Sony CMT-X3CD (serv.man2) Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
CMT-X3CD
SPECIFICATIONS
PERSONAL AUDIO SYSTEM
9-896-051-02
2014L33-1
©
2014.12
Singapore Model
Taiwan Model
Korean Model
Thai Model
Ver. 1.1 2014.12
Model Name Using Similar Mechanism
NEW
Mechanism Type
T33DS
Optical Pick-up Block Name
S76RFS7GP
Amplifier section
Power output (rated):
8 watts + 8 watts (at 8 ohms, 1 kHz, 1% THD)
RMS power output (reference):
10 watts + 10 watts (per channel at 8 ohms,
1 kHz)
1 kHz)
Inputs/Outputs
AUDIO IN:
AUDIO IN (external input) jack:
Stereo mini jack, sensitivity 1 V, impedance
47 kilohms
Stereo mini jack, sensitivity 1 V, impedance
47 kilohms
USB:
USB port: Type A, 5 V DC 1.5 A
HEADPHONE jack:
Stereo standard jack, 8 ohms or more
CD-DA/MP3/WMA player section
System:
Compact disc and digital audio system
Laser Diode Properties:
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
Laser Output*: Less than 44.6 μW
* This output is the value measurement at a
distance of 200mm from the objective lens
surface on the Optical Pick-up Block with 7mm
aperture.
surface on the Optical Pick-up Block with 7mm
aperture.
Frequency response:
20 Hz - 20 kHz
Signal-to-noise ratio:
More than 90 dB
Dynamic range:
More than 90 dB
Tuner section
FM tuner section:
FM stereo, FM superheterodyne tuner
Tuning range:
87.5 MHz - 108.0 MHz (50 kHz step)
87.5 MHz - 108.0 MHz (50 kHz step)
Antenna:
FM lead antenna
FM lead antenna
Antenna terminals:
8 ohms unbalanced
8 ohms unbalanced
Speaker section
Speaker system:
Full-range speaker
Passive radiator
Passive radiator
Rated impedance:
8 ohms
BLUETOOTH section
Communication system:
BLUETOOTH Standard version 4.0
Output:
BLUETOOTH Standard Power Class 2
Maximum communication range:
Line of sight approx. 10 m
*1
Frequency band:
2.4 GHz band (2.4000 GHz - 2.4835 GHz)
Modulation method:
FHSS
Compatible BLUETOOTH profiles
*2
:
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
AVRCP (Audio Video Remote Control Profile)
Supported content protection method
SCMS-T method
Supported codec
SBC (Sub Band Codec)
Transmission bandwidth
20 Hz - 20,000 Hz (with 44.1 kHz sampling)
*
1
The actual range will vary depending on factors
such as obstacles between devices, magnetic
fields around a microwave oven, static
electricity, reception sensitivity, antenna’s
performance, operating system, software
application, etc.
such as obstacles between devices, magnetic
fields around a microwave oven, static
electricity, reception sensitivity, antenna’s
performance, operating system, software
application, etc.
*
2
BLUETOOTH standard profiles indicate the
purpose of BLUETOOTH communication
between devices.
purpose of BLUETOOTH communication
between devices.
General
Power requirements:
AC 120 V - 240 V, 50 Hz/60 Hz
(Singapore and Thai models)
(Singapore and Thai models)
AC 110 V - 240 V, 50 Hz/60 Hz (Taiwan model)
AC 220 V - 240 V, 50 Hz/60 Hz (Korean model)
AC 220 V - 240 V, 50 Hz/60 Hz (Korean model)
Power consumption:
28 watts
Dimensions (W/H/D) (incl. projecting parts):
Approx. 340 mm × 173 mm × 90 mm
Mass:
Approx. 2.3 kg
Supplied accessories:
Remote (RM-AMU212) (1), FM lead antenna
(1), Operating Instructions (1), Warranty card (1)
(Korean model)
(1), Operating Instructions (1), Warranty card (1)
(Korean model)
Design and specifications are subject to
change without notice.
change without notice.
Standby power consumption: 0.5 W
(BLUETOOTH network ports off)
BLUETOOTH Standby mode: 5.9 W (BLUETOOTH
network ports on)
(BLUETOOTH network ports off)
BLUETOOTH Standby mode: 5.9 W (BLUETOOTH
network ports on)
CMT-X3CD
2
1.
SERVICING NOTES
.............................................
3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 7
2-2. Grill
Assy
........................................................................ 8
2-3. Loader
Block
................................................................... 9
2-4. Loader Assy (CDM1), OPU Assy (OP1) ........................ 10
2-5. MA Board, NFC Module ................................................ 11
2-6. KY
2-5. MA Board, NFC Module ................................................ 11
2-6. KY
Board
........................................................................ 12
2-7. IN
Board
......................................................................... 13
2-8. AC Cord Assy (AC1) ...................................................... 14
2-9. PW
2-9. PW
Board
........................................................................ 15
2-10. Speaker Unit (SP1, SP2) ................................................. 16
2-11. FV Board ......................................................................... 17
2-11. FV Board ......................................................................... 17
3.
