Sony CMT-SE1 / HCD-SE1 Service Manual ▷ View online
SERVICE MANUAL
CD
Section
Amplifier section
DIN power output (rated): 55 + 55 W
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
80 + 80 W
(4 ohms at 1 kHz, 10%
THD)
(4 ohms at 1 kHz, 10%
THD)
Inputs
MD (TAPE) IN (stereo mini jack):
MD (TAPE) IN (stereo mini jack):
Sensitivity 450/250 mV,
impedance 47 kilohms
impedance 47 kilohms
Outputs
CD OPTICAL OUT DIGITAL:
CD OPTICAL OUT DIGITAL:
Optical Wavelength:
660 nm
660 nm
PHONES:
Accepts headphones with
an impedance of 8 ohms or
more
an impedance of 8 ohms or
more
MD (TAPE) OUT (stereo mini jack):
Impedance 1 kilohm
SPEAKER:
Accepts impedance of
4 ohms
4 ohms
CD player section
Laser
Semiconductor laser
(CD:
(CD:
λ=780 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz
Wavelength
780 – 790 nm
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
(50 kHz step)
Antenna
FM wire antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
531 – 1,602 kHz
(9 kHz step)
(9 kHz step)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
230 V AC, 50/60 Hz
Power consumption
45 W
0.3 W (in Power Saving
mode)
0.3 W (in Power Saving
mode)
Dimensions (w/h/d) incl. projecting parts and controls
Amplifier/Tuner/CD section:
Amplifier/Tuner/CD section:
Approx. 155
× 119 ×
289 mm
Mass
Approx. 3.0 kg
Design and specifications are subject to change
without notice.
without notice.
COMPACT DISC DECK RECEIVER
AEP Model
UK Model
SPECIFICATIONS
HCD-SE1
Ver 1.1 2003. 11
HCD-SE1 is the Amplifier, CD player and
Tuner section in CMT-SE1.
Tuner section in CMT-SE1.
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM80B-K6BD44S
Base Unit Name
BU-K6BD44S
Optical Block Name
KSM-213D
9-961-094-02
Sony Corporation
2003K16-1
Home Audio Company
C
2003.11
Published by Sony Engineering Corporation
2
HCD-SE1
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
3
HCD-SE1
TABLE OF CONTENTS
1.
GENERAL
...................................................................
4
2.
DISASSEMBLY
.........................................................
6
2-1.
CASE ........................................................................ 7
2-2.
FRONT PANEL ASSY SECTION .......................... 7
2-3.
FRONT PANEL ....................................................... 8
2-4.
JACK BOARD ......................................................... 8
2-5.
CD MECHANISM BLOCK SECTION .................. 9
2-6.
CD MECHANISM DECK
(CDM80B-K6BD44S) ............................................. 9
(CDM80B-K6BD44S) ............................................. 9
2-7.
AMP BOARD, SUB TRANS BOARD ................. 10
2-8.
SWITCHING REGULATOR ................................ 10
2-9.
LID (CD) ASSY ..................................................... 11
2-10. CHASSIS (TOP) .................................................... 11
2-11. LEVER (LOADING R/L) ..................................... 12
2-12. DISC STOP LEVER, DISC SENSOR LEVER .... 13
2-13. DRIVER BOARD .................................................. 13
2-14. BD BOARD ........................................................... 14
2-15. BU SECTION ........................................................ 14
2-16. BASE UNIT ........................................................... 15
2-18. LEVER (BU BLOCK) ........................................... 16
2-19. CLOSE LEVER ..................................................... 16
2-20. DIR LEVER, GEAR (IDL-B) ............................... 17
2-21. GEAR (IDL-C) ...................................................... 17
2-11. LEVER (LOADING R/L) ..................................... 12
2-12. DISC STOP LEVER, DISC SENSOR LEVER .... 13
2-13. DRIVER BOARD .................................................. 13
2-14. BD BOARD ........................................................... 14
2-15. BU SECTION ........................................................ 14
2-16. BASE UNIT ........................................................... 15
2-18. LEVER (BU BLOCK) ........................................... 16
2-19. CLOSE LEVER ..................................................... 16
2-20. DIR LEVER, GEAR (IDL-B) ............................... 17
2-21. GEAR (IDL-C) ...................................................... 17
3.
TEST MODE
.............................................................. 18
4.
