DAV-DZ810W, HCD-DZ810W — Sony Audio Service Manual (repair manual)

Model
DAV-DZ810W HCD-DZ810W
Pages
100
Size
13.15 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
dav-dz810w-hcd-dz810w.pdf
Date

View Sony DAV-DZ810W / HCD-DZ810W Service Manual online

SERVICE MANUAL
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation
AEP Model
UK Model
SUPER AUDIO CD/DVD RECEIVER
9-887-192-02
2006I16-1
© 2006.09
Ver. 1.1  2006.09
HCD-DZ810W
HCD-DZ810W is the amplifier, DVD/CD and tuner
section in DAV-DZ810W.
SPECIFICATIONS
Model Name Using Similar Mechanism
HCD-DZ110
Mechanism Type
CDM85-DVBU102
Optical Pick-up Name
KHM-310CAA
This system incorporates with Dolby*
1
 Digital and Dolby Pro Logic (II)
adaptive matrix surround decoder and the DTS*
2
  Digital Surround
System.
*1 Manufactured under license from Dolby Laboratories.
“Dolby,” “Pro Logic,” and the double-D symbol are trademarks of
Dolby Laboratories.
*2 Manufactured under license from Digital Theater Systems, Inc.
“DTS” and “DTS Digital Surround” are trademarks of Digital
Theater Systems, Inc.
Amplifier section
Stereo mode (rated)
108 W + 108 W (3 ohms at 
1 kHz, 1 % THD)
Surround mode (reference)  RMS output power, 10 % 
THD
Front: 143 W + 143 W 
(with SS-TS55)
Center*: 143 W
(with SS-CT52)
Surround*: 143 W + 143 
W** (3 ohms)
Subwoofer*: 285 W
(with SS-WS52B)
* Depending on the sound field settings and the source, 
there may be no sound output.
** When connecting the surround speakers to the system 
by the speaker cords.
Inputs (Analog)
LINE1/TV (AUDIO IN)
Sensitivity: 450/250 mV
AUDIO IN
Sensitivity: 250/125 mV
Inputs (Digital)
LINE1 (
OPTICAL IN
)/LINE2 (
COAXIAL IN
)
impedance: –/75 ohms
Outputs (Analog)
Phones
Accepts low-and high-
impedance headphones.
Super Audio CD/DVD system
Laser
 
Semiconductor laser
(Super Audio CD/DVD:
 
