Sony CX-LT110 / LCX-T110 / SX-LT110 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
AEP Model
UK Model
MICRO HI-FI COMPONENT SYSTEM
9-877-997-05
2006E16-1
© 2006.05
© 2006.05
Ver. 1.4 2006. 05
CX-LT110/LCX-T110/
SX-LT110
COMPONENT MODEL NAME
Amplifier/CD player/
Tuner System
Speaker System
LCX-T110
CX-LT110
SX-LT110
•
LCX-T110 is composed of following models.
SPECIFICATIONS
MAIN UNIT CX-LT110
TUNER
FM tuning range
FM tuning range
87.5 MHz to 108 MHz
FM usable sensitivity (IHF)
13.2 dBf
FM antenna terminal
75 Ω (unbalanced)
AM tuning range
531 kHz to 1602 kHz
AM usable sensitivity
350 µV/m
AM antenna
Loop antenna
AMPLIFIER
Power output
Power output
Rated: 1.9 W + 1.9 W (6 Ω,
T.H.D. 1%, 1 kHz/DIN 45500)
Reference: 2.5 W + 2.5 W (6 Ω,
T.H.D. 10%, 1 kHz/DIN 45324)
MUSIC POWER
6.0 W + 6.0 W
T.H.D. 1%, 1 kHz/DIN 45500)
Reference: 2.5 W + 2.5 W (6 Ω,
T.H.D. 10%, 1 kHz/DIN 45324)
MUSIC POWER
6.0 W + 6.0 W
Input
AUX IN: 600 mV
Outputs
SPEAKERS: 6 Ω or more
PHONES: 32 Ω or more
PHONES: 32 Ω or more
CASSETTE DECK
Track format
Track format
4 tracks, 2 channels stereo
Frequency response
50 Hz – 12500 Hz
Recording system
AC bias
Heads
Recording/playback × 1, erase × 1
CD PLAYER
Laser
Laser
Semiconductor laser (λ = 780 nm)
Emission duration: continuous
Emission duration: continuous
D/A converter
1 bit dual
Signal- to-noise ratio
95 dB (1 kHz, 0 dB)
Wow and flutter
Unmeasurable
SPEAKER SYSTEM SX-LT110
Speakers system
1 way, bass-reflex type
Speaker units
Full range: 100 mm cone type
Normal impedance
6 Ω
Dimensions (w/h/d)
Approx. 130 × 211 × 201 mm
Mass
Approx. 17 kg net per speaker
GENERAL
Power requirements
Power requirements
230 V AC, 50/60 Hz
Power consumption
20 W
Dimensions (w/h/d)
Approx. 145 × 215 × 206 mm
Mass
Approx. 2.1 kg
Supplied accessories:
FM antenna (1)
AM antenna (1)
Remote commander (1)
Batteries (2)
AM antenna (1)
Remote commander (1)
Batteries (2)
Specifications and external appearance are subject to change
without notice.
without notice.
2
CX-LT110/LCX-T110/SX-LT110
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
TABLE OF CONTENTS
1.
SERVICING NOTES
...........................................
3
2.
DIAGRAMS
2-1.
Printed Wiring Board
– MAIN Section (Conductor Side) – ...............................
– MAIN Section (Conductor Side) – ...............................
5
2-2.
Printed Wiring Board
– MAIN Section (Component Side) – .............................
– MAIN Section (Component Side) – .............................
6
2-3.
Schematic Diagram – MAIN Section (1/2) –
.............
7
2-4.
Schematic Diagram – MAIN Section (2/2) – .................
8
2-5.
Printed Wiring Board – MOTOR Section – ...................
9
2-6.
Printed Wiring Board
– FRONT/CD Section (Conductor Side)– ....................... 10
– FRONT/CD Section (Conductor Side)– ....................... 10
2-7.
Printed Wiring Board
– FRONT Section (Component Side) – ........................... 11
– FRONT Section (Component Side) – ........................... 11
2-8.
Schematic Diagram – FRONT Section – ....................... 12
2-9.
Schematic Diagram – CD Section – ............................... 13
2-10. Printed Wiring Board – POWER Section – .................... 14
2-11. Schematic Diagram – POWER Section – ...................... 14
2-11. Schematic Diagram – POWER Section – ...................... 14
3.
EXPLODED VIEWS
3-1.
Overall Section-1 ............................................................ 17
3-2.
Overall Section-2, Speaker (SX-LT110) ........................ 18
4.
ELECTRICAL PARTS LIST
................................. 19
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Ver. 1.3
3
CX-LT110/LCX-T110/SX-LT110
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.
that the S curve waveform is output several times.
PICK-UP Assy P.W.B
Solder
PRECAUTION TO REPLACE OPTICAL BLOCK
(SF-P101NR)
(SF-P101NR)
1. After the connection, remove solder shown in the figure.
4
CX-LT110/LCX-T110/SX-LT110
For Schematic Diagrams.
Note:
• All capacitors are in
Note:
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
• Voltages are dc with respect to ground under no-signal
(detuned) conditions.
• Voltages are dc with respect to ground in service mode.
For Printed Wiring Boards.
Note:
•
Note:
•
X
: parts extracted from the component side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side : Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side : Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Pattern face side : Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side : Parts on the parts face side seen from
(Component Side) the parts face are indicated.
SECTION 2
DIAGRAMS