DAR-RD100, HTR-210SS — Sony Audio Service Manual (repair manual)

Model
DAR-RD100 HTR-210SS
Pages
77
Size
8.01 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
dar-rd100-htr-210ss.pdf
Date

View Sony DAR-RD100 / HTR-210SS Service Manual online

AEP Model
UK Model
SERVICE MANUAL
DVD RECORDER
SPECIFICATIONS
RMT-D215P
RDR-GX210
System
Laser: Semiconductor laser
Channel coverage: 
PAL/SECAM (B/G, D/K, I, L) 
VHF: E2 to E12, R1 to R12, F1 to F10, Italian 
A to H, Ireland A to J, South Africa 4 to 13/
UHF: E21 to E69, R21 to R69, B21 to B69, 
F21 to F69/CATV: S01 to S05, S1 to S20, 
France B to Q/HYPER: S21 to S41
The above channel coverage merely ensures the 
channel reception within these ranges. It does 
not guarantee the ability to receive signals in 
all circumstances.
Video reception: Frequency synthesizer system
Audio reception: Split carrier system
Aerial out: 75-ohm asymmetrical aerial socket
Timer: Clock: Quartz locked/Timer indication: 
24-hour cycle (digital)
Video recording format: MPEG Video
Audio recording format: Dolby Digital/2 ch
Inputs and outputs
LINE 2 OUT
(AUDIO): 
Phono jack/2 Vrms/600 ohms
(VIDEO): Phono jack/1.0 Vp-p
(S VIDEO): 4-pin mini DIN/Y:1.0 Vp-p, 
C: 0.3 Vp-p (PAL)
LINE 2 IN/LINE 4 IN
(AUDIO):
 Phono jack/2 Vrms/more than 47 
kilohms
(VIDEO): Phono jack/1.0 Vp-p
(S VIDEO): 4-pin mini DIN/Y:1.0 Vp-p, 
C: 0.3 Vp-p (PAL)
LINE 1 -TV: 21-pin 
CVBS IN/OUT 
RGB OUT (upstream)
LINE 3/DECODER: 21-pin 
CVBS IN/OUT 
RGB IN 
Decoder
DV IN: 4-pin/i.LINK S100
DIGITAL OUT (OPTICAL): Optical output 
jack/–18 dBm  (wave length: 660 nm)
DIGITAL OUT (COAXIAL): Phono jack/
0.5 Vp-p/75 ohms
COMPONENT VIDEO OUT 
(Y, P
B
/C
B
, P
R
/C
R
): 
Phono jack/Y: 1.0 Vp-p, P
B
/C
B
: 0.7 Vp-p, 
P
R
/C
R
: 0.7 Vp-p
General
Power requirements: 220-240 V AC, 50/60 Hz
Power consumption: 30W
Dimensions (approx.): 430
× 75 × 293 mm 
(width/height/depth) incl. projecting parts
Mass (approx.): 4.0 kg
Operating temperature: 5 
°C to 35 °C
Operating humidity: 25 % to 80 %
Supplied accessories: 
Audio cord (1) 
Video cord (1)
Aerial cable (1) 
Remote commander (remote) (1) 
R6 (size AA) batteries (2)
Specifications and design are subject to change 
without notice.
Compatible colour systems
This recorder is designed to record and play 
using the PAL colour system. 
The signals of the SECAM colour system can 
be received or recorded but played back in the 
PAL colour system only. Recording of video 
sources based on other colour systems cannot 
be guaranteed.
— 2 —
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
WARNING!!
WHEN  SERVICING,  DO  NOT  APPROACH  THE  LASER
EXIT  WITH  THE  EYE  TOO  CLOSELY.  IN  CASE  IT  IS
NECESSARY  TO  CONFIRM  LASER  BEAM  EMISSION,
BE  SURE  TO  OBSERVE  FROM  A  DISTANCE  OF MORE
THAN   25  cm  FROM  THE  SURFACE  OF  THE OBJECTIVE
LENS  ON  THE  OPTICAL  PICK-UP  BLOCK.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
1. Check the area of your repair for unsoldered or poorly-soldered
connections.  Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair.  Point them out to
the customer and recommend their replacement.
This appliance is classified as 
a CLASS 1 LASER product. 
The CLASS 1 LASER 
PRODUCT MARKING is 
located on the rear exterior.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
4. Look for parts which, though functioning, show obvious signs
of deterioration.  Point them out to the customer and recommend
their replacement.
5. Check the B+ voltage to see it is at the values specified.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
— 3 —
TABLE OF CONTENTS
Service Note
1
Connection of Jig (Extension Cable) ·································· 4
2
Disc Removal Procedure (at Power off) ····························· 5
1.
General
Hookups and Settings ······················································ 1-3
Basic Operation ······························································· 1-6
Recording ········································································ 1-9
Playback ········································································ 1-11
Erasing and Editing ······················································· 1-14
