Sony CMT-PX333 / HCD-PX333 Service Manual ▷ View online
6
HCD-PX333
TABLE OF CONTENTS
SELF-DIAGNOSIS FUNCTION
.....................................
2
1.
SERVICING NOTES
...............................................
7
2.
GENERAL
................................................................... 17
3.
DISASSEMBLY
......................................................... 19
4.
TEST MODE
............................................................... 31
5.
ELECTRICAL ADJUSTMENTS
MD Section ..................................................................... 37
CD Section ...................................................................... 48
CD Section ...................................................................... 48
6.
DIAGRAMS
6-1. Block Diagram – MD Servo Section – ........................... 51
– D/A, A/D Converter Section – ..................................... 52
– Main Section ................................................................ 53
– Display, Power Supply Section – ................................ 54
– Main Section ................................................................ 53
– Display, Power Supply Section – ................................ 54
6-2. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 55
6-3. Printed Wiring Board – BD (CD) Board – ..................... 56
6-4. Schematic Diagram – BD (CD) Board – ........................ 57
6-5. Printed Wiring Board – BD (MD) Board – .................... 58
6-6. Schematic Diagram – BD (MD) Board (1/2) – .............. 59
6-7. Schematic Diagram – BD (MD) Board (2/2) – .............. 60
6-8. Printed Wiring Board – MD DIGITAL Section – .......... 61
6-9. Schematic Diagram – MD Digital Section (1/3) – ......... 62
6-10. Schematic Diagram – MD Digital Section (2/3) – ......... 63
6-11. Schematic Diagram – MD Digital Section (3/3) – ......... 64
6-12. Printed Wiring Boards – Main Board – ......................... 65
6-13. Schematic Diagram – Main Board (1/2) – ..................... 66
6-14. Schematic Diagram – Main Board (1/2) – ..................... 67
6-15. Printed Wiring Board – AMP Board – .......................... 68
6-16. Printed Wiring Board – SP Board – .............................. 68
6-17. Schematic Diagram – AMP Board – ............................. 69
6-18. Schematic Diagram – SP Board – .................................. 70
6-19. Printed Wiring Boards – Panel Section1 – .................... 71
6-20. Schematic Diagram – Panel Section1 – ........................ 72
6-21. Printed Wiring Boards – Panel Section2 – .................... 73
6-22. Schematic Diagram – Panel Section2 – ........................ 73
6-23. Printed Wiring Boards – Power Board – ....................... 74
6-24. Schematic Diagram – Power Board – ........................... 75
6-25. IC Block Diagrams .......................................................... 77
6-26. IC Pin Function Description ........................................... 81
6-4. Schematic Diagram – BD (CD) Board – ........................ 57
6-5. Printed Wiring Board – BD (MD) Board – .................... 58
6-6. Schematic Diagram – BD (MD) Board (1/2) – .............. 59
6-7. Schematic Diagram – BD (MD) Board (2/2) – .............. 60
6-8. Printed Wiring Board – MD DIGITAL Section – .......... 61
6-9. Schematic Diagram – MD Digital Section (1/3) – ......... 62
6-10. Schematic Diagram – MD Digital Section (2/3) – ......... 63
6-11. Schematic Diagram – MD Digital Section (3/3) – ......... 64
6-12. Printed Wiring Boards – Main Board – ......................... 65
6-13. Schematic Diagram – Main Board (1/2) – ..................... 66
6-14. Schematic Diagram – Main Board (1/2) – ..................... 67
6-15. Printed Wiring Board – AMP Board – .......................... 68
6-16. Printed Wiring Board – SP Board – .............................. 68
6-17. Schematic Diagram – AMP Board – ............................. 69
6-18. Schematic Diagram – SP Board – .................................. 70
6-19. Printed Wiring Boards – Panel Section1 – .................... 71
6-20. Schematic Diagram – Panel Section1 – ........................ 72
6-21. Printed Wiring Boards – Panel Section2 – .................... 73
6-22. Schematic Diagram – Panel Section2 – ........................ 73
6-23. Printed Wiring Boards – Power Board – ....................... 74
6-24. Schematic Diagram – Power Board – ........................... 75
6-25. IC Block Diagrams .......................................................... 77
6-26. IC Pin Function Description ........................................... 81
7.
