Sony CX-JV4 / JAX-V4 Service Manual ▷ View online
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
E Model
CX-JV4
Ver. 1.3 2005.04
9-961-182-04
Sony Corporation
2005D05-1
Personal Audio Group
© 2005.04
Published by Sony Engineering Corporation
SPECIFICATIONS
CX-JV4 is the tuner, amplifier, cassette deck and
disc player section in JAX-V4.
disc player section in JAX-V4.
Model Name Using Similar Mechanism
CX-JV5
CD
CD Mechanism Type
CDM74B-30BD61S
Section
Base Unit Name
BU-30BD61S
Optical Pick-up Name
OP Assy (A-MAX.3)
Tape deck
Model Name Using Similar Mechanism
CX-JV5
Section
Tape Transport Mechanism Type
CWM43FR16
TUNER
FM tuning range
FM tuning range
87.5 MHz to 108 MHz
FM usable sensitivity (IHF)
13.2 dBf
FM antenna terminal
75 ohms (unbalanced)
AM tuning range
Middle Eastern model:
Middle Eastern model:
531 kHz to 1602 kHz (9 kHz step)
Other models:
530 kHz to 1710 kHz (10 kHz step)
531 kHz to 1602 kHz (9 kHz step)
531 kHz to 1602 kHz (9 kHz step)
AM usable sensitivity
350
µV/m
AM antenna
Loop antenna
AMPLIFIER
Power output
Power output
Rated: 80 W + 80 W (1 kHz, T.H.D.
1 %, 6 ohms)
Reference: 100 W + 100 W (1 kHz,
T.H.D. 10 %, 6 ohms)
1 %, 6 ohms)
Reference: 100 W + 100 W (1 kHz,
T.H.D. 10 %, 6 ohms)
Total harmonic distortion
0.08 % (20 W, 1 kHz, 6 ohms, DIN
AUDIO)
AUDIO)
Input
VIDEO/AUX: 1.2 V
Outputs
FRONT SPEAKER: 6 ohms or more
SURROUND SPEAKER (JAX-V5
only): 8 ohms or more
PHONES: 32 ohms or more
REC OUT: 0.775 V
VIDEO OUT: 1 Vp-p (75 ohms)
SURROUND SPEAKER (JAX-V5
only): 8 ohms or more
PHONES: 32 ohms or more
REC OUT: 0.775 V
VIDEO OUT: 1 Vp-p (75 ohms)
CASSETTE DECK
Track format
Track format
4 tracks, 2 channels stereo
Frequency response
50 Hz – 8 kHz
Recording system
AC bias
Heads
Deck A: playback x 1
Deck B: Recording/playback x 1,
Deck B: Recording/playback x 1,
erase x 1
DISC PLAYER
Laser
Laser
Semiconductor laser (
λ = 795 nm)
Emission duration:
continuous
continuous
D/A converter
1 bit dual
Signal-to-noise ratio
90 dB (1 kHz, 0 dB)
Harmonic distortion
0.05 % (1 kHz, 0 dB)
Video signal
NTSC/PAL color system (selectable)
Video data
MPEG1
Audio data
MPEG1, Layer2 (VIDEO CD)
MPEG1, Layer3 (MP3-CD)
MPEG1, Layer3 (MP3-CD)
GENERAL
Power requirements
Power requirements
110-120 V/220-240 V AC (Switchable),
50 Hz/60 Hz
50 Hz/60 Hz
Power consumption
130 W
Power consumption
With ECO mode on: 0.25 W
in standby mode
With ECO mode off: 25 W
Dimensions (W x H x D)
280 x 330 x 392.5 mm
Weight
8.1 kg
Specifications and external appearance are subject to change
without notice.
without notice.
COPYRIGHT
Check copyright laws relevant to recordings from discs, tuner
or tape for the country where the unit is to be used.
Check copyright laws relevant to recordings from discs, tuner
or tape for the country where the unit is to be used.
Licensed by BBE Sound, Inc. under USP4638258, 5510752
and 5736897.
and 5736897.
CX-JV4
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The following caution label is located inside the apparatus.
This appliance is classified as
a CLASS 1 LASER product.
This marking is located on
the rear exterior.
a CLASS 1 LASER product.
This marking is located on
the rear exterior.
CX-JV4
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
7
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
9
3-2. Case (SIDE-L/R) ............................................................. 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74B-30BD61S) ................. 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43FR16) .................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. PT Board, MAIN Board .................................................. 13
3-10. Table Assy ....................................................................... 14
3-11. MOTOR (TB) Board ....................................................... 14
3-12. MOTOR (LD) Board ....................................................... 15
3-13. Base Unit (BU-30BD61S) .............................................. 15
3-14. BD Board ......................................................................... 16
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74B-30BD61S) ................. 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43FR16) .................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. PT Board, MAIN Board .................................................. 13
3-10. Table Assy ....................................................................... 14
3-11. MOTOR (TB) Board ....................................................... 14
3-12. MOTOR (LD) Board ....................................................... 15
3-13. Base Unit (BU-30BD61S) .............................................. 15
3-14. BD Board ......................................................................... 16
4.
TEST MODE
.............................................................. 17
5.
