Sony CMT-SE5 / CMT-SE9 / HCD-SE5 / HCD-SE9 Service Manual ▷ View online
HCD-SE5/SE9
UK Model
SERVICE MANUAL
MICRO HI-FI COMPONENT SYSTEM
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-961-507-02
2004J16-1
© 2004.10
HCD-SE5/SE9 are the amplifier, DVD/CD/SACD
player and tuner section in CMT-SE5/SE9.
player and tuner section in CMT-SE5/SE9.
Ver 1.1 2004.10
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM80-DVBU24
Optical Pick-up Name
DBU-1
SPECIFICATIONS
Amplifier section
The following measured at AC 230 V, 50/60 Hz
DIN power output (rated): 20 + 20 W
DIN power output (rated): 20 + 20 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
Front speaker:
Front speaker:
25 + 25 watts
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Center speaker:
25 watts
(8 ohms at 1 kHz, 10%
THD)
(8 ohms at 1 kHz, 10%
THD)
Surround speaker:
25 + 25 watts
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Subwoofer:
50 watts
(3 ohms at 1 kHz, 10%
THD)
(3 ohms at 1 kHz, 10%
THD)
Music power output (reference):
40 + 40 W
Inputs
MD/TAPE IN (phono jack):
MD/TAPE IN (phono jack):
Voltage 250 mV,
impedance 47 kilohms
impedance 47 kilohms
VIDEO/SAT IN (phono jacks):
Voltage 450/250 mV,
impedance 47 kilohms
impedance 47 kilohms
VIDEO/SAT IN VIDEO (phono jack):
1 Vp-p, 75 ohms
MD DIGITAL IN OPTICAL:
Supported sampling
frequencies: 32 kHz,
44.1 kHz and 48 kHz
frequencies: 32 kHz,
44.1 kHz and 48 kHz
VIDEO/SAT DIGITAL IN OPTICAL:
Supported sampling
frequencies: 32 kHz,
44.1 kHz and 48 kHz
frequencies: 32 kHz,
44.1 kHz and 48 kHz
Outputs
MD/TAPE OUT (phono jacks):
MD/TAPE OUT (phono jacks):
Voltage 250 mV,
impedance 1 kilohm
impedance 1 kilohm
MD DIGITAL OUT OPTICAL:
Sampling frequencies:
44.1 kHz (CD only)
Wavelength: 660 nm
44.1 kHz (CD only)
Wavelength: 660 nm
PHONES (stereo phone jack):
Accepts headphones of
8 ohms or more
8 ohms or more
LINE-TV:
Max. output level
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
Disc player section
System
Compact disc, digital
audio and video system
and Super Audio CD
audio and video system
and Super Audio CD
Laser
Semiconductor laser
(DVD:
(DVD:
λ =650 nm,
CD:
λ =780 nm)
Emission duration:
continuous
continuous
Frequency response
DVD (PCM 48 kHz):
2 Hz – 22 kHz
CD: 2 Hz – 20 kHz
Super Audio CD:
2 Hz – 50 kHz
2 Hz – 22 kHz
CD: 2 Hz – 20 kHz
Super Audio CD:
2 Hz – 50 kHz
T
General
uner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
Antenna
Antenna terminals
Intermediate frequency
Antenna terminals
Intermediate frequency
87.5 – 108.0 MHz
(50 kHz step)
FM lead antenna
75 ohm unbalanced
10.7 MHz
(50 kHz step)
FM lead antenna
75 ohm unbalanced
10.7 MHz
AM tuner section
Tuning range
Antenna
Antenna terminals
Intermediate frequency
Antenna terminals
Intermediate frequency
531 – 1,602 kHz (with the
tuning interval set at
9 kHz)
AM loop antenna
External antenna terminal
450 kHz
tuning interval set at
9 kHz)
AM loop antenna
External antenna terminal
450 kHz
Power requirements
Power consumption
Power consumption
Dimensions (w/h/d)
Mass
230 V AC, 50/60 Hz
55 watts
0.3 watts (in Power Saving
Mode)
Approx. 155 120
55 watts
0.3 watts (in Power Saving
Mode)
Approx. 155 120
×
×
345 mm
Approx. 5.3 kg
Approx. 5.3 kg
Design and specifications are subject to change
without notice.
without notice.
