Sony CX-JN331 / CX-JPK331 / JAX-N331 Service Manual ▷ View online
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
E Model
SPECIFICATIONS
CX-JN331/JPK331
Ver. 1.0 2005.05
Model Name Using Similar Mechanism
CX-JN33/JPK33
CD
CD Mechanism Type
CDM74KS-F1BD81C
Section
Base Unit Name
BU-F1BD81C
Optical Pick-up Name
KSM-215DCP
Tape deck
Model Name Using Similar Mechanism
CX-JN33/JPK33
Tape Transport Mechanism Type
CWM43FF13 (JPK331)
Section
CWM43FR34 (JN331)
9-879-731-01
2005E05-1
© 2005.05
© 2005.05
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
– Continued on next page –
CX-JN331 is the amplifier, CD player, tape deck
and tuner section in JAX-N331.
CX-JPK331 is the amplifier, CD player, tape deck
and tuner section in JAX-PK331.
and tuner section in JAX-N331.
CX-JPK331 is the amplifier, CD player, tape deck
and tuner section in JAX-PK331.
CX-JN331
The following measured at AC 120, 127, 220, 240 V
50/60 Hz
DIN power output (rated): 48 + 48 watts (6 ohms at
50/60 Hz
DIN power output (rated): 48 + 48 watts (6 ohms at
1 kHz, DIN)
Continuous RMS power output (reference):
60 + 60 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
CX-JPK331
The following measured at AC 120, 127, 220, 240 V
50/60 Hz
DIN power output (rated): 48 + 48 watts (6 ohms at
50/60 Hz
DIN power output (rated): 48 + 48 watts (6 ohms at
1 kHz, DIN)
Continuous RMS power output (reference):
60 + 60 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
Inputs
VIDEO/MD IN (phono jacks):
VIDEO/MD IN (phono jacks):
voltage 450/250 mV,
impedance 47 kilohms
impedance 47 kilohms
MIC (phone jack)
chilean and peruvian model
sensitivity 1 mV,
impedance 10 kilohms
impedance 10 kilohms
Amplifier section
Outputs
PHONES (stereo mini jack):
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
8 ohms or more
SPEAKER:
accepts impedance of 6 to
16 ohms
16 ohms
CD player section
System
Compact disc and digital
audio system
audio system
Laser Diode Properties
Emission duration:
continuous
Laser Output: Less than
44.6
continuous
Laser Output: Less than
44.6
µW
(This output is the value
measurement at a distance
of 200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture)
measurement at a distance
of 200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture)
Frequency response
2 Hz
− 20 kHz (±0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Tape deck section
Recording system
4-track 2-channel, stereo
Frequency response
50
− 13,000 Hz (±3 dB),
using Sony TYPE I
cassettes
cassettes
Wow and flutter
±0.15% W. Peak (IEC)
0.1% W. RM S (NAB)
±0.2% W. Peak (DIN)
0.1% W. RM S (NAB)
±0.2% W. Peak (DIN)
AM tuner section
Tuning range
2 Band type:
2 Band type:
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5
− 108.0 MHz
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
530
− 1,710 kHz
(with the tuning interval
set at 10 kHz)
531
set at 10 kHz)
531
− 1,602 kHz
(with the tuning interval
set at 9 kHz)
set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
2
CX-JN331/JPK331
General
Power requirements
Mexican models:
Mexican models:
127 V AC, 60 Hz
Other models:
120 V, 22 0 V or
230
230
− 240 V AC, 50/60 Hz
Adjustable with voltage
selector
110 watts
selector
110 watts
Dimensions (w/h/d) incl. projecting parts and controls
Amplifier/Tuner/Tape /CD section:
Amplifier/Tuner/Tape /CD section:
Approx. 280
× 325 ×
425 mm
Power consumption
Mass
Approx. 8.3 kg
Design and specifications are subject to change
without notice.
without notice.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
This appliance is classified as a CLASS 1
LASER product.
This label is located on the rear exterior.
LASER product.
This label is located on the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
3
CX-JN331/JPK331
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
4
2.
GENERAL
...................................................................
7
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
9
3-2.
Case (Side-L/R) ............................................................... 10
3-3.
Case (Top) ....................................................................... 10
3-4.
Tray Panel ........................................................................ 11
3-5.
CD Mechanism Deck (CDM74KS-F1BD81C) ............... 11
3-6.
Front Pack Block ............................................................. 12
3-7.