ELECTRICAL ADJUSTMENTS
CD Section ...................................................................... 18
6.
DIAGRAMS
6-1. Block Diagram – CD SERVO Section – ....................... 21
6-2. Block Diagram – AUDIO/VIDEO Section – ................ 22
6-3. Block Diagram – TUNER/TAPE/PANEL Section – ..... 23
6-4. Block Diagram – AMP/POWER SUPPLY Section – ... 24
6-5. Note for Printed Wiring Boards and
6-2. Block Diagram – AUDIO/VIDEO Section – ................ 22
6-3. Block Diagram – TUNER/TAPE/PANEL Section – ..... 23
6-4. Block Diagram – AMP/POWER SUPPLY Section – ... 24
6-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
6-6. Printed Wiring Board – BD Section – ........................... 26
6-7. Schematic Diagram – BD Section – .............................. 27
6-8. Printed Wiring Boards – CHANGER Section – ............ 28
6-9. Schematic Diagram – CHANGER Section – ................ 29
6-10. Schematic Diagram – VMP Section (1/2) – .................. 30
6-11. Schematic Diagram – VMP Section (2/2) – .................. 31
6-12. Printed Wiring Board – VMP Section – ........................ 32
6-13. Printed Wiring Boards – MAIN Section – .................... 33
6-14. Schematic Diagram – MAIN Section (1/4) – ................ 34
6-15. Schematic Diagram – MAIN Section (2/4) – ................ 35
6-16. Schematic Diagram – MAIN Section (3/4) – ................ 36
6-17. Schematic Diagram – MAIN Section (4/4) – ................ 37
6-18. Printed Wiring Boards – VF/HP Section – .................... 38
6-19. Schematic Diagram – VF/HP Section – ........................ 39
6-20. Printed Wiring Board – PANEL Section – .................... 40
6-21. Schematic Diagram – PANEL Section – ....................... 41
6-22. Printed Wiring Boards – KEY Section – ....................... 42
6-23. Schematic Diagram – KEY Section – ........................... 43
6-24. Printed Wiring Board – PT Section – ............................ 44
6-25. Schematic Diagram – PT Section – ............................... 45
6-26. IC Pin Function Description ........................................... 52
6-7. Schematic Diagram – BD Section – .............................. 27
6-8. Printed Wiring Boards – CHANGER Section – ............ 28
6-9. Schematic Diagram – CHANGER Section – ................ 29
6-10. Schematic Diagram – VMP Section (1/2) – .................. 30
6-11. Schematic Diagram – VMP Section (2/2) – .................. 31
6-12. Printed Wiring Board – VMP Section – ........................ 32
6-13. Printed Wiring Boards – MAIN Section – .................... 33
6-14. Schematic Diagram – MAIN Section (1/4) – ................ 34
6-15. Schematic Diagram – MAIN Section (2/4) – ................ 35
6-16. Schematic Diagram – MAIN Section (3/4) – ................ 36
6-17. Schematic Diagram – MAIN Section (4/4) – ................ 37
6-18. Printed Wiring Boards – VF/HP Section – .................... 38
6-19. Schematic Diagram – VF/HP Section – ........................ 39
6-20. Printed Wiring Board – PANEL Section – .................... 40
6-21. Schematic Diagram – PANEL Section – ....................... 41
6-22. Printed Wiring Boards – KEY Section – ....................... 42
6-23. Schematic Diagram – KEY Section – ........................... 43
6-24. Printed Wiring Board – PT Section – ............................ 44
6-25. Schematic Diagram – PT Section – ............................... 45
6-26. IC Pin Function Description ........................................... 52
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 60
7-2. Front Panel Section-1 ...................................................... 61
7-3. Front Panel Section-2 ...................................................... 62
7-4. Front Panel Section-3 ...................................................... 63
7-5. Front Panel Section-4 ...................................................... 64
7-6. Chassis Section ............................................................... 65
7-7. CD Mechanism Deck Section-1 (CDM74-30BD61S) ... 66
7-8. CD Mechanism Deck Section-2 (CDM74-30BD61S) ... 67
7-9. CD Mechanism Deck Section-3 (CDM74-30BD61S) ... 68
7-10. Base Unit Section (BU-30BD61S) ................................. 69
7-2. Front Panel Section-1 ...................................................... 61
7-3. Front Panel Section-2 ...................................................... 62
7-4. Front Panel Section-3 ...................................................... 63
7-5. Front Panel Section-4 ...................................................... 64
7-6. Chassis Section ............................................................... 65
7-7. CD Mechanism Deck Section-1 (CDM74-30BD61S) ... 66
7-8. CD Mechanism Deck Section-2 (CDM74-30BD61S) ... 67
7-9. CD Mechanism Deck Section-3 (CDM74-30BD61S) ... 68
7-10. Base Unit Section (BU-30BD61S) ................................. 69
8.
ELECTRICAL PARTS LIST
............................... 70
4
CX-JV4
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Releasing Procedure :
While pressing the
While pressing the
x
key, press the
Z
OPEN/CLOSE
key for 5
seconds. The message “UNLOCKED” is displayed and the tray is
unlocked.
unlocked.
Note:
When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the
turning power on/off with the
[POWER]
key.
