Sony CX-JN101 / JAX-N101 Service Manual ▷ View online
CX-JN101
2
This appliance is classified
as a CLASS 1 LASER
product.
as a CLASS 1 LASER
product.
This label is located on the
rear exterior.
rear exterior.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASER LAITE
KLASS 1 LASER APPARAT
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CX-JN101
3
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
4
2.
GENERAL
...................................................................
7
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
9
3-2. Case (Side-L/R) ............................................................... 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74KS-K6BD72) ................ 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43FF13) .................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. PT Board, MAIN Board .................................................. 13
3-10. Table Assy ....................................................................... 14
3-11. MOTOR (TB) Board ....................................................... 14
3-12. MOTOR (LD) Board ....................................................... 15
3-13. Base Unit (BU-K6BD72) ................................................ 15
3-14. Motor Gear Assy (SLED) (M701), BD Board ............... 16
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74KS-K6BD72) ................ 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43FF13) .................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. PT Board, MAIN Board .................................................. 13
3-10. Table Assy ....................................................................... 14
3-11. MOTOR (TB) Board ....................................................... 14
3-12. MOTOR (LD) Board ....................................................... 15
3-13. Base Unit (BU-K6BD72) ................................................ 15
3-14. Motor Gear Assy (SLED) (M701), BD Board ............... 16
4.
TEST MODE
.............................................................. 17
5.
MECHANICAL ADJUSTMENTS
....................... 19
6.
ELECTRICAL ADJUSTMENTS
......................... 20
7.
DIAGRAMS
7-1. Block Diagram – CD Section – ...................................... 22
7-2. Block Diagram – TUNER/TAPE/PANEL Section – ...... 23
7-3. Block Diagram – AMP/POWER SUPPLY Section – .... 24
7-4. Printed Wiring Board – BD Section – ............................ 26
7-5. Schematic Diagram – BD Section – ............................... 27
7-6. Printed Wiring Boards – CHANGER Section – ............. 28
7-7. Schematic Diagram – CHANGER Section – ................. 29
7-8. Schematic Diagram – MAIN Section (1/4) – ................. 30
7-2. Block Diagram – TUNER/TAPE/PANEL Section – ...... 23
7-3. Block Diagram – AMP/POWER SUPPLY Section – .... 24
7-4. Printed Wiring Board – BD Section – ............................ 26
7-5. Schematic Diagram – BD Section – ............................... 27
7-6. Printed Wiring Boards – CHANGER Section – ............. 28
7-7. Schematic Diagram – CHANGER Section – ................. 29
7-8. Schematic Diagram – MAIN Section (1/4) – ................. 30
7-9. Schematic Diagram – MAIN Section (2/4) – ................. 31
7-10. Schematic Diagram – MAIN Section (3/4) – ................. 32
7-11. Schematic Diagram – MAIN Section (4/4) – ................. 33
7-12. Printed Wiring Board – MAIN Section – ....................... 34
7-13. Printed Wiring Board – HP Section – ............................. 35
7-14. Schematic Diagram – HP Section – ............................... 35
7-15. Printed Wiring Board – PANEL Section – ..................... 36
7-16. Schematic Diagram – PANEL section – ......................... 37
7-17. Printed Wiring Boards – KEY Section – ........................ 38
7-18. Schematic Diagram – KEY Section – ............................ 39
7-19. Printed Wiring Board
7-10. Schematic Diagram – MAIN Section (3/4) – ................. 32
7-11. Schematic Diagram – MAIN Section (4/4) – ................. 33
7-12. Printed Wiring Board – MAIN Section – ....................... 34
7-13. Printed Wiring Board – HP Section – ............................. 35
7-14. Schematic Diagram – HP Section – ............................... 35
7-15. Printed Wiring Board – PANEL Section – ..................... 36
7-16. Schematic Diagram – PANEL section – ......................... 37
7-17. Printed Wiring Boards – KEY Section – ........................ 38
7-18. Schematic Diagram – KEY Section – ............................ 39
7-19. Printed Wiring Board
– PT Section (Australian Model) – ................................. 40
7-20. Schematic Diagram
– PT Section (Australian Model) – ................................. 41
7-21. Printed Wiring Boards
– PT Section (E, Singapore Model) – ............................. 42
7-22. Schematic Diagram
– PT Section (E, Singapore Model) – ............................. 43
8.
EXPLODED VIEWS
8-1. Case Section .................................................................... 49
8-2. Tape Deck Section .......................................................... 50
8-3. PANEL Board Section .................................................... 51
8-4. KEY Section .................................................................... 52
8-5. Front Cabinet Section ..................................................... 53
8-6. Chassis Section ............................................................... 54
8-7. CD Mechanism Deck Section-1
8-2. Tape Deck Section .......................................................... 50
8-3. PANEL Board Section .................................................... 51
8-4. KEY Section .................................................................... 52
8-5. Front Cabinet Section ..................................................... 53
8-6. Chassis Section ............................................................... 54
8-7. CD Mechanism Deck Section-1
(CDM74KS-K6BD72) .................................................... 55
8-8. CD Mechanism Deck Section-2
(CDM74KS-K6BD72) .................................................... 56
8-9. CD Mechanism Deck Section-3
(CDM74KS-K6BD72) .................................................... 57
8-10. Base Unit Section (BU-K6BD72) .................................. 58
9.
ELECTRICAL PARTS LIST
................................ 59
4
CX-JN101
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
Australian model
2-595-963-0[]
E model
2-595-967-0[]
Singapore model
2-595-968-0[]
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Releasing Procedure :
While pressing the
While pressing the
x
key, press the
OPEN/CLOSE
Z
key for 5
seconds. The message “UNLOCKED” is displayed and the tray is
unlocked.
unlocked.
Note:
When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the [POWER] key.
turning power on/off with the [POWER] key.
PART No.
5
CX-JN101
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH TURNS OFF.
3
Pull-out the disc tray.
1
Remove the case (side-L).
2
Turn the loading gear in the direction of arrow
A
.
A