This system incorporates Dolby* Digital, Dolby Pro Logic (II) adaptive matrix
* Manufactured under license from Dolby Laboratories.
“Dolby”, “Pro Logic” and the double-D symbol are trademarks of
Laboratories.
Laboratories.
** Manufactured under license from Digital Theater Systems, Inc.
“DTS” and “DTS Digital Surround” are registered trademarks of Digital
Theater Systems, Inc.
Theater Systems, Inc.
surround decoder, and the DTS** Digital Surround System.
Dolby
Photo : HCD-SE9
2
HCD-SE5/SE9
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
3
HCD-SE5/SE9
TABLE OF CONTENTS
1. SERVICING NOTE
·····················································
4
2. GENERAL
···································································
7
3. DISASSEMBLY
3-1. Top Cover, Front Panel Assy ········································· 13
3-2. PANEL Board, HP Board ············································· 14
3-3. Mechanism Deck (CDM80-DVBU24) ························· 15
3-4. CONNECTOR (D2) Board, I/O Board,
SCART Board ······························································· 15
3-5. Tuner, DC Fan ······························································· 16
3-6. SPEAKER Board ·························································· 16
3-7. Bracket (CDM) ····························································· 17
3-8. UCOM Board, POWER Board,
SUBPOWER Board, Power Trance ······························ 18
3-9. DC Fan ·········································································· 18
3-10. AMP Board, REG Board, CONNECTOR (DMB)
Board, JIG Board, DMBSE Board ····························· 19
3-11. Chassis (Top) ······························································ 20
3-12. Lever (Loading R/L) ··················································· 21
3-13. Disc Stop Lever, Disc Sensor Lever ··························· 22
3-14. CDM80 Board ····························································· 22
3-15. RF Board ····································································· 23
3-16. Optical Pick-up (DBU-1) ············································ 23
3-17. Base Unit ····································································· 24
3-18. Lever (Bu Lock) ·························································· 24
3-19. Close Lever ································································· 25
3-20. Dir Lever, Gear (IDL-B) ············································· 25
3-21. Gear (IDL-C) ······························································ 26
3-2. PANEL Board, HP Board ············································· 14
3-3. Mechanism Deck (CDM80-DVBU24) ························· 15
3-4. CONNECTOR (D2) Board, I/O Board,
SCART Board ······························································· 15
3-5. Tuner, DC Fan ······························································· 16
3-6. SPEAKER Board ·························································· 16
3-7. Bracket (CDM) ····························································· 17
3-8. UCOM Board, POWER Board,
SUBPOWER Board, Power Trance ······························ 18
3-9. DC Fan ·········································································· 18
3-10. AMP Board, REG Board, CONNECTOR (DMB)
Board, JIG Board, DMBSE Board ····························· 19
3-11. Chassis (Top) ······························································ 20
3-12. Lever (Loading R/L) ··················································· 21
3-13. Disc Stop Lever, Disc Sensor Lever ··························· 22
3-14. CDM80 Board ····························································· 22
3-15. RF Board ····································································· 23
3-16. Optical Pick-up (DBU-1) ············································ 23
3-17. Base Unit ····································································· 24
3-18. Lever (Bu Lock) ·························································· 24
3-19. Close Lever ································································· 25
3-20. Dir Lever, Gear (IDL-B) ············································· 25
3-21. Gear (IDL-C) ······························································ 26
4. TEST MODE
····························································
27
5. ELECTRICAL ADJUSTMENT
······························
36
6. DIAGRAMS
6-1. Block Diagrams
– RF Servo Section – ····················································· 38
– Video Section – ·························································· 39
– Audio Section – ·························································· 40
– Amp Section – ···························································· 41
– Power Supply Section – ············································· 42
6-2. Printed Wiring Board
