Sony CX-JN1 / JAX-N1 / JAX-PK1 Service Manual ▷ View online
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
AEP Model
UK Model
E Model
Australian Model
CX-JN1
Ver. 1.4 2004.10
9-877-271-05
Sony Corporation
2004J05-1
Personal Audio Company
© 2004.10
Published by Sony Engineering Corporation
SPECIFICATIONS
CX-JN1 is the amplifier, CD player, tape deck
and tuner section in JAX-N1/PK1.
and tuner section in JAX-N1/PK1.
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM74S-K6BD72
CD
Base Unit Name
BU-K6BD72
Section
Optical Block Name
KSM-213DCP
Optical Pick-up Name
KSS-213D
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism type
CWM43FF13
TUNER
FM
Except CIS model:
Except CIS model:
tuning range
87.5 MHz to 108 MHz
FM
AEP, UK models:
CIS model:
AEP, UK models:
CIS model:
Except AEP, UK, CIS models:
usable sensitivity (IHF)
16.8 dBf
FM antenna terminal
75 ohms (unbalanced)
AM
AEP, UK, CIS, E, EA, TW models:
AEP, UK, CIS, E, EA, TW models:
E51 model:
tuning range
531 kHz to 1602 kHz
AM usable sensitivity
350
µV/m
SP, KR, AUS models:
530 kHz to 1710 kHz (10 kHz step)
531 kHz to 1602 kHz (9 kHz step)
AM antenna
Loop antenna
AMPLIFIER
Power
AEP, UK, CIS models:
AEP, UK, CIS models:
Except AEP, UK, CIS models:
output
Rated: 12 W + 12 W (6 ohms, T.H.D.
1 %, 1 kHz/DIN 45500)
Reference: 15 W + 15 W (6 ohms,
T.H.D. 10 %, 1 kHz/DIN 45324)
MUSIC POWER: 27 W +27 W
1 %, 1 kHz/DIN 45500)
Reference: 15 W + 15 W (6 ohms,
T.H.D. 10 %, 1 kHz/DIN 45324)
MUSIC POWER: 27 W +27 W
Total harmonic distortion
0.08 % (6 W, 1 kHz, 6 ohms, DIN
AUDIO)
AUDIO)
CASSETTE DECK
Track format
4 tracks, 2 channels stereo
Frequency response
50 Hz – 8 kHz
Recording system
AC bias
Heads
Deck A: playback x 1
Deck B: recording/playback x 1,
erase x 1
Deck B: recording/playback x 1,
erase x 1
CD PLAYER
Laser
Semiconductor laser
(
(
λ = 780 nm)
Emission duration:
continuous
continuous
D/A converter
1 bit dual
Signal-to-noise ratio
85 dB (1 kHz, 0 dB)
Harmonic distortion
0.05 % (1 kHz, 0 dB)
GENERAL
Power
AEP, UK, CIS models:
E, E51, SP, TW models:
AEP, UK, CIS models:
E, E51, SP, TW models:
AEP, UK, CIS models:
AEP, UK, CIS models:
KR model:
AUS model:
AUS model:
Except AEP, UK, CIS models:
(Except AEP, UK, CIS models)
requirements
230 V AC, 50/60 Hz
Power consumption
40 W
Power consumption
With ECO mode on: 0.25 W
in standby mode
With ECO mode off: 15 W
Dimensions (W x H x D)
280 x 330 x 392.5 mm
Weight
6.1 kg
Specifications and external appearance are subject to change
without notice.
without notice.
