DOWNLOAD Sony CMT-SE5 / CMT-SE9 / HCD-SE5 / HCD-SE9 Service Manual ↓ Size: 13.52 MB | Pages: 127 in PDF or view online for FREE

Model
CMT-SE5 CMT-SE9 HCD-SE5 HCD-SE9
Pages
127
Size
13.52 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cmt-se5-cmt-se9-hcd-se5-hcd-se9.pdf
Date

Sony CMT-SE5 / CMT-SE9 / HCD-SE5 / HCD-SE9 Service Manual ▷ View online

HCD-SE5/SE9
UK Model
SERVICE MANUAL
MICRO HI-FI COMPONENT SYSTEM
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-961-507-02
2004J16-1
© 2004.10
HCD-SE5/SE9 are the amplifier, DVD/CD/SACD
player and tuner section in CMT-SE5/SE9.
Ver 1.1  2004.10
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM80-DVBU24
Optical Pick-up Name
DBU-1
SPECIFICATIONS
 
Amplifier section
The following measured at AC 230 V, 50/60 Hz
DIN power output (rated): 20 + 20 W 
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
Front speaker:
25 + 25 watts
(6 ohms at 1 kHz, 10% 
THD)
Center speaker:
25 watts 
(8 ohms at 1 kHz, 10% 
THD)
Surround speaker:
25 + 25 watts
(6 ohms at 1 kHz, 10% 
THD) 
Subwoofer:
50 watts 
(3 ohms at 1 kHz, 10% 
THD)
Music power output (reference):
40 + 40 W
Inputs
MD/TAPE IN (phono jack):
Voltage 250 mV, 
impedance 47 kilohms
VIDEO/SAT IN (phono jacks):
Voltage 450/250 mV, 
impedance 47 kilohms  
VIDEO/SAT IN VIDEO (phono jack):
1 Vp-p, 75 ohms
MD DIGITAL IN OPTICAL:
Supported sampling 
frequencies: 32 kHz, 
44.1 kHz and 48 kHz
VIDEO/SAT DIGITAL IN OPTICAL:
Supported sampling 
frequencies: 32 kHz, 
44.1 kHz and 48 kHz
Outputs
MD/TAPE OUT (phono jacks):
Voltage 250 mV, 
impedance 1 kilohm 
MD DIGITAL OUT OPTICAL:
Sampling frequencies: 
44.1 kHz (CD only)
Wavelength: 660 nm
PHONES (stereo phone jack):
Accepts headphones of 
8 ohms  or  more   
LINE-TV:
Max. output level
1 Vp-p, unbalanced, Sync 
negative, load impedance 
75 ohms
Disc player section 
System
Compact disc, digital 
audio and video system 
and Super Audio CD
Laser   
Semiconductor laser 
(DVD: 
λ =650 nm, 
CD: 
λ =780 nm)
Emission duration: 
continuous   
Frequency response   
DVD (PCM 48 kHz):
2 Hz – 22 kHz
CD: 2 Hz – 20 kHz
Super Audio CD:
2 Hz – 50 kHz
T
General
uner section
FM stereo, FM/AM superheterodyne tuner   
FM tuner section
Tuning range
Antenna
Antenna terminals
Intermediate frequency
87.5 – 108.0 MHz 
(50 kHz step)
FM lead antenna
75 ohm unbalanced   
10.7 MHz 
AM tuner section
   