TEST MODE
............................................................ 18
4.
ELECTRICAL CHECK
......................................... 19
5. TROUBLESHOOTING
.......................................... 20
6. DIAGRAMS
6-1. Block
Diagram
................................................................ 22
6-2. Wiring
Diagram
.............................................................. 23
6-3. Printed Wiring Board - MA Board - ............................... 25
6-4. Schematic Diagram - MA Board (1/6) - ......................... 26
6-5. Schematic Diagram - MA Board (2/6) - ......................... 27
6-6. Schematic Diagram - MA Board (3/6) - ......................... 28
6-7. Schematic Diagram - MA Board (4/6) - ......................... 29
6-8. Schematic Diagram - MA Board (5/6) - ......................... 30
6-9. Schematic Diagram - MA Board (6/6) - ......................... 31
6-10. Printed Wiring Boards - IN/FV Boards - ........................ 32
6-11. Schematic Diagram - IN/FV Boards - ............................ 33
6-12. Printed Wiring Board - KY Board - ................................ 34
6-13. Schematic Diagram - KY Board - ................................... 35
6-14. Schematic Diagram - PW Board - .................................. 36
6-15. Printed Wiring Board - PW Board - ................................ 37
6-4. Schematic Diagram - MA Board (1/6) - ......................... 26
6-5. Schematic Diagram - MA Board (2/6) - ......................... 27
6-6. Schematic Diagram - MA Board (3/6) - ......................... 28
6-7. Schematic Diagram - MA Board (4/6) - ......................... 29
6-8. Schematic Diagram - MA Board (5/6) - ......................... 30
6-9. Schematic Diagram - MA Board (6/6) - ......................... 31
6-10. Printed Wiring Boards - IN/FV Boards - ........................ 32
6-11. Schematic Diagram - IN/FV Boards - ............................ 33
6-12. Printed Wiring Board - KY Board - ................................ 34
6-13. Schematic Diagram - KY Board - ................................... 35
6-14. Schematic Diagram - PW Board - .................................. 36
6-15. Printed Wiring Board - PW Board - ................................ 37
7.
EXPLODED VIEWS
7-1. Front Panel Section ......................................................... 38
7-2. Loader
7-2. Loader
Section
................................................................ 39
7-3. MA Board Section .......................................................... 40
7-4. PW Board Section ........................................................... 41
7-5. Rear Panel Section .......................................................... 42
7-4. PW Board Section ........................................................... 41
7-5. Rear Panel Section .......................................................... 42
8. ACCESSORIES
....................................................... 43
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Trademarks, etc.
Windows Media is either a registered trademark
or trademark of Microsoft Corporation in the
United States and/or other countries.
This product is protected by certain intellectual
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this
product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.
“WALKMAN” and “WALKMAN” logo are
registered trademarks of Sony Corporation.
The BLUETOOTH® word mark and logos are
registered trademarks owned by BLUETOOTH
SIG, Inc. and any use of such marks by Sony
Corporation is under license.
or trademark of Microsoft Corporation in the
United States and/or other countries.
This product is protected by certain intellectual
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this
product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.
“WALKMAN” and “WALKMAN” logo are
registered trademarks of Sony Corporation.
The BLUETOOTH® word mark and logos are
registered trademarks owned by BLUETOOTH
SIG, Inc. and any use of such marks by Sony
Corporation is under license.
trademark of NFC Forum, Inc. in the United
The N Mark is a trademark or registered
States and in other countries.
The system names and product names indicated
in this manual are generally the trademarks or
registered trademarks of the manufacturer. ™
and ® marks are omitted in this manual.
The system names and product names indicated
in this manual are generally the trademarks or
registered trademarks of the manufacturer. ™
and ® marks are omitted in this manual.
CMT-X3CD
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• PW
Board
CE501, CE502, CE551, CE552
– PW Board (Conductor Side) –
800
:/2 W
(for CE502)
800
:/2 W
(for CE501)
800
:/2 W
(for CE551)
800
:/2 W
(for CE552)
The SERVICING NOTES contains important information for servicing. Be sure to read this section before repairing the unit.
CMT-X3CD
4
MODEL IDENTIFICATION
Distinguish by Part No. of model number label stuck on the bottom
side of a main unit.
Distinguish by Part No. of model number label stuck on the bottom
side of a main unit.
Note: The printed contents of following fi gure model number label may
be different from the model number label of a main unit.
DESTINATION ABBREVIATIONS
The following abbreviations for model destinations are used in this
service manual.
The following abbreviations for model destinations are used in this
service manual.
• Abbreviations
KR
KR
: Korean model
SP
: Singapore model
TH :
Thai
model
TW :
Taiwan
model
– Bottom view –
MODEL NUMBER LABEL
Singapore model (SP1)
Thai model (TH1)
Taiwan model (TW2)
Korean model (KR2)
4-545-156-0
[]
4-545-155-0
[]
4-545-158-0
[]
4-545-157-0
[]