ELECTRICAL ADJUSTMENTS
......................... 20
5.
DIAGRAMS
5-1.
BLOCK DIAGRAMS
– CD SECTION – .................................................. 22
– MAIN SECTION – ............................................. 23
– POWER/DISPLAY SECTION – ........................ 24
– CD SECTION – .................................................. 22
– MAIN SECTION – ............................................. 23
– POWER/DISPLAY SECTION – ........................ 24
5-2.
PRINTED WIRING BOARD
– BD SECTION – .................................................. 25
– BD SECTION – .................................................. 25
5-3.
SCHEMATIC DIAGRAM
– BD SECTION – .................................................. 26
– BD SECTION – .................................................. 26
5-4.
PRINTED WIRING BOARD
– DRIVER SECTION – ......................................... 27
– DRIVER SECTION – ......................................... 27
5-5.
SCHEMATIC DIAGRAM
– DRIVER SECTION – ......................................... 27
– DRIVER SECTION – ......................................... 27
5-6.
PRINTED WIRING BOARD
– AMP SECTION – ............................................... 28
– AMP SECTION – ............................................... 28
5-7.
SCHEMATIC DIAGRAM
– AMP SECTION – ............................................... 29
– AMP SECTION – ............................................... 29
5-8.
PRINTED WIRING BOARD
– MAIN SECTION – ............................................. 30
– MAIN SECTION – ............................................. 30
5-9.
SCHEMATIC DIAGRAM
– MAIN SECTION – ............................................. 31
– MAIN SECTION – ............................................. 31
5-10. PRINTED WIRING BOARD
– PANEL SECTION – ........................................... 32
5-11. SCHEMATIC DIAGRAM
– PANEL SECTION – ........................................... 33
5-12. PRINTED WIRING BOARD
– CONTROL SECTION – ..................................... 34
5-13. SCHEMATIC DIAGRAM
– CONTROL SECTION – ..................................... 35
5-14. PRINTED WIRING BOARD
– JACK/HEADPHONE SECTION – .................... 36
5-15. SCHEMATIC DIAGRAM
– JACK/POWER SECTION – ............................... 37
5-16. PRINTED WIRING BOARD
– POWER SECTION – .......................................... 38
5-17. SCHEMATIC DIAGRAM
– SWITCHING REGULATOR SECTION – ........ 39
5-17. IC PIN FUNCTION DESCRIPTION ................... 46
6.
EXPLODED VIEWS
6-1.
CASE SECTION ................................................... 48
6-2.
FRONT PANEL SECTION ................................... 49
6-3.
CHASSIS SECTION-1 .......................................... 50
6-4.
CHASSIS SECTION-2 .......................................... 51
6-5.
CD MECHANISM DECK SECTION-1
(CDM80B-K6BD44S) ........................................... 52
(CDM80B-K6BD44S) ........................................... 52
6-6.
CD MECHANISM DECK SECTION-2
(CDM80B-K6BD44S) ........................................... 53
(CDM80B-K6BD44S) ........................................... 53
6-7.
CD MECHANISM DECK SECTION-3
(CDM80B-K6BD44S) ........................................... 54
(CDM80B-K6BD44S) ........................................... 54
6-8.
BASE UNIT SECTION
(BU-K6BD44S) ..................................................... 55
(BU-K6BD44S) ..................................................... 55
7.
ELECTRICAL PARTS LIST
............................... 56
Ver 1.1 2003.11
4
HCD-SE1
SECTION 1
GENERAL
This section is extracted from
instruction manual.
instruction manual.
Main unit
AM qa
BASS/TREBLE qs
DBFB 3
BASS/TREBLE qs
DBFB 3
Disc slot 4
Display window 5
FM qa
Display window 5
FM qa
Front cover 7
FUNCTION qf
Lever qa qd
FUNCTION qf
Lever qa qd
PHONES jack 9
PRESET +/– qa
PRESET +/– qa
Remote sensor 2
VOLUME control 8
VOLUME control 8
?/1 (power) 1
./> (go back/go forward)
./> (go back/go forward)
qd
NX (play pause) qd
x (stop) qd
Z EJECT (eject) 6
+/– q;
x (stop) qd
Z EJECT (eject) 6
+/– q;
ALPHABETICAL ORDER
A – O
P – Z
BUTTON DESCRIPTIONS
?/1