Tuning range 
Antenna
Antenna terminals
Intermediate frequency
531 – 1,602 kHz (with the 
tuning interval set at 
9 kHz)
AM loop antenna
External antenna terminal   
450 kHz 
Power requirements
Power consumption
Dimensions (w/h/d) 
Mass
230 V AC, 50/60 Hz
55 watts
0.3 watts (in Power Saving 
Mode)
Approx. 155   120 
×
×
345 mm
Approx. 5.3 kg
Design and specifications are subject to change 
without notice.
This system incorporates Dolby* Digital, Dolby Pro Logic (II) adaptive matrix
* Manufactured under license from Dolby Laboratories.
“Dolby”, “Pro Logic” and the double-D symbol are trademarks of
Laboratories.
** Manufactured under license from Digital Theater  Systems, Inc.
“DTS” and “DTS Digital Surround” are registered trademarks of Digital
Theater Systems, Inc.
surround decoder, and the DTS** Digital Surround System.
Dolby
Photo : HCD-SE9
2
HCD-SE5/SE9
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
 damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
 circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
 or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
0
 OR DOTTED LINE WITH
MARK 
0
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
3
HCD-SE5/SE9
TABLE OF CONTENTS
1. SERVICING NOTE
·····················································
4
2. GENERAL
···································································
7
3. DISASSEMBLY
3-1. Top Cover, Front Panel Assy ········································· 13
3-2. PANEL Board, HP Board ············································· 14
3-3. Mechanism Deck (CDM80-DVBU24) ························· 15
3-4. CONNECTOR (D2) Board, I/O Board,
       SCART Board ······························································· 15
3-5. Tuner, DC Fan ······························································· 16
3-6. SPEAKER Board ·························································· 16
3-7. Bracket (CDM) ····························································· 17
3-8. UCOM Board, POWER Board,
       SUBPOWER Board, Power Trance ······························ 18
3-9. DC Fan ·········································································· 18
3-10. AMP Board, REG Board, CONNECTOR (DMB)
         Board, JIG Board,  DMBSE Board ····························· 19
3-11. Chassis (Top) ······························································ 20
3-12. Lever (Loading R/L) ··················································· 21
3-13. Disc Stop Lever, Disc Sensor Lever ··························· 22
3-14. CDM80 Board ····························································· 22
3-15. RF Board ····································································· 23
3-16. Optical Pick-up (DBU-1) ············································ 23
3-17. Base Unit ····································································· 24
3-18. Lever (Bu Lock) ·························································· 24
3-19. Close Lever ································································· 25
3-20. Dir Lever, Gear (IDL-B) ············································· 25
3-21. Gear (IDL-C) ······························································ 26
4. TEST  MODE
····························································
27
5. ELECTRICAL  ADJUSTMENT
······························
36
6. DIAGRAMS
6-1. Block Diagrams
       – RF Servo Section – ····················································· 38
       – Video Section – ·························································· 39
       – Audio Section – ·························································· 40
       – Amp Section – ···························································· 41
       – Power Supply Section – ············································· 42
6-2. Printed Wiring Board
       – RF Section – ······························································· 43
6-3. Schematic Diagram
       – RF Section – ······························································· 44
6-4. Printed Wiring Board
       – CONNECTOR(DMB)/CDM80/JIG Section – ··········· 45
6-5. Schematic Diagram
       – CONNECTOR(DMB)/CDM80/JIG Section – ··········· 46
6-6. Printed Wiring Board
       – DMBSE Section (Side A) – ········································ 47
6-7. Printed Wiring Board
       – DMBSE Section (Side B) – ········································ 48
6-8. Schematic Diagram
       – DMBSE Section (1/11) – ··········································· 49
6-9. Schematic Diagram
       – DMBSE Section (2/11) – ··········································· 50
6-10. Schematic Diagram
         – DMBSE Section (3/11) – ········································· 51
6-11. Schematic Diagram
         – DMBSE Section (4/11) – ········································· 52
6-12. Schematic Diagram
         – DMBSE Section (5/11) – ········································· 53
6-13. Schematic Diagram
         – DMBSE Section (6/11) – ········································· 54
6-14. Schematic Diagram
