29. Printed Wiring Board –POWER Section– ...................... 54
5-30. Schematic Diagram –POWER Section– ......................... 55
5-21. Schematic Diagram –KEY-SW, P-SW, LED Section– ... 47
5-22. Printed Wiring Boards –USB, MS-203 Section– ............ 48
5-23. Schematic Diagram –USB Section– ............................... 48
5-24. Printed Wiring Boards –FL, ENCODER Section– ......... 49
5-25. Schematic Diagram –FL Section– .................................. 50
5-26. Schematic Diagram –ENCODER Section– .................... 51
5-27. Printed Wiring Board –S-AIR-INCLUDE Section– ....... 52
5-28. Schematic Diagram –S-AIR-INCLUDE Section– ......... 53
5-29. Printed Wiring Board –POWER Section– ...................... 54
5-30. Schematic Diagram –POWER Section– ......................... 55
6.
EXPLODED VIEWS
6-1. Overall
Section
............................................................... 69
6-2. Front Panel Section ......................................................... 70
6-3. Front Boards Section ...................................................... 71
6-4. Back Panel Section ......................................................... 72
6-5. Chassis
6-3. Front Boards Section ...................................................... 71
6-4. Back Panel Section ......................................................... 72
6-5. Chassis
Section
............................................................... 73
6-6. DVD Mechanism Deck Section
(CDM85MB-DVBU102)
(CDM85MB-DVBU102)
................................................
74
7.
ELECTRICAL PARTS LIST
.............................. 75
HBD-DZ910W
6
tray
Insert a screwdriver from between the front panel and
the chassis and slide the rod in the direction of the arrow.
the chassis and slide the rod in the direction of the arrow.
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
How to open the disc table when power switch turns off
Insert a tapering driver into the aperture of the unit bottom, and
slide it in the direction of the arrow.
Insert a tapering driver into the aperture of the unit bottom, and
slide it in the direction of the arrow.
Precaution when installing a new OP unit/
Precaution before unsoldering the static electricity
prevention solder bridge
Precaution before unsoldering the static electricity
prevention solder bridge
When installing a new OP unit, be sure to connect the fl exible
printed circuit board fi rst of all before removing the static electric-
ity prevention solder bridge by unsoldering.
Remove the static electricity prevention solder bridge by unsolder-
ing after the fl exible printed circuit board has already been con-
nected.
(Do not remove nor unsolder the solder bridge as long as the OP
unit is kept standalone.)
printed circuit board fi rst of all before removing the static electric-
ity prevention solder bridge by unsoldering.
Remove the static electricity prevention solder bridge by unsolder-
ing after the fl exible printed circuit board has already been con-
nected.
(Do not remove nor unsolder the solder bridge as long as the OP
unit is kept standalone.)
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
On cleaning discs, disc/lens cleaners
• Do not use cleaning discs or disc/lens cleaners (including wet
• Do not use cleaning discs or disc/lens cleaners (including wet
or spray types). These may cause the apparatus to malfunction.
IMPORTANT NOTICE
Caution: This system is capable of holding a still video image or on-
screen display image on your television screen indefi nitely. If you leave
the still video image or on-screen display image displayed on your TV
for an extended period of time you risk permanent damage to your tele-
vision screen.
Projection televisions are especially susceptible to this.
Caution: This system is capable of holding a still video image or on-
screen display image on your television screen indefi nitely. If you leave
the still video image or on-screen display image displayed on your TV
for an extended period of time you risk permanent damage to your tele-
vision screen.
Projection televisions are especially susceptible to this.
DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Setting Procedure :
1. Press the [
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Setting Procedure :
1. Press the [
?/1
] button to turn the set on.
2. Press the [FUNCTION] button to set DVD/CD function.
3. Insert a disc.
4. Press the [
3. Insert a disc.
4. Press the [
x
] button and the [
Z
] button simultaneously for fi ve
seconds.
5. The message “LOCKED” is displayed and the tray is locked.
Releasing Procedure :
1. Press the [
Releasing Procedure :
1. Press the [
x
] button and the [Z] button simultaneously for fi ve
seconds again.
2. The message “UNLOCKED” is displayed and the tray is un-
locked.
Note: When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the [?/1] button.
LASER DIODE AND FOCUS SEARCH
1. Open the case and turn POWER on with no disc inserted.
2. Confi rm that the following operation is performed while ob-
1. Open the case and turn POWER on with no disc inserted.
2. Confi rm that the following operation is performed while ob-
serving the objecting lens from the clearance of DVD mecha-
nism deck.
1) Confi rm that laser beam is spread.
2) Up and down motion of the objective lens. (2 times)
nism deck.
1) Confi rm that laser beam is spread.
2) Up and down motion of the objective lens. (2 times)
