CX-JTV8, JAX-TV8 — Sony Audio Service Manual (repair manual)

Model
CX-JTV8 JAX-TV8
Pages
90
Size
7.26 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cx-jtv8-jax-tv8.pdf
Date

View Sony CX-JTV8 / JAX-TV8 Service Manual online

SERVICE MANUAL
COMPACT DISC DECK RECEIVER
E Model
CX-JTV8
Ver. 1.4  2005.05
9-877-421-05
Sony Corporation
2005E05-1
Personal Audio Group
© 2005.05
Published by Sony Engineering Corporation
SPECIFICATIONS
CX-JTV8 is the tuner, amplifier, cassette deck and
CD player section in JAX-TV8
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM74F-30BD62
Section
Base Unit Name
BU-30BD62
Optical Pick-up Name
OP Assy (A-MAX.3)
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
CWM43RR23
TUNER
FM tuning range
87.5 MHz to 108 MHz
FM usable sensitivity (IHF)
13.2 dBf
FM antenna terminal
75 ohms (unbalanced)
AM tuning range
 Middle Eastern model:
531 kHz to 1602 kHz (9 kHz step)
 Other models:
530 kHz to 1710 kHz (10 kHz step)
531 kHz to 1602 kHz (9 kHz step)
AM usable sensitivity
350 µV/m
AM antenna
Loop antenna
AMPLIFIER
Power output
Front:
Rated: 144 W + 144 W (6 ohms,
T.H.D. 1 %, 1 kHz)
Reference: 180 W + 180 W (6 ohms,
T.H.D. 10 %, 1 kHz)
Front and Surround:
250 W + 110 W (Front Speaker: 6
ohms, Surround Speaker: 8 ohms,
T.H.D. 10 %, 1 kHz/DIN AUDIO)
Total harmonic distortion
0.08 % (88 W, 1 kHz, 6 ohms, DIN
AUDIO)
Input
MD (VIDEO): 1.5 V
MIC: 1 mV
CASSETTE DECK
Track format
4 tracks, 2 channels stereo
Frequency response
50 Hz – 8 kHz
Recording system
AC bias
Heads
Deck A: playback x 1
Deck B: recording/playback x 1,
erase x 1
CD PLAYER
Laser
Semiconductor laser
(
λ = 780 nm)
Emission duration:
continuous
D/A converter
1 bit dual
Signal-to-noise ratio
85 dB (1 kHz, 0 dB)
Harmonic distortion
0.05 % (1 kHz, 0 dB)
Video color system format
NTSC, PAL
Specifications and external appearance are subject to change
without notice.
COPYRIGHT
Check copyright laws relevant to recordings from discs, tuner
or tape for the country where the unit is to be used.
Licensed by BBE Sound, Inc. under USP4638258, 5510752
and 5736897.
Outputs
FRONT SPEAKER: 6 ohms or more
SURROUND SPEAKER: 8 ohms or
more
MD (VIDEO) (for audio): 500 mV
VIDEO (for video): 1 Vp-p
PHONES: 32 ohms or more
GENERAL
Power requirements
 Saudi Arabian model:
120-127 V/220 V AC (Switchable),
50 Hz/60 Hz
,
 Other models:
110-120 V/220-240 V or 120-127
V/220 V AC (Switchable), 50 Hz/
60 Hz
Power consumption
210 W
Power consumption
With ECO mode on: 0.25 W
  in standby mode
With ECO mode off: 25 W
Dimensions (W x H x D)
280 x 328 x 437 mm
Weight
10.5 kg
CX-JTV8
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASER LAITE
KLASS 1 LASER APPARA
T
This appliance is classified
as a CLASS 1 LASER
product.
This label is located on the
rear exterior.
The following caution label is located inside the apparatus.
CX-JTV8
3
TABLE  OF  CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
7
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
9
3-2. Case (SIDE-L/R) ............................................................. 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74F-30BD62) .................... 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43RR23) ................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. Main Board ...................................................................... 13
3-10. Power Board .................................................................... 14
3-11. Transformer Board .......................................................... 14
3-12 Table Assy ....................................................................... 15
3-13. Motor (TB) Board ........................................................... 15
3-14. Motor (LD) Board ........................................................... 16
3-15. Base Unit (BU-30BD62) ................................................ 16
3-16. BD Board ......................................................................... 17
4.
TEST  MODE
.............................................................. 18
5.
ELECTRICAL  ADJUSTMENTS
CD Section ...................................................................... 21