         – DMBSE Section (7/11) – ········································· 55
6-15. Schematic Diagram
         – DMBSE Section (8/11) – ········································· 56
6-16. Schematic Diagram
         – DMBSE Section (9/11) – ········································· 57
6-17. Schematic Diagram
         – DMBSE Section (10/11) – ······································· 58
6-18. Schematic Diagram
         – DMBSE Section (11/11) – ······································· 59
6-19. Printed Wiring Board
         – AMP/HP/SPEAKER Section – ································ 60
6-20. Schematic Diagram
         – AMP(1/2)/HP Section – ··········································· 61
6-21. Schematic Diagram
         – AMP(2/2)/SPEAKER Section – ······························· 62
6-22. Printed Wiring Board
         – UCOM Section – ······················································ 63
6-23. Schematic Diagram
         – UCOM Section(1/2) – ·············································· 64
6-24. Schematic Diagram
         – UCOM Section(2/2) – ·············································· 65
6-25. Printed Wiring Board
         – PANEL Section – ····················································· 66
6-26. Schematic Diagram
         – PANEL Section – ····················································· 67
6-27. Printed Wiring Board
         – I/O/SCART/CONNECTOR(D2) Section – ·············· 68
6-28. Schematic Diagram
         – I/O/SCART/CONNECTOR(D2) Section – ·············· 69
6-29. Printed Wiring Board
         – POWER/SUBPOWER/REG Section – ···················· 70
6-30. Schematic Diagram
         – POWER/SUBPOWER/REG Section – ···················· 71
6-31. IC Pin Function Description ······································· 82
7. EXPLODED VIEWS
7-1. Top Cover ······································································ 99
7-2. Front Panel Assy ························································· 100
7-3. Chassis Section-1 ························································ 101
7-4. Chassis Section-2 ························································ 102
7-5. Mechanism Deck Section-1
        (CDM80-DVBU24) ···················································· 103
7-6. Mechanism Deck Section-2
        (CDM80-DVBU24) ···················································· 104
7-7. Mechanism Deck Section-3
        (CDM80-DVBU24) ···················································· 105
7-8. Base Unit Section ························································ 106
8. ELECTRICAL PARTS LIST
·································
107
4
HCD-SE5/SE9
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.
SECTION 1
SERVICING NOTE
DISC SLOT LOCK
The disc slot lock function for the antitheft of an demonstration
disc in the store is equipped.
Setting Procedure :
1.
Press the  ?/1  button to turn the set on.
2.
Press the 
[FUNCTION]
 button to set DVD function.
3.
Insert a disc.
4.
Press the 
[DVD     ]
 stick and the 
[     DVD]
 button simultaneously
for five seconds.
5.
The message “LOCKED” is displayed and the slot is locked.
Releasing Procedure :
1.
Press the 
[DVD     ]
 stick and the 
[     DVD]
  button simultaneously
for five seconds again.
2.
The message “UNLOCKED” is displayed and the slot is
unlocked.
Note:
When “LOCKED” is displayed, the slot lock is not released by
turning power on/off with the  ?/1  button.
Note 1:
Incorrect operations may be performed if the test mode ia not
entered properly.
In this case, press the  ?/1  button to turn the power off, and
retry to enter the test mode.
Note 2:
If the disc tray does not open and the message “LOCKED”
appears, press the 
[DVD     ]
 stick and the 
[     DVD]
  button
simultaneously for 5 seconds or longer.
Then remove your fingers from the above stick and the button.
The message “UNLOCKED” appears for 2 seconds and the disc
tray opens.
x
x
Z
Z
x
Z
I/O board
Fix it securely with lead pins so that the wires 
do not touch the upper I/O board. 
SUBPOWER board
CAUTION-Fixing the wires
Ver 1.1
NOTES ON DMBSE BOARD EXCHANGE
If a DMBSE board is exchanged, “DRIVE AUTO ADJUSTMENT”
may be unable to be performed. In this case, initialize a memory in
the following procedure.
1. Starting Test  Mode (see page 28).
2. Press the 2  button of remote commander to set the Drive
Manual Operation (see page 30).
3. Press the 6 button of remote commander to set the Memory
Check (see page 32).
4. Press the [CLEAR] button of remote commander to initialize
a memory.
Page of 127
Display

Sony CMT-SE5 / CMT-SE9 / HCD-SE5 / HCD-SE9 Service Manual ▷ Download

  • DOWNLOAD Sony CMT-SE5 / CMT-SE9 / HCD-SE5 / HCD-SE9 Service Manual ↓ Size: 13.52 MB | Pages: 127 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony CMT-SE5 / CMT-SE9 / HCD-SE5 / HCD-SE9 in PDF for free, which will help you to disassemble, recover, fix and repair Sony CMT-SE5 / CMT-SE9 / HCD-SE5 / HCD-SE9 Audio. Information contained in Sony CMT-SE5 / CMT-SE9 / HCD-SE5 / HCD-SE9 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.