Back Panel Section ......................................................... 12
3-8.
MAIN Board .................................................................... 13
3-9.
Tape Mechanism Deck
(CWM43FF13: JPK331)/(CWM43FR34: JN331) .......... 13
(CWM43FF13: JPK331)/(CWM43FR34: JN331) .......... 13
3-10. Table Assy ....................................................................... 14
3-11 MOTOR (TB) Board ...................................................... 14
3-12 MOTOR (LD) Board ...................................................... 15
3-13 Base Unit (BU-F1BD81C) .............................................. 15
3-14 Motor Gear Assy (Sled) (M102), CD BOARD ............. 16
3-15 Optical Pick-up (KSM-215DCP) .................................... 16
3-11 MOTOR (TB) Board ...................................................... 14
3-12 MOTOR (LD) Board ...................................................... 15
3-13 Base Unit (BU-F1BD81C) .............................................. 15
3-14 Motor Gear Assy (Sled) (M102), CD BOARD ............. 16
3-15 Optical Pick-up (KSM-215DCP) .................................... 16
4.
TEST MODE
.............................................................. 17
5.
MECHANICAL ADJUSTMENTS
....................... 21
6.
ELECTRICAL ADJUSTMENTS
......................... 21
7.
DIAGRAMS
7-1.
Block Diagram
−
SERVO Section
−
.............................. 24
7-2.
Block Diagram
−
MAIN Section
−
................................ 25
7-3.
Block Diagram
−
PANEL/POWER SUPPLY Section
−
........................... 26
7-4.
Printed Wiring Board
−
CD Board
−
............................. 28
7-5.
Schematic Diagram
−
CD Board
−
................................. 29
7-6.
Printed Wiring Boards
−
CHANGER Section
−
........... 30
7-7.
Schematic Diagram
−
CHANGER Section
−
................. 31
7-8.
Printed Wiring Board
−
CDMP3 CONNECT Board
−
....................................... 32
7-9.
Schematic Diagram
−
CDMP3 CONNECT Board
−
....................................... 33
7-10. Schematic Diagram
−
MAIN Section (1/4)
−
................ 34
7-11. Schematic Diagram
−
MAIN Section (2/4)
− ................
35
7-12. Schematic Diagram
−
MAIN Section (3/4)
− ................
36
7-13. Schematic Diagram
−
MAIN Section (4/4)
− ................
37
7-14. Printed Wiring Boards
−
MAIN Section
− .....................
38
7-15. Printed Wiring Boards
−
PANEL Section
− ...................
39
7-16. Schematic Diagram
−
PANEL Section (1/2)
− ...............
40
7-17. Schematic Diagram
−
PANEL Section (2/2)
− ...............
41
7-18. Printed Wiring Board
−
POWER AMP Section
− ..........
42
7-19. Schematic Diagram
−
POWER AMP Section
− .............
43
7-20. Printed Wiring Boards
−
TRANS Section
− ...................
44
7-21. Schematic Diagram
−
TRANS Section
− .......................
45
8.
EXPLODED VIEWS
8-1.
Case Section .................................................................... 56
8-2.
Tape Mechanism Deck Section
(CWM43FF13: JPK331)/(CWM43FR34: JN331) .......... 57
(CWM43FF13: JPK331)/(CWM43FR34: JN331) .......... 57
8-3.
Panel Board Section ........................................................ 58
8-4.
Cassette Box Section ....................................................... 59
8-5.
Front Panel Section ......................................................... 60
8-6.
Back Panel Section .......................................................... 61
8-7.
Chassis Section ................................................................ 62
8-8.
CD Mechanism deck Section-1
(CDM74KS-F1BD81C) .................................................. 63
(CDM74KS-F1BD81C) .................................................. 63
8-9.
CD Mechanism deck Section-2
(CDM74KS-F1BD81C) .................................................. 64
(CDM74KS-F1BD81C) .................................................. 64
8-10. CD Mechanism deck Section-3
(CDM74KS-F1BD81C) .................................................. 65
8-11. Base Unit (BU-F1BD81C) .............................................. 66
9.
ELECTRICAL PARTS LIST
................................ 67
4
CX-JN331/JPK331
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
MODEL
PART No.
CX-JPK331: Mexican model
4-252-231-2[]
CX-JN331/JPK331: Chilean and Peruvian models
4-252-231-3[]
•
MODEL IDENTIFICATION
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–
+
R
L
R
L
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– Rear View –
PART No.