CIS model:
65 MHz to 74 MHz (10 kHz step)
87.5 MHz to 108 MHz (50 kHz step)
87.5 MHz to 108 MHz (50 kHz step)
15.3 dBf (65 MHz to 74 MHz)
12.8 dBf (87.5 MHz to 108 MHz)
13.2 dBf
12.8 dBf (87.5 MHz to 108 MHz)
13.2 dBf
530 kHz to 1710 kHz (10 kHz step)
531 kHz to 1710 kHz (9 kHz step)
531 kHz to 1710 kHz (9 kHz step)
Rated: 36 W + 36 W (1 kHz, T.H.D. 1
%, 6 ohms)
Reference: 45 W + 45 W (1 kHz,
T.H.D. 10 %, 6 ohms)
%, 6 ohms)
Reference: 45 W + 45 W (1 kHz,
T.H.D. 10 %, 6 ohms)
110
220 V AC, 60 Hz
240 V AC, 50 Hz/60 Hz
240 V AC, 50 Hz/60 Hz
- 120V / 220 - 240V AC
(Switchable), 50 Hz/60 Hz
EA models:
120 - 127V / 220 V AC
(Switchable), 50 Hz/60 Hz
(Switchable), 50 Hz/60 Hz
74 W
E, EA, SP, TW, KR, AUS models:
6.8 kg
E51 model:
6.7 kg
Input
VIDEO/AUX: 400 mV
Outputs
SPEAKER:
MIC: 1.7 mV (10k ohms)
6 ohms or more
PHONES: 32 ohms or more
– Continued on next page –
CX-JN1
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
COPYRIGHT
Check copyright laws relevant to recordings from discs, tuner
or tape for the country where the unit is to be used.
Check copyright laws relevant to recordings from discs, tuner
or tape for the country where the unit is to be used.
Licensed by BBE Sound, Inc. under USP4638258, 5510752
and 5736897.
and 5736897.
• Abbreviation
AUS : Australian model
EA : Saudi Arabia model
E51 : Chilean and Peruvian models
KR : Korean model
SP
EA : Saudi Arabia model
E51 : Chilean and Peruvian models
KR : Korean model
SP
: Singapore model
TW : Taiwan model
Ver 1.2
CX-JN1
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
7
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
9
3-2. Case (SIDE-L/R) ............................................................. 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74S-K6BD72) ................... 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43FF13) .................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. PT Board, MAIN Board .................................................. 13
3-10. Table Assy ....................................................................... 14
3-11. Motor (TB) Board ........................................................... 14
3-12. Motor (LD) Board ........................................................... 15
3-13. Base Unit (BU-K6BD72) ................................................ 15
3-14. Motor Gear Assy (Sled) (M701), BD Board .................. 16
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74S-K6BD72) ................... 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck (CWM43FF13) .................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. PT Board, MAIN Board .................................................. 13
3-10. Table Assy ....................................................................... 14
3-11. Motor (TB) Board ........................................................... 14
3-12. Motor (LD) Board ........................................................... 15
3-13. Base Unit (BU-K6BD72) ................................................ 15
3-14. Motor Gear Assy (Sled) (M701), BD Board .................. 16
4.
TEST MODE
.............................................................. 17
5.
ELECTRICAL ADJUSTMENTS
CD Section ...................................................................... 19
6.