DV Dubbing ·································································· 1-16
Settings and Adjustments ·············································· 1-17
Additional Information ·················································· 1-19
2.
Disassembly
2-1
Top Case ········································································· 2-1
2-2
Front Panel Section-1 ····················································· 2-1
2-3
Front Panel Section-2 ····················································· 2-2
2-4
Video Deck Ass’y ··························································· 2-2
3.
Block Diagrams
1)
Video Block Diagram ····················································· 3-1
2)
Audio Block Diagram ···················································· 3-3
3)
Video Input/Record Path ················································ 3-5
4)
Video Output Path ·························································· 3-7
5)
Audio Input Path (Tuner, AV & DV1394) ······················ 3-9
6)
FLD/u-Com/Tuner ······················································· 3-11
7)
Power: Main Board ······················································ 3-13
4.
Schematic Diagrams
4-1
Frame (1/2) ······································································ 4-1
4-2
Frame (2/2) ······································································ 4-3
4-3
Power ··············································································· 4-5
4-4
Mpeg Encoder ································································· 4-7
4-5
Mpeg Decoder ································································· 4-9
4-6
Video Decoder & DV1394 Phy ····································· 4-11
4-7
I/O ·················································································· 4-13
4-8
Key ················································································ 4-15
4-9
Jack ················································································ 4-17
4-10 Timer ············································································· 4-19
4-11 Waveforms ····································································· 4-21
4-12 Circuit Voltage Chart ····················································· 4-23
5.
Printed Wiring Boards
5-1
Main Board ······································································ 5-1
5-2
I/O Board ········································································· 5-3
5-3
Key/Timer Board ····························································· 5-7
5-4
Jack Board ······································································· 5-9
6.
Troubleshooting
·················································
6-1
7.
Repair Parts List
7-1
Exploded Views ······························································· 7-1
7-1-1 Cabinet and Main Frame Section ···································· 7-1
7-1-2 Packing Accessory Section ·············································· 7-2
7-2
Electrical Parts List ························································· 7-3
— 4 —
SERVICE  NOTE
Video deck assy
Main board
PM101
PM102
Extension cable
(J-6090-174-A)
PIM01
PIM02
I/O board
Key board
TIMER board
Jack board
SMPS board
RDR-GX210
1. CONNECTION  OF  JIG (EXTENSION CABLE)
Please use the extension cable (J-6090-174-A) as shown in the figure below when you serve the main board and I/O board.
— 5 —
2. DISC  REMOVAL  PROCEDURE (at  POWER  OFF)
1)
Remove the top case.
2)
Remove the front panel block.
3)
Insert the point of the driver etc. to the hole of mechanism deck and push it. (See Fig. 1)
4)
Draw out the tray. (See Fig. 1)
Hole
Tray
Fig. 1

Download Sony DAR-RD100 / HTR-210SS Service Manual (Repair Manual)

Here you can view online or download Sony DAR-RD100 / HTR-210SS Service Manual in pdf. This Service Manual can help you recover, restore, fix, disassemble and repair Sony DAR-RD100 / HTR-210SS Audio. Information contained in Sony DAR-RD100 / HTR-210SS service manual (repair manual) typically includes:

  • Disassembly, troubleshooting, programming, maintenance, remote, adjustment, installation and setup instructions.
  • Schematics, wiring and block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).