Sony CX-LFA660 / CX-LFA770 / XR-FA660 / XR-FA770 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Personal Audio Division
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
AEP Model
UK Model
CX-LFA660/LFA770
Australian Model
CX-LFA660
COMPACT DISC DECK RECEIVER
9-879-045-02
2005J16-1
© 2005.10
© 2005.10
Ver. 1.1 2005.10
SPECIFICATIONS
CX-LFA660/LFA770
CX-LFA660/LFA770 are the Amplifier, CD player, Tape
Deck and Tuner section in XR-FA660/FA770.
Deck and Tuner section in XR-FA660/FA770.
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM77B-F1BD81A
Section
Base Unit Name
BU-F1BD81A
Optical Pick-up Name
KSM-215DCP/C2NP
TAPE
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
CMAL1Z240A
Photo : CX-LFA660
Amplifier section
CX-LFA770 for XR-FA770
DIN power output (rated): 55 + 55 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
70 + 70 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
125 + 125 W
CX-LFA660 for XR-FA660
European model:
DIN power output (rated): 40 + 40 W
DIN power output (rated): 40 + 40 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
50 + 50 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
85 + 85 W
Other models:
The following measured at AC 230 – 240 V, 50/60 Hz
DIN power output (rated): 40 + 40 W
The following measured at AC 230 – 240 V, 50/60 Hz
DIN power output (rated): 40 + 40 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
50 + 50 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Inputs
MD IN (RCA pin jacks):
MD IN (RCA pin jacks):
Sensitivity 2 V,
impedance 47 kilohms
impedance 47 kilohms
Outputs
PHONES (stereo mini jack):
PHONES (stereo mini jack):
Accepts headphones with
an impedance of 32 ohms
or more
an impedance of 32 ohms
or more
SPEAKER:
Accepts impedance of
6 ohms
6 ohms
CD player section
Laser
Semiconductor laser
(
(
λ=770 – 810 nm)
Emission duration:
continuous
continuous
Frequency response
20 Hz – 20 kHz
Tape deck section
Recording system
4-track 2-channel, stereo
— Continued on next page —
2
CX-LFA660/LFA770
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
3
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
8
3-2.
Top Cabinet, Tuner (FM/AM), DC Fan ..........................
9
3-3.
Panel (DVD) ....................................................................
9
3-4.
CD Mechanism Section ................................................... 10
3-5.
Front Panel Section ......................................................... 10
3-6.
MAIN Board .................................................................... 11
3-7.
FRONT Board ................................................................. 11
3-8.
Cassette Deck Mechanism ............................................... 12
3-9.
Power Transformer .......................................................... 12
3-10. Tray (AU) ........................................................................ 13
3-11. MS-128 Board ................................................................. 13
3-12. Base Unit, Belt, Driving Gear ......................................... 14
3-11. MS-128 Board ................................................................. 13
3-12. Base Unit, Belt, Driving Gear ......................................... 14
4.
TEST MODE
............................................................... 15
5.
MECHANICAL ADJUSTMENTS
......................... 16
6.
ELECTRICAL ADJUSTMENTS
.......................... 17
7.
DIAGRAMS
7-1.
Block Diagram – BD Section – ...................................... 22
– MAIN Section – ........................................................... 23
– MAIN Section – ........................................................... 23
7-2.
Printed Wiring Board – BD81A Section – ..................... 24
7-3.
Schematic Diagram – BD81A Section – ........................ 25
7-4.
Printed Wiring Boards – MAIN Section – ..................... 26
7-5.
Schematic Diagram – MAIN Section (1/2) – ................. 27
7-6.
Schematic Diagram – MAIN Section (2/2) – ................. 28
7-7.
Printed Wiring Board – FRONT Section – ..................... 29
7-8.
Schematic Diagram – FRONT Section – ....................... 30
7-9.
Printed Wiring Board – AMP Section – ......................... 31
7-10. Schematic Diagram – AMP Section – ............................ 32
7-11. Printed Wiring Board – PT Section – ............................. 33
7-12. Schematic Diagram – PT Section – ................................ 33
7-11. Printed Wiring Board – PT Section – ............................. 33
7-12. Schematic Diagram – PT Section – ................................ 33
8.
EXPLODED VIEWS
8-1.
Overall Section ................................................................ 41
8-2.
Front Section ................................................................... 42
8-3.
Chassis Section ................................................................ 43
8-4.
CD Mechanism Deck Section (CDM77B-F1BD81A) .... 44
8-5.
Base Unit (BU-F1BD81A) .............................................. 45
9.
ELECTRICAL PARTS LIST
.................................. 46
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50-kHz step)
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
European model:
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
Other models:
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
European model:
European model:
230 V AC, 50/60 Hz
Australian model:
230 – 240 V AC, 50/60 Hz
Power consumption
XR-FA770:
XR-FA770:
75 W
0.3 W (in Power Saving
Mode)
0.3 W (in Power Saving
Mode)
XR-FA660
European model:
European model:
65 W
0.3 W (in Power Saving
Mode)
0.3 W (in Power Saving
Mode)
Other models:
70 W
Dimensions (w/h/d)
Approx. 190
×
250
×
308
mm incl. projecting parts
and controls
and controls
Mass
CX-LFA770 for XR-FA770:
CX-LFA770 for XR-FA770:
Approx. 6.1 kg
CX-LFA660 for XR-FA660:
Approx. 5.8 kg
Design and specifications are subject to change
without notice.
without notice.
Frequency response
50 – 13,000 Hz (
±
3 dB),
using Sony TYPE I
cassettes
cassettes
3
CX-LFA660/LFA770
SECTION 1
SERVICING NOTES
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on the
rear exterior.
The CLASS 1 LASER PRODUCT MARKING is located on the
rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Part No.
Model Name
Part No.
AEP and UK models
2-067-053-0
[ ]
Australian model
2-067-053-2
[ ]
4
CX-LFA660/LFA770
• SERVICE POSITION OF THE CD MECHANISM DECK
• SERVICE POSITION OF THE TAPE CASSETTE MECHANISM DECK
CD mechanism deck
holder mech
*
Lay the CX-LFA660/LFA770 with the left-side facing downward and then check the CD mechanism deck after removing it
from the Holder Mech.
MAIN Board
tape cassette mechanism deck
front panel
*
Remove the CD mechanism deck and the Holder mech from the unit and check the tape cassette mechanism deck with
the front panel being open.