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• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 °C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.

0

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This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 

°C.

Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

Power requirements
European and Russian models:

230 V AC, 50/60 Hz

Mexican models:

127 V AC, 60 Hz

Other models:

120 V, 220 V or 
230 – 240 V AC, 50/60 Hz
Adjustable with voltage 
selector

Power consumption
European and Russian models:

180 watts
0.25 watts (at the Power 
Saving Mode)

Other models:

170 watts

Dimensions (w/h/d) incl. projecting parts and controls 
Amplifier/Tuner/Tape/CD section:

Approx. 280 

× 325 ×

425 mm

Mass Approx. 

9.9 

kg

Design and specifications are subject to change 
without notice.

3

................................................

4

Location of Controls .......................................................

7

3-1. Disassembly Flow ...........................................................

9

3-2. Case (Side-L/R) ............................................................... 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74-F1BD81) ...................... 11
3-6. Front Panel Block ............................................................ 12
3-7. Back Panel Section .......................................................... 12
3-8. MAIN Board ................................................................... 13
3-9. Tape Mechanism Deck (CWM43FR34) ......................... 13
3-10. Table Assy ....................................................................... 14
3-11. MOTOR (TB) Board ....................................................... 14
3-12. MOTOR (LD) Board ....................................................... 15
3-13. Base Unit (BU-F1BD81A) ............................................. 15
3-14. CD Board ......................................................................... 16

.............................................................. 17

CD Section ...................................................................... 21

6-1. Block Diagram  – SERVO Section – .............................. 22
6-2. Block Diagram  – MAIN Section – ................................ 23
6-3. Block Diagram

– PANEL/POWER SUPPLY Section – .......................... 24

6-4. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 25

6-5. Printed Wiring Board  – CD Board – ............................. 26
6-6. Schematic Diagram  – CD Board – ................................ 27
6-7. Printed Wiring Boards  – CHANGER Section – ............ 28
6-8. Schematic Diagram  – CHANGER Section – ................ 29
6-9. Printed Wiring Boards

– CDMP3 CONNECT/TRANSLATION Boards – ........ 30

6-10. Schematic Diagram

– CDMP3 CONNECT/TRANSLATION Boards – ........ 31

6-11. Schematic Diagram  – MAIN Section (1/4) – ................ 32
6-12. Schematic Diagram  – MAIN Section (2/4) – ................ 33
6-13. Schematic Diagram  – MAIN Section (3/4) – ................ 34
6-14. Schematic Diagram  – MAIN Section (4/4) – ................ 35
6-15. Printed Wiring Boards  – MAIN Section – .................... 36
6-16. Printed Wiring Board  – PANEL Section – .................... 37
6-17. Schematic Diagram  – PANEL Section (1/2) – .............. 38
6-18. Schematic Diagram  – PANEL Section (2/2) – .............. 39
6-19. Printed Wiring Board  – POWER AMP Section –

(AEP, UK, CIS only) ....................................................... 40

6-20. Schematic Diagram  – POWER AMP Section –

(AEP, UK, CIS only) ....................................................... 41

6-21. Printed Wiring Board  – POWER AMP Section –

(E51, MX only) ............................................................... 42

6-22. Schematic Diagram  – POWER AMP Section –

(E51, MX only) ............................................................... 43

6-23. Printed Wiring Boards  – TRANS Section –

(AEP, UK, CIS only) ....................................................... 44

6-24. Schematic Diagram  – TRANS Section –

(AEP, UK, CIS only) ....................................................... 45

6-25. Printed Wiring Boards  – TRANS Section –

(E51, MX only) ............................................................... 46

6-26. Schematic Diagram  – TRANS Section –

(E51, MX only) ............................................................... 47

7-1. Case Section .................................................................... 58
7-2. Tape Mechanism Deck Section (CWM43FR34) ............ 59
7-3. Cassette Box Section ...................................................... 60
7-4. Front Panel Section ......................................................... 61
7-5. Back Panel Section .......................................................... 62
7-6. Chassis Section ............................................................... 63
7-7. CD Mechanism Deck Section-1 (CDM74-F1BD81) ..... 64
7-8. CD Mechanism Deck Section-2 (CDM74-F1BD81) ..... 65
7-9. CD Mechanism Deck Section-3 (CDM74-F1BD81) ..... 66
7-10. Base Unit Section (BU-F1BD81A) ................................ 67

............................... 68

• Abbreviation

E51

: Chilean and Peruvian models

MX

: Mexican model

4

R

L

R

L

PART No.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.

•

MODEL

PART No.

AEP, UK models

4-253-949-0

[]

CIS model

4-253-950-0

[]

Chilean and Peruvian models

4-253-951-0

[]

Mexican model

4-255-500-0

[]

5

1

Remove the case (side-L).

2

Turn the loading gear in the direction 
of arrow 

A

.

A

3

Pull-out the disc tray.

CD mechanism deck

stand

CDMP3 CONNECT board