Sony DAV-DZ910W / HBD-DZ910W Service Manual ▷ View online
HBD-DZ910W
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
General
Power requirements
North American and Mexican models:
North American and Mexican models:
120 V AC, 60 Hz
Taiwan models:
120 V AC, 50/60 Hz
Argentine models:
220 V - 240 V AC,
50/60
Hz
Latin American models: 110 V - 240 V AC,
50/60
50/60
Hz
Other models:
220 V - 240 V AC,
50/60
Hz
Power consumption
On: 125 W
Standby:
0.25
W*
* Valid when the system is in the following status:
– “DEMO” is set to “OFF.”
– [CONTROL FOR HDMI] is set to [OFF].
– “S-AIR STBY” is set to “STBY OFF.”
– “DEMO” is set to “OFF.”
– [CONTROL FOR HDMI] is set to [OFF].
– “S-AIR STBY” is set to “STBY OFF.”
Dimensions (approx.)
430 mm
× 66 mm × 390
mm (w/h/d) incl.
projecting
parts
430
mm
× 66 mm × 420
mm (w/h/d) with the
wireless
transceiver
inserted
Mass (approx.)
Mass (approx.)
4.4 kg
Supported fi le format
MP3 (MPEG 1 Audio Layer-3)
File Extension:
mp3
Bitrate:
32 kbps - 320 kbps
Sampling frequencies:
32/44.1/48 kHz
WMA (USB device only)
File Extension:
wma
Bitrate:
48 kbps - 192 kbps
Sampling frequencies:
44.1 kHz
AAC (USB device only)
File Extension:
m4a
Bitrate:
48 kbps - 320 kbps
Sampling frequencies:
44.1 kHz
DivX
File Extension:
avi/divx
Video codec:
DivX video
Bitrate:
10.08 Mbps (MAX)
Frame rate:
30 fps
Resolution: 720
× 576
Audio codec:
MP3
MPEG4
File format:
MP4 File Format
File Extension:
mp4/m4v
Video codec:
MPEG4 Simple Profi le (AVC is not compatible.)
Bitrate: 4
Mbps
Frame rate:
30 fps
Resolution: 720
× 576
Audio codec:
AAC-LC (HE-AAC is not compatible.)
DRM: Not
compatible
Design and specifi cations are subject to change without notice.
SPECIAL COMPONENT NOTICE
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
HBD-DZ910W
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HBD-DZ910W
4
• Abbreviation
CH
CH
: Chinese model
E3
: 240V AC area in E model
E15
: Iranian model
EA
: Saudi Arabia model
SP
: Singapore model
TH :
Thai
model
Model
Part No.
E3 model
4-159-515-0[]
E15, EA models
4-159-515-1[]
SP model
4-159-515-2[]
CH model
4-159-515-3[]
TH model
4-159-515-4[]
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
(When letters/numbers appear in the
display)
display)
When the self-diagnosis function is activated to
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the TV screen or front panel display. In this case,
check the following table.
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a
combination of a letter and 4 digits appears on
the TV screen or front panel display. In this case,
check the following table.
When the version number
appears on the TV screen
When you turn on the system, the version
number [VER.X.XX] (X is a number) may
appear on the TV screen. Although this is not a
malfunction and for Sony service use only,
normal system operation will not be possible.
Turn off the system, and then turn on the system
again to operate.
number [VER.X.XX] (X is a number) may
appear on the TV screen. Although this is not a
malfunction and for Sony service use only,
normal system operation will not be possible.
Turn off the system, and then turn on the system
again to operate.
Self-diagnosis Function
First 3
characters of
the service
number
characters of
the service
number
Cause and/or corrective action
C 13
The disc is dirty.
,Clean the disc with a soft cloth
,Clean the disc with a soft cloth
E XX
(XX is a
number)
number)
To prevent a malfunction, the
system has performed the self-
diagnosis function.
,Contact your nearest Sony
system has performed the self-
diagnosis function.
,Contact your nearest Sony
dealer or local authorized Sony
service facility and give the 5-
character service number.
service facility and give the 5-
character service number.
Example: E 61 10
C:13:50
VER.X.XX
Parts No.
HBD-DZ910W
5
TABLE OF CONTENTS
1.
SERVICING NOTES
............................................. 6
2. DISASSEMBLY
2-1. Case ................................................................................ 9
2-2. Loading
2-2. Loading
Panel
................................................................. 10
2-3. Front Panel Section ......................................................... 10
2-4. FL Board, ENCODER Board, JACK Board,
2-4. FL Board, ENCODER Board, JACK Board,
USB Board, LED Board ................................................. 11
2-5. KEY-SW Board, P-SW Board ........................................ 12
2-6. Back Panel Section ......................................................... 13
2-7. MAIN
2-6. Back Panel Section ......................................................... 13
2-7. MAIN
Board
................................................................... 14
2-8. IO
Board
......................................................................... 15
2-9. POWER
Board
................................................................ 15
2-10. DVD Mechanism Deck Section ...................................... 16
2-11. Tray ................................................................................. 16
2-12. Belt .................................................................................. 17
2-13. MS-203 Board ................................................................. 17
2-14. Base Unit ......................................................................... 18
2-15. Optical Pick-up ............................................................... 18
2-11. Tray ................................................................................. 16
2-12. Belt .................................................................................. 17
2-13. MS-203 Board ................................................................. 17
2-14. Base Unit ......................................................................... 18
2-15. Optical Pick-up ............................................................... 18
3.