– RF Section – ······························································· 43
6-3. Schematic Diagram
– RF Section – ······························································· 44
6-4. Printed Wiring Board
– CONNECTOR(DMB)/CDM80/JIG Section – ··········· 45
6-5. Schematic Diagram
– CONNECTOR(DMB)/CDM80/JIG Section – ··········· 46
6-6. Printed Wiring Board
– DMBSE Section (Side A) – ········································ 47
6-7. Printed Wiring Board
– DMBSE Section (Side B) – ········································ 48
6-8. Schematic Diagram
– DMBSE Section (1/11) – ··········································· 49
6-9. Schematic Diagram
– DMBSE Section (2/11) – ··········································· 50
6-10. Schematic Diagram
– DMBSE Section (3/11) – ········································· 51
6-11. Schematic Diagram
– DMBSE Section (4/11) – ········································· 52
6-12. Schematic Diagram
– DMBSE Section (5/11) – ········································· 53
6-13. Schematic Diagram
– DMBSE Section (6/11) – ········································· 54
– RF Servo Section – ····················································· 38
– Video Section – ·························································· 39
– Audio Section – ·························································· 40
– Amp Section – ···························································· 41
– Power Supply Section – ············································· 42
6-2. Printed Wiring Board
– RF Section – ······························································· 43
6-3. Schematic Diagram
– RF Section – ······························································· 44
6-4. Printed Wiring Board
– CONNECTOR(DMB)/CDM80/JIG Section – ··········· 45
6-5. Schematic Diagram
– CONNECTOR(DMB)/CDM80/JIG Section – ··········· 46
6-6. Printed Wiring Board
– DMBSE Section (Side A) – ········································ 47
6-7. Printed Wiring Board
– DMBSE Section (Side B) – ········································ 48
6-8. Schematic Diagram
– DMBSE Section (1/11) – ··········································· 49
6-9. Schematic Diagram
– DMBSE Section (2/11) – ··········································· 50
6-10. Schematic Diagram
– DMBSE Section (3/11) – ········································· 51
6-11. Schematic Diagram
– DMBSE Section (4/11) – ········································· 52
6-12. Schematic Diagram
– DMBSE Section (5/11) – ········································· 53
6-13. Schematic Diagram
– DMBSE Section (6/11) – ········································· 54
6-14. Schematic Diagram
– DMBSE Section (7/11) – ········································· 55
6-15. Schematic Diagram
– DMBSE Section (8/11) – ········································· 56
6-16. Schematic Diagram
– DMBSE Section (9/11) – ········································· 57
6-17. Schematic Diagram
– DMBSE Section (10/11) – ······································· 58
6-18. Schematic Diagram
– DMBSE Section (11/11) – ······································· 59
6-19. Printed Wiring Board
– AMP/HP/SPEAKER Section – ································ 60
6-20. Schematic Diagram
– AMP(1/2)/HP Section – ··········································· 61
6-21. Schematic Diagram
– AMP(2/2)/SPEAKER Section – ······························· 62
6-22. Printed Wiring Board
– UCOM Section – ······················································ 63
6-23. Schematic Diagram
– UCOM Section(1/2) – ·············································· 64
6-24. Schematic Diagram
– UCOM Section(2/2) – ·············································· 65
6-25. Printed Wiring Board
– PANEL Section – ····················································· 66
6-26. Schematic Diagram
– PANEL Section – ····················································· 67
6-27. Printed Wiring Board
– I/O/SCART/CONNECTOR(D2) Section – ·············· 68
6-28. Schematic Diagram
– I/O/SCART/CONNECTOR(D2) Section – ·············· 69
6-29. Printed Wiring Board
– POWER/SUBPOWER/REG Section – ···················· 70
6-30. Schematic Diagram
– POWER/SUBPOWER/REG Section – ···················· 71
6-31. IC Pin Function Description ······································· 82
– DMBSE Section (7/11) – ········································· 55
6-15. Schematic Diagram
– DMBSE Section (8/11) – ········································· 56
6-16. Schematic Diagram
– DMBSE Section (9/11) – ········································· 57
6-17. Schematic Diagram
– DMBSE Section (10/11) – ······································· 58
6-18. Schematic Diagram
– DMBSE Section (11/11) – ······································· 59
6-19. Printed Wiring Board
– AMP/HP/SPEAKER Section – ································ 60
6-20. Schematic Diagram
– AMP(1/2)/HP Section – ··········································· 61
6-21. Schematic Diagram