λ = 650 nm)
(CD: 
λ = 790 nm)
Emission duration: 
continuous
Signal format system
PAL
Tuner section
System
PLL quartz-locked digital 
synthesizer system
FM tuner section
Tuning range 
87.5 – 108.0 MHz 
(50 kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range 
531 – 1,602 kHz (with the 
interval set at 9 kHz)
Antenna (aerial)
AM loop antenna (aerial)
Intermediate frequency
450 kHz
Video section
Outputs
VIDEO: 1 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p 
75 ohms
R/G/B: 0.7 Vp-p 75 ohms
HDMI OUT: Type A (19 
pin)
General
Power requirements 
220 – 240 V AC, 50/60 Hz
Power consumption
On: 170 W
Standby: 0.3 W (at the 
Power Saving mode) 
Dimensions (approx.)
430 
× 55×  390 mm (w/h/d) 
incl. projecting parts
Mass (approx.)
4.0 kg
Design and specifications are subject to change 
without notice.
2
HCD-DZ810W
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270 
°
C
during repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This appliance is classified as
a CLASS 1 LASER product.
This marking is located on
the bottom exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
3
HCD-DZ810W
TABLE OF CONTENTS
1.
SERVICING NOTE
...................................................
4
2.
GENERAL
................................................................... 10
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 13
3-2.
Case, Front Panel Assy .................................................... 14
3-3.
FL Board .......................................................................... 15
3-4.
JACK Board, SW Board .................................................. 15
3-5.
I/O SCART Board, SPEAKER Board ............................. 16
3-6.
MAIN Board .................................................................... 16
3-7.
DMB12 Board ................................................................. 17
3-8.
DIAT-TX Board ............................................................... 17
3-9.
DC Fan, Tuner Unit ......................................................... 18
3-10. POWER Board ................................................................ 18
3-11. DVD Mechanism Deck (CDM85-DVBU102) ................ 19
3-12. Tray .................................................................................. 19
3-13. Belt, MS-203 Board ........................................................ 20
3-14. Optical Pick-up (KHM-310CAA) ................................... 21
4.
TEST MODE
............................................................... 22
5.
ELECTRICAL ADJUSTMENT
............................. 26
6.
DIAGRAMS
6-1.
Block Diagram  – RF Section – ....................................... 28
6-2.
Block Diagram  – AMP Section – ................................... 29
6-3.
Block Diagram  – AUDIO Section – ............................... 30
6-4.
Block Diagram  – VIDEO Section – ............................... 31
6-5.
Block Diagram  – DIAT Section – .................................. 32
6-6.
Block Diagram  – POWER Section – .............................. 33
6-7.
Printed Wiring Board  – DMB12 Board (Side A) – ........ 34
6-8.
Printed Wiring Board  – DMB12 Board (Side B) – ........ 35
6-9.
Schematic Diagram  – DMB12 Board (1/7) – ................. 36
6-10. Schematic Diagram  – DMB12 Board (2/7) – ................. 37
6-11. Schematic Diagram  – DMB12 Board (3/7) – ................. 38
6-12. Schematic Diagram  – DMB12 Board (4/7) – ................. 39
6-13. Schematic Diagram  – DMB12 Board (5/7) – ................. 40
6-14. Schematic Diagram  – DMB12 Board (6/7) – ................. 41
6-15. Schematic Diagram  – DMB12 Board (7/7) – ................. 42
6-16. Printed Wiring Board  – MAIN Board (Side A) – ........... 43
6-17. Printed Wiring Board  – MAIN Board (Side B) – ........... 44
6-18. Schematic Diagram  – MAIN Board (1/8) – ................... 45
6-19. Schematic Diagram  – MAIN Board (2/8) – ................... 46
6-20. Schematic Diagram  – MAIN Board (3/8) – ................... 47
6-21. Schematic Diagram  – MAIN Board (4/8) – ................... 48
6-22. Schematic Diagram  – MAIN Board (5/8) – ................... 49
6-23. Schematic Diagram  – MAIN Board (6/8) – ................... 50
6-24. Schematic Diagram  – MAIN Board (7/8) – ................... 51
6-25. Schematic Diagram  – MAIN Board (8/8) – ................... 52
6-26. Printed Wiring Board  – I/O SCART Board (Side A) – .. 53
6-27. Printed Wiring Board  – I/O SCART Board (Side B) – .. 54
6-28. Schematic Diagram  – I/O SCART Board – .................... 55
6-29. Printed Wiring Boards  – PANEL Section – .................... 56
6-30. Schematic Diagram  – PANEL Section – ........................ 57
6-31. Printed Wiring Board  – SPEAKER Board – .................. 58
6-32. Schematic Diagram  – SPEAKER Board – ..................... 58
6-33. Printed Wiring Board  – DIAT-TX Board – .................... 59
6-34. Schematic Diagram  – DIAT-TX Board – ....................... 60
6-35. Printed Wiring Board  – MS-203 Board – ....................... 61
6-36. Schematic Diagram  – MS-203 Board – ......................... 61
6-37. Printed Wiring Board  – POWER Board – ...................... 62
6-38. Schematic Diagram  – POWER Board  – ........................ 63
7.
EXPLODED VIEWS
7-1.
Overall Section ................................................................ 77
7-2.
Front Panel Section ......................................................... 78
7-3.
Chassis Section ................................................................ 79
7-4.
DVD Mechanism Deck Section (CDM85-DVBU102) ... 80
8.
ELECTRICAL PARTS LIST
.................................. 81
4
HCD-DZ810W
SECTION  1
SERVICING  NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH
1. Open the cover and turn POWER on with no disc inserted.
2. Confirm that the following operation is performed while
observing the objecting lens.
1)
Confirm that laser beam is spread.
2)
Up and down motion of the objective lens. (3 times)
DISC TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Setting Procedure :
1. Press the  ?/1  button to turn the set on.
2. Press the [FUNCTION] button to set DVD function.
3. Insert a disc.
4. Press the  
x  
button and the  
 button simultaneously for five
seconds.
5. The message “LOCKED” is displayed and the tray is locked.
Releasing Procedure :
1. Press the  
x  
button and the  
 button simultaneously for five
seconds again.
2. The message “UNLOCKED” is displayed and the tray is
unlocked.
Note :
When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the  ?/1  button.
Note on DMB12 board replacement
New part of EEP ROM (IC103, IC706) on the DMB12 board cannot be
used. Therefore, if the mounted DMB12 board (A-1166-673-A) is replaced,
exchange new EEP ROM (IC103, IC706) with that used before the
replacement.
When the self-diagnosis function is activated to 
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a 
combination of a letter and 4 digits appears on 
the screen and the front panel display. In this 
case, check the following table.
When displaying the version 
number on the screen
When you turn on the system, the version 
number [VER.X.XX] (X is a number) may 
appear on the screen. Although this is not a 
malfunction and for Sony service use only, 
normal system operation will not be possible. 
Turn off the system, and then turn on the system 
again to operate.
Self-diagnosis Function 
(When letters/numbers appear in the 
display)
First 3 
characters of 
the service 
number
Cause and/or corrective action
C 13
The disc is dirty.
,Clean the disc with a soft cloth 
C 31
The disc is not inserted correctly.
,Restart the system, then re-insert 
the disc correctly.
E XX
(xx is a number)
To prevent a malfunction, the 
system has performed the self-
diagnosis function.
,Contact your nearest Sony 
dealer or local authorized Sony 
service facility and give the 5-
character service number.
Example: E 61 10
C:13:50
VER.X.XX
5
HCD-DZ810W
CN3002
MAIN BOARD
POWER BOARD
CN902
RED
BLACK
C903
C939
C933
C932
Discharge the charged electricity in capacitors to prevent electric shock as follows 
When disassembling the machine, be sure to discharge the charged electricity in the following capacitors.
Use a resistor of 800 ohms, 2 Watts for discharging the following capacitors. 
POWER board
   C903 : 600V
   C932, C933, C939, CN902 : 30V
MAIN board
   CN3002 : 30 V
(Parts face side)
(Parts face side)
*
Connect the specified resistor
   between black and red leads
HOW TO OPEN THE DISC TABLE WHEN POWER SWITCH TURNS OFF 
Insert a tapering driver into the aperture of the unit bottom, and slide
it in the direction of the arrow.
disc tray
tapering driver

Download Sony DAV-DZ810W / HCD-DZ810W Service Manual (Repair Manual)

Here you can view online or download Sony DAV-DZ810W / HCD-DZ810W Service Manual in pdf. This Service Manual can help you recover, restore, fix, disassemble and repair Sony DAV-DZ810W / HCD-DZ810W Audio. Information contained in Sony DAV-DZ810W / HCD-DZ810W service manual (repair manual) typically includes:

  • Disassembly, troubleshooting, programming, maintenance, remote, adjustment, installation and setup instructions.
  • Schematics, wiring and block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).