VIDEO Section ............................................................... 22
6.
DIAGRAMS
6-1. Block Diagram  – CD SERVO Section – ....................... 23
6-2. Block Diagram  – AUDIO/VIDEO CD Section – .......... 24
6-3. Block Diagram  – TUNER/TAPE/PANEL Section – ..... 25
6-4. Block Diagram  – AMP/POWER SUPPLY Section – ... 26
6-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 27
6-6. Printed Wiring Board  – BD Board – ............................. 28
6-7. Schematic Diagram  – BD Board – ................................ 29
6-8. Printed Wiring Boards  – CHANGER Section – ............ 30
6-9. Schematic Diagram  – CHANGER Section – ................ 31
6-10. Schematic Diagram  – VMP42DN Board (1/2) – .......... 32
6-11. Schematic Diagram  – VMP42DN Board (2/2) – .......... 33
6-12. Printed Wiring Board  – VMP42DN Board – ................ 34
6-13. Printed Wiring Board  – MAIN Board – ........................ 35
6-14. Schematic Diagram  – MAIN Board (1/4) – .................. 36
6-15. Schematic Diagram  – MAIN Board (2/4) – .................. 37
6-16. Schematic Diagram  – MAIN Board (3/4) – .................. 38
6-17. Schematic Diagram  – MAIN Board (4/4) – .................. 39
6-18. Printed Wiring Board  – Power Board – ......................... 41
6-19. Schematic Diagram  – Power Board (1/2) – ................... 42
6-20. Schematic Diagram  – Power Board (2/2) – ................... 43
6-21. Printed Wiring Boards
– CD BUTTON/HEADPHONE/
MICROPHONE/VIDEO OUT Boards – ........................ 44
6-22. Schematic Diagram
– CD BUTTON/HEADPHONE/
MICROPHONE/VIDEO OUT Boards – ........................ 45
6-23. Printed Wiring Board  – PANEL Board – ...................... 46
6-24. Schematic Diagram  – PANEL Board – ......................... 47
6-25. Printed Wiring Board
– TRANSFORMER Board – .......................................... 48
6-26. Schematic Diagram
 – TRANSFORMER Board – ......................................... 49
6-27. IC Pin Function Description ........................................... 53
7.
EXPLODED  VIEWS
7-1. Case Section .................................................................... 63
7-2. Front Panel Section-1 ...................................................... 64
7-3. Front Panel Section-2 ...................................................... 65
7-4. Front Panel Section-3 ...................................................... 66
7-5. Front Panel Section-4 ...................................................... 67
7-6. Chassis Section-1 ............................................................ 68
7-7. Chassis Section-2 ............................................................ 69
7-8. CD Mechanism Deck Section-1
(CDM74F-K6BD71A) .................................................... 70
7-9. CD Mechanism Deck Section-2
(CDM74F-K6BD71A) .................................................... 71
7-10. CD Mechanism Deck Section-3
(CDM74F-K6BD71A) .................................................... 72
7-11. Base Unit Section (BU-30BD62) ................................... 73
8.
ELECTRICAL  PARTS  LIST
............................... 74
4
CX-JTV8
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
• MODEL  IDENTIFICATION
– Back Panel –
MODEL
PART No.
Singapore and Malaysia models
4-247-552-0
[]
Saudi Arabia model
4-249-062-0
[]
E model
4-250-476-0
[]
PART No.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure :
While pressing the
x
key,  press the
Z
key for 5 seconds. The
message “UNLOCKED” is displayed and the tray is unlocked.
Note:
When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the 
[POWER]
 key.
Ver 1.2
Page of 90
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Here you can view online or download Sony CX-JTV8 / JAX-TV8 Service Manual in pdf. This Service Manual can help you recover, restore, fix, disassemble and repair Sony CX-JTV8 / JAX-TV8 Audio. Information contained in Sony CX-JTV8 / JAX-TV8 service manual (repair manual) typically includes:

  • Disassembly, troubleshooting, programming, maintenance, remote, adjustment, installation and setup instructions.
  • Schematics, wiring and block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).