TEST MODE
............................................................ 19
4. ELECTRICAL
ADJUSTMENTS
........................ 23
5. DIAGRAMS
5-1. Block Diagram –RF Section– ......................................... 27
5-2. Block Diagram –VIDEO Section– ................................. 28
5-3. Block Diagram –AUDIO Section– ................................. 29
5-4. Block Diagram –AMP Section– ..................................... 30
5-5. Block Diagram –DIR/S-AIR Section– ........................... 31
5-6. Block Diagram –POWER Section– ................................ 32
5-7. Printed Wiring Board –MAIN Section (1/2)– ................. 33
5-8. Printed Wiring Board –MAIN Section (2/2)– ................. 34
5-9. Schematic Diagram –MAIN Section (1/8)– ................... 35
5-2. Block Diagram –VIDEO Section– ................................. 28
5-3. Block Diagram –AUDIO Section– ................................. 29
5-4. Block Diagram –AMP Section– ..................................... 30
5-5. Block Diagram –DIR/S-AIR Section– ........................... 31
5-6. Block Diagram –POWER Section– ................................ 32
5-7. Printed Wiring Board –MAIN Section (1/2)– ................. 33
5-8. Printed Wiring Board –MAIN Section (2/2)– ................. 34
5-9. Schematic Diagram –MAIN Section (1/8)– ................... 35
5-10. Schematic Diagram –MAIN Section (2/8)– ................... 36
5-11. Schematic Diagram –MAIN Section (3/8)– ................... 37
5-12. Schematic Diagram –MAIN Section (4/8)– ................... 38
5-13. Schematic Diagram –MAIN Section (5/8)– ................... 39
5-14. Schematic Diagram –MAIN Section (6/8)– ................... 40
5-15. Schematic Diagram –MAIN Section (7/8)– ................... 41
5-16. Schematic Diagram –MAIN Section (8/8)– ................... 42
5-17. Printed Wiring Board –IO Section– ................................ 43
5-18. Schematic Diagram –IO Section– ................................... 44
5-19. Printed Wiring Boards
5-11. Schematic Diagram –MAIN Section (3/8)– ................... 37
5-12. Schematic Diagram –MAIN Section (4/8)– ................... 38
5-13. Schematic Diagram –MAIN Section (5/8)– ................... 39
5-14. Schematic Diagram –MAIN Section (6/8)– ................... 40
5-15. Schematic Diagram –MAIN Section (7/8)– ................... 41
5-16. Schematic Diagram –MAIN Section (8/8)– ................... 42
5-17. Printed Wiring Board –IO Section– ................................ 43
5-18. Schematic Diagram –IO Section– ................................... 44
5-19. Printed Wiring Boards
–JACK, KEY-SW, P-SW, LED Section– ........................ 45
5-20. Schematic Diagram –JACK Section– ............................. 46
5-21. Schematic Diagram –KEY-SW, P-SW, LED Section– ... 47
5-22. Printed Wiring Boards –USB, MS-203 Section– ............ 48
5-23. Schematic Diagram –USB Section– ............................... 48
5-24. Printed Wiring Boards –FL, ENCODER Section– ......... 49
5-25. Schematic Diagram –FL Section– .................................. 50
5-26. Schematic Diagram –ENCODER Section– .................... 51
5-27. Printed Wiring Board –S-AIR-INCLUDE Section– ....... 52
5-28. Schematic Diagram –S-AIR-INCLUDE Section– ......... 53
5-29. Printed Wiring Board –POWER Section– ...................... 54
5-30. Schematic Diagram –POWER Section– ......................... 55
5-21. Schematic Diagram –KEY-SW, P-SW, LED Section– ... 47
5-22. Printed Wiring Boards –USB, MS-203 Section– ............ 48
5-23. Schematic Diagram –USB Section– ............................... 48
5-24. Printed Wiring Boards –FL, ENCODER Section– ......... 49
5-25. Schematic Diagram –FL Section– .................................. 50
5-26. Schematic Diagram –ENCODER Section– .................... 51
5-27. Printed Wiring Board –S-AIR-INCLUDE Section– ....... 52
5-28. Schematic Diagram –S-AIR-INCLUDE Section– ......... 53
5-29. Printed Wiring Board –POWER Section– ...................... 54
5-30. Schematic Diagram –POWER Section– ......................... 55
6.
EXPLODED VIEWS
6-1. Overall
Section
............................................................... 69
6-2. Front Panel Section ......................................................... 70
6-3. Front Boards Section ...................................................... 71
6-4. Back Panel Section ......................................................... 72
6-5. Chassis
6-3. Front Boards Section ...................................................... 71
6-4. Back Panel Section ......................................................... 72
6-5. Chassis
Section
............................................................... 73
6-6. DVD Mechanism Deck Section
(CDM85MB-DVBU102)
(CDM85MB-DVBU102)
................................................
74
7.
ELECTRICAL PARTS LIST
.............................. 75