Sony CX-JTV8 / JAX-TV8 Service Manual ▷ View online
CX-JTV8
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASER LAITE
KLASS 1 LASER APPARA
T
This appliance is classified
as a CLASS 1 LASER
product.
as a CLASS 1 LASER
product.
This label is located on the
rear exterior.
rear exterior.
The following caution label is located inside the apparatus.
CX-JTV8
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
7
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
9
3-2. Case (SIDE-L/R) ............................................................. 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74F-30BD62) .................... 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43RR23) ................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. Main Board ...................................................................... 13
3-10. Power Board .................................................................... 14
3-11. Transformer Board .......................................................... 14
3-12 Table Assy ....................................................................... 15
3-13. Motor (TB) Board ........................................................... 15
3-14. Motor (LD) Board ........................................................... 16
3-15. Base Unit (BU-30BD62) ................................................ 16
3-16. BD Board ......................................................................... 17
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74F-30BD62) .................... 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43RR23) ................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. Main Board ...................................................................... 13
3-10. Power Board .................................................................... 14
3-11. Transformer Board .......................................................... 14
3-12 Table Assy ....................................................................... 15
3-13. Motor (TB) Board ........................................................... 15
3-14. Motor (LD) Board ........................................................... 16
3-15. Base Unit (BU-30BD62) ................................................ 16
3-16. BD Board ......................................................................... 17
4.
TEST MODE
.............................................................. 18
5.
ELECTRICAL ADJUSTMENTS
CD Section ...................................................................... 21
VIDEO Section ............................................................... 22
VIDEO Section ............................................................... 22
6.
DIAGRAMS
6-1. Block Diagram – CD SERVO Section – ....................... 23
6-2. Block Diagram – AUDIO/VIDEO CD Section – .......... 24
6-3. Block Diagram – TUNER/TAPE/PANEL Section – ..... 25
6-4. Block Diagram – AMP/POWER SUPPLY Section – ... 26
6-5. Note for Printed Wiring Boards and
6-2. Block Diagram – AUDIO/VIDEO CD Section – .......... 24
6-3. Block Diagram – TUNER/TAPE/PANEL Section – ..... 25
6-4. Block Diagram – AMP/POWER SUPPLY Section – ... 26
6-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 27
6-6. Printed Wiring Board – BD Board – ............................. 28
6-7. Schematic Diagram – BD Board – ................................ 29
6-8. Printed Wiring Boards – CHANGER Section – ............ 30
6-9. Schematic Diagram – CHANGER Section – ................ 31
6-10. Schematic Diagram – VMP42DN Board (1/2) – .......... 32
6-11. Schematic Diagram – VMP42DN Board (2/2) – .......... 33
6-12. Printed Wiring Board – VMP42DN Board – ................ 34
6-13. Printed Wiring Board – MAIN Board – ........................ 35
6-14. Schematic Diagram – MAIN Board (1/4) – .................. 36
6-15. Schematic Diagram – MAIN Board (2/4) – .................. 37
6-16. Schematic Diagram – MAIN Board (3/4) – .................. 38
6-17. Schematic Diagram – MAIN Board (4/4) – .................. 39
6-18. Printed Wiring Board – Power Board – ......................... 41
6-19. Schematic Diagram – Power Board (1/2) – ................... 42
6-20. Schematic Diagram – Power Board (2/2) – ................... 43
6-21. Printed Wiring Boards
6-7. Schematic Diagram – BD Board – ................................ 29
6-8. Printed Wiring Boards – CHANGER Section – ............ 30
6-9. Schematic Diagram – CHANGER Section – ................ 31
6-10. Schematic Diagram – VMP42DN Board (1/2) – .......... 32
6-11. Schematic Diagram – VMP42DN Board (2/2) – .......... 33
6-12. Printed Wiring Board – VMP42DN Board – ................ 34
6-13. Printed Wiring Board – MAIN Board – ........................ 35
6-14. Schematic Diagram – MAIN Board (1/4) – .................. 36
6-15. Schematic Diagram – MAIN Board (2/4) – .................. 37
6-16. Schematic Diagram – MAIN Board (3/4) – .................. 38
6-17. Schematic Diagram – MAIN Board (4/4) – .................. 39
6-18. Printed Wiring Board – Power Board – ......................... 41
6-19. Schematic Diagram – Power Board (1/2) – ................... 42
6-20. Schematic Diagram – Power Board (2/2) – ................... 43
6-21. Printed Wiring Boards
– CD BUTTON/HEADPHONE/
MICROPHONE/VIDEO OUT Boards – ........................ 44
MICROPHONE/VIDEO OUT Boards – ........................ 44
6-22. Schematic Diagram
– CD BUTTON/HEADPHONE/
MICROPHONE/VIDEO OUT Boards – ........................ 45
MICROPHONE/VIDEO OUT Boards – ........................ 45
6-23. Printed Wiring Board – PANEL Board – ...................... 46
6-24. Schematic Diagram – PANEL Board – ......................... 47
6-25. Printed Wiring Board
6-24. Schematic Diagram – PANEL Board – ......................... 47
6-25. Printed Wiring Board
– TRANSFORMER Board – .......................................... 48
6-26. Schematic Diagram
– TRANSFORMER Board – ......................................... 49
6-27. IC Pin Function Description ........................................... 53
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 63
7-2. Front Panel Section-1 ...................................................... 64
7-3. Front Panel Section-2 ...................................................... 65
7-4. Front Panel Section-3 ...................................................... 66
7-5. Front Panel Section-4 ...................................................... 67
7-6. Chassis Section-1 ............................................................ 68
7-7. Chassis Section-2 ............................................................ 69
7-8. CD Mechanism Deck Section-1
7-2. Front Panel Section-1 ...................................................... 64
7-3. Front Panel Section-2 ...................................................... 65
7-4. Front Panel Section-3 ...................................................... 66
7-5. Front Panel Section-4 ...................................................... 67
7-6. Chassis Section-1 ............................................................ 68
7-7. Chassis Section-2 ............................................................ 69
7-8. CD Mechanism Deck Section-1
(CDM74F-K6BD71A) .................................................... 70
7-9. CD Mechanism Deck Section-2
(CDM74F-K6BD71A) .................................................... 71
7-10. CD Mechanism Deck Section-3
(CDM74F-K6BD71A) .................................................... 72
7-11. Base Unit Section (BU-30BD62) ................................... 73
8.
ELECTRICAL PARTS LIST
............................... 74
4
CX-JTV8
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
Singapore and Malaysia models
4-247-552-0
[]
Saudi Arabia model
4-249-062-0
[]
E model
4-250-476-0
[]
PART No.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Releasing Procedure :
While pressing the
While pressing the
x
key, press the
Z
key for 5 seconds. The
message “UNLOCKED” is displayed and the tray is unlocked.
Note:
When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the
turning power on/off with the
[POWER]
key.
Ver 1.2
5
CX-JTV8
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH TURNS OFF.
2
Turn the loading gear
in the direction of arrow
in the direction of arrow
A
.
1
Remove the case (side-L).
A
3
Pull-out the disc tray.