– AMP(2/2)/SPEAKER Section – ······························· 62
6-22. Printed Wiring Board
– UCOM Section – ······················································ 63
6-23. Schematic Diagram
– UCOM Section(1/2) – ·············································· 64
6-24. Schematic Diagram
– UCOM Section(2/2) – ·············································· 65
6-25. Printed Wiring Board
– PANEL Section – ····················································· 66
6-26. Schematic Diagram
– PANEL Section – ····················································· 67
6-27. Printed Wiring Board
– I/O/SCART/CONNECTOR(D2) Section – ·············· 68
6-28. Schematic Diagram
– I/O/SCART/CONNECTOR(D2) Section – ·············· 69
6-29. Printed Wiring Board
– POWER/SUBPOWER/REG Section – ···················· 70
6-30. Schematic Diagram
– POWER/SUBPOWER/REG Section – ···················· 71
6-31. IC Pin Function Description ······································· 82
7. EXPLODED VIEWS
7-1. Top Cover ······································································ 99
7-2. Front Panel Assy ························································· 100
7-3. Chassis Section-1 ························································ 101
7-4. Chassis Section-2 ························································ 102
7-5. Mechanism Deck Section-1
(CDM80-DVBU24) ···················································· 103
7-6. Mechanism Deck Section-2
(CDM80-DVBU24) ···················································· 104
7-7. Mechanism Deck Section-3
(CDM80-DVBU24) ···················································· 105
7-8. Base Unit Section ························································ 106
7-2. Front Panel Assy ························································· 100
7-3. Chassis Section-1 ························································ 101
7-4. Chassis Section-2 ························································ 102
7-5. Mechanism Deck Section-1
(CDM80-DVBU24) ···················································· 103
7-6. Mechanism Deck Section-2
(CDM80-DVBU24) ···················································· 104
7-7. Mechanism Deck Section-3
(CDM80-DVBU24) ···················································· 105
7-8. Base Unit Section ························································ 106
8. ELECTRICAL PARTS LIST
·································
107
4
HCD-SE5/SE9
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.
that the S curve waveform is output several times.
SECTION 1
SERVICING NOTE
DISC SLOT LOCK
The disc slot lock function for the antitheft of an demonstration
disc in the store is equipped.
Setting Procedure :
1.
disc in the store is equipped.
Setting Procedure :
1.
Press the ?/1 button to turn the set on.
2.
Press the
[FUNCTION]
button to set DVD function.
3.
Insert a disc.
4.
Press the
[DVD ]
stick and the
[ DVD]
button simultaneously
for five seconds.
5.
The message “LOCKED” is displayed and the slot is locked.
Releasing Procedure :
1.
1.
Press the
[DVD ]
stick and the
[ DVD]
button simultaneously
for five seconds again.
2.
The message “UNLOCKED” is displayed and the slot is
unlocked.
unlocked.
Note:
When “LOCKED” is displayed, the slot lock is not released by
turning power on/off with the ?/1 button.
turning power on/off with the ?/1 button.
Note 1:
Incorrect operations may be performed if the test mode ia not
entered properly.
In this case, press the ?/1 button to turn the power off, and
retry to enter the test mode.
entered properly.
In this case, press the ?/1 button to turn the power off, and
retry to enter the test mode.
Note 2:
If the disc tray does not open and the message “LOCKED”
appears, press the
appears, press the
[DVD ]
stick and the
[ DVD]
button
simultaneously for 5 seconds or longer.
Then remove your fingers from the above stick and the button.
The message “UNLOCKED” appears for 2 seconds and the disc
tray opens.
Then remove your fingers from the above stick and the button.
The message “UNLOCKED” appears for 2 seconds and the disc
tray opens.
x
x
Z
Z
x
Z
I/O board
Fix it securely with lead pins so that the wires
do not touch the upper I/O board.
do not touch the upper I/O board.
SUBPOWER board
CAUTION-Fixing the wires
Ver 1.1
NOTES ON DMBSE BOARD EXCHANGE
If a DMBSE board is exchanged, “DRIVE AUTO ADJUSTMENT”
may be unable to be performed. In this case, initialize a memory in
the following procedure.
may be unable to be performed. In this case, initialize a memory in
the following procedure.
1. Starting Test Mode (see page 28).
2. Press the 2 button of remote commander to set the Drive
2. Press the 2 button of remote commander to set the Drive
Manual Operation (see page 30).
3. Press the 6 button of remote commander to set the Memory
Check (see page 32).
4. Press the [CLEAR] button of remote commander to initialize
a memory.