Sony DAV-DS1000 / SA-IR1000 Service Manual ▷ View online
5
SA-IR1000
SECTION 2
DISASSEMBLY
Note:
Follow the disassembly procedure in the numerical order given.
2-1. NET FRAME ASSY, CAP LIGHT (REAR) ASSY
4
cap light (rear) assy
1
net frame assy
net frame assy
2
two screws
(+BVTP 3
(+BVTP 3
×
10)
3
two screws
(PWH M3 )
(PWH M3 )
Caution:
To remove the net frame assy, heat the areas that are attached
by the adhesive agent, to 40
by the adhesive agent, to 40
°
C or 50
°
C with a hair-dryer.
After heating up, remove it easily.
Areas attached by
adhesive agent
adhesive agent
JIG for speaker remover
(J-2501-238-A)
(J-2501-238-A)
Ver 1.1 2004.01
6
SA-IR1000
1
two screws
(+BVTP 3
(+BVTP 3
×
10)
3
two screws
(DIA. 2.6)(IT3B)
(DIA. 2.6)(IT3B)
5
cover rear
2
Slide ‘‘Cover Rear’’ up to disengage the ten claws.
4
POWER LED board
five claws
five claws
2-2. COVER REAR
Ver 1.1 2004.01
7
7
SA-IR1000
C E
B
These are omitted.
• IC Block Diagram
– F/E Board –
– F/E Board –
IC121 CXA3504M-T6
SECTION 3
DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
2
: nonflammable resistor
•
C
: panel designation
•
A
: B+ Line
• Voltage is measured when SS-IF1000, SA-WS1000 and
DVX-DS1000 (DVD stop) are connected, so SS-IR1000
receive infrared rays.
receive infrared rays.
• Voltages are dc with respect to ground under no-signal con-
ditions.
• Voltages are taken with a VOM (input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Signal path
F
: AUDIO (DIGITAL)
• Abbreviation
SP
: Singapore model
MX
: Mexican model
HK
: Hong Kong model
EA
: Saudi Arabia model
KR
: Korea model
AUS
: Australian model
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
C
B
These are omitted.
E
Q
Note on Printed Wiring Boards:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
b
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
V
CC
I
V
CC
S
V
CC
O
Signal Process Block
Output Block
PRE_AMP
O_AMP
Current
Source
Source
AGC A T T
I/V Amp
AGC23
AGC24
GNDO
DET
OUT
V
CC
O
V
CC
S
NC
NC
NC
F_H
NC
ADJ
RSET
AGC22
AGC21
V
CC
I
SIS
GNDI
IN
NC
NC
NC
AGC13
AGC12
AGC11
GNDS
NC
Rt
Vref
Vref
IN
0deg
-
180deg
IN+
IN-
OUT+
8MHz
LPF
LPF
Full
BPF
BPF
6MHz
LPF
LPF
H/L
BPF
BPF
Filter
Select
Select
OUT-
Input Block
Phase Splitter
1st A GC Amp
2nd A GC Amp
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
Ver. 1.2
8
8
SA-IR1000
3-1. PRINTED WIRING BOARD – F/E Section –
1
2
A
B
C
D
E
F
G
3
4
5
6
7
8
9
10
IC121
SPEAKER
SPEAKER
TERMINAL
TERMINAL
-
2
1
2
1
1
2
STAND BY
AC IN
+
A
E
G
B
TO
POWER BOARD
CN904
TO
AMP BOARD
CN302
TO
AMP BOARD
(L)/(R)
CN303
(EXCEPT MX: Page 10) (MX: Page 11)
TO
AMP BOARD
CN304
3
TO
POWER BOARD
CN901
(EXCEPT MX: Page 10)
(MX: Page 11)
(MX: Page 11)
Supp-1
Page 5
Page 5
F
Supp-1
Page 5
Page 5
Supp-1
Page 5
Page 5
(L)/(R)
Ref. No.
Location
D125
E-3
D126
E-3
D127
E-4
D128
E-4
D129
E-4
D130
E-5
D131
D-5
D132
D-4
D133
D-4
D134
D-4
D135
D-3
D136
D-3
D137
D-3
D138
D-2
D139
D-2
D140
D-2
D141
D-2
D142
D-1
D143
E-1
D144
E-1
D145
E-2
D146
E-2
D147
E-2
D148
E-3
D190
G-6
D351
B-6
IC121
B-2
• Semiconductor
Location
Ver. 1.2
•
See page 2 of Supplement-1 for Circuit Boards Location.
:Uses unleaded solder.
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