DIAGRAMS
6-1. Block Diagram – CD Section – ..................................... 20
6-2. Block Diagram – TUNER/TAPE/PANEL Section – ..... 21
6-3. Block Diagram – AMP/POWER SUPPLY Section – ... 22
6-4. Note for Printed Wiring Boards and
6-2. Block Diagram – TUNER/TAPE/PANEL Section – ..... 21
6-3. Block Diagram – AMP/POWER SUPPLY Section – ... 22
6-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
6-5. Printed Wiring Board – BD Section – ........................... 24
6-6. Schematic Diagram – BD Section – .............................. 25
6-7. Printed Wiring Boards – CHANGER Section – ............ 26
6-8. Schematic Diagram – CHANGER Section – ................ 27
6-9. Schematic Diagram – MAIN Section (1/4) – ................ 28
6-10. Schematic Diagram – MAIN Section (2/4) – ................ 29
6-11. Schematic Diagram – MAIN Section (3/4) – ................ 30
6-12. Schematic Diagram – MAIN Section (4/4) – ................ 31
6-13. Printed Wiring Board – MAIN Section – ...................... 32
6-14. Printed Wiring Board – HP Section – ........................... 33
6-15. Schematic Diagram – HP Section – .............................. 33
6-16. Printed Wiring Board – PANEL Section – .................... 34
6-17. Schematic Diagram – PANEL Section – ....................... 35
6-18. Printed Wiring Boards – KEY Section – ....................... 36
6-19. Schematic Diagram – KEY Section – ........................... 37
6-20. Printed Wiring Board – PT Section –
6-6. Schematic Diagram – BD Section – .............................. 25
6-7. Printed Wiring Boards – CHANGER Section – ............ 26
6-8. Schematic Diagram – CHANGER Section – ................ 27
6-9. Schematic Diagram – MAIN Section (1/4) – ................ 28
6-10. Schematic Diagram – MAIN Section (2/4) – ................ 29
6-11. Schematic Diagram – MAIN Section (3/4) – ................ 30
6-12. Schematic Diagram – MAIN Section (4/4) – ................ 31
6-13. Printed Wiring Board – MAIN Section – ...................... 32
6-14. Printed Wiring Board – HP Section – ........................... 33
6-15. Schematic Diagram – HP Section – .............................. 33
6-16. Printed Wiring Board – PANEL Section – .................... 34
6-17. Schematic Diagram – PANEL Section – ....................... 35
6-18. Printed Wiring Boards – KEY Section – ....................... 36
6-19. Schematic Diagram – KEY Section – ........................... 37
6-20. Printed Wiring Board – PT Section –
(AEP, UK, CIS, MX, KR, AUS) ..................................... 38
6-21. Schematic Diagram – PT Section –
(AEP, UK, CIS, MS, KR, AUS) ...................................... 39
6-22. Printed Wiring Board – PT Section –
(E, E51, SP, TW) ............................................................. 40
6-23. Schematic Diagram – PT Section –
(E, E51, SP, TW) ............................................................. 41
6-24. IC Pin Function Description ........................................... 45
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 47
7-2. Front Panel Section-1 ...................................................... 48
7-3. Front Panel Section-2 ...................................................... 49
7-4. Front Panel Section-3 ...................................................... 50
7-5. Front Panel Section-4 ...................................................... 51
7-6. Chassis Section ............................................................... 52
7-7. CD Mechanism Deck Section-1
7-2. Front Panel Section-1 ...................................................... 48
7-3. Front Panel Section-2 ...................................................... 49
7-4. Front Panel Section-3 ...................................................... 50
7-5. Front Panel Section-4 ...................................................... 51
7-6. Chassis Section ............................................................... 52
7-7. CD Mechanism Deck Section-1
(CDM74S-K6BD72) ....................................................... 53
7-8. CD Mechanism Deck Section-2
(CDM74S-K6BD72) ....................................................... 54
7-9. CD Mechanism Deck Section-3
(CDM74S-K6BD72) ....................................................... 55
7-10. Base Unit Section (BU-K6BD72) .................................. 56
8.
ELECTRICAL PARTS LIST
............................... 57
Ver 1.2
•
• Abbreviation
AUS : Australian model
EA : Saudi Arabia model
E51 : Chilean and Peruvian models
KR : Korean model
SP
EA : Saudi Arabia model
E51 : Chilean and Peruvian models
KR : Korean model
SP
: Singapore model
TW : Taiwan model
4
CX-JN1
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
CIS model
4-245-154-4
[]
E, Singapore and Taiwan models
4-245-201-0
[]
Chilean and Peruvian models
4-245-201-2
[]
AEP and UK models
4-245-201-3
[]
Korean and Australian models
4-245-201-6
[]
Saudi Arabia model
4-245-279-0
[]
PART No.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Ver 1.2