EXPLODED VIEWS
................................................ 93
8.
ELECTRICAL PARTS LIST
.............................. 100
MODEL IDENTIFICATION
— Back panel —
Model
Part No.
AEP,UK models
4-231-958-1[]
Homg Kong,Malaysia,
Singapore models
Singapore models
4-231-958-2[]
Australian model
4-231-958-3[]
PART No.
7
HCD-PX333
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
For CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
For MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
checking it for adjustment. It is feared that you will lose your sight.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
The following caution label is located inside the unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
SECTION 1
SERVICING NOTES
(Figure A)
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type
anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande föreskrifter.
Använd samma batterityp eller en likvärdig typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande föreskrifter.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer’s instructions.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer’s instructions.
CLEANING OBJECTIVE LENS OF OPTICAL PICK-UP
• In cleaning the objective lens of optical pick-up, be sure the
following below.
1. In cleaning the lens, do not apply an excessive force.
As the optical pick-up is vulnerable, application of excessive
force could damage the lens holder.
force could damage the lens holder.
2. In cleaning, do not use a cleaner other than exclusive cleaning
liquid (KK-91 or isopropyl alcohol).
3. Wipe the objective lens spirally from center toward outside. (See
Figure A)
4. Eject the disk, if loaded.
5. Disconnect the power cord from the socket to shut off the power
5. Disconnect the power cord from the socket to shut off the power
supply.
6. When cleaning the objective lens of optical pick-up in CD, refer
to “HOLDER (BU) ASS’Y” on page XX for removing
HOLDER (BU) ASS’Y.
HOLDER (BU) ASS’Y.
8
HCD-PX333
SERVICE POSITION
• In checking the MD mechanism deck section (MDM-7X2A), prepare two extension jigs (Part No. J-2501-100-A: 1.00 mm 27 core and
Part No. J-2501-198-A: 1.00 mm 17 core).
• In checking the CD mechanism deck section (CDM55A-21BD53), prepare extension jig (Part No. J-2501-075-A: 1.00 mm 21 core.)
MD mechanism deck section
(MDM-7X2A)
(MDM-7X2A)
CN103
BD (MD) board
CD mechanism deck section
(CDM55A-21BD53)
(CDM55A-21BD53)
Connect extension jig (J-2501-198-A) to the
BD (MD) board (CN103) and MD DIGITAL board (CN1004).
BD (MD) board (CN103) and MD DIGITAL board (CN1004).
Connect extension jig (J-2501-100-A) to the
BD (MD) board (CN102) and MD DIGITAL board (CN1003).
BD (MD) board (CN102) and MD DIGITAL board (CN1003).
CN1004
CN1003
CN101
BD (CD) board
CN1005
CN1002
MD DIGITAL board
Connect extension jig (J-2501-075-A)
to the BD (CD) board (CN101) and
MD DIGITAL board (CN1002).
to the BD (CD) board (CN101) and
MD DIGITAL board (CN1002).
CN1005
Pin
2
(GND)
Pin
3
(OUTSW)
CN102
harness
Note on Checking CD Mechanism Deck Section
In performing the operation check with the CD mechanism deck section removed from the main unit, the CD disc loading will be disabled if
the connector cable between MD DIGITAL board (CN1005) and LOADING board (CN151) is disconnected. Accordingly, make preparation
through the following steps.
1. Insert the CD disc for test with the set assembled.
2. Unplug the AC power cord to turn the power off, and remove the CD mechanism deck section. (Disconnect the connector cable between
the connector cable between MD DIGITAL board (CN1005) and LOADING board (CN151) is disconnected. Accordingly, make preparation
through the following steps.
1. Insert the CD disc for test with the set assembled.
2. Unplug the AC power cord to turn the power off, and remove the CD mechanism deck section. (Disconnect the connector cable between
MD DIGITAL board (CN1005) and LOADING board (CN151), and also the connector cable between MD DIGITAL board (CN1002)
and BD (CD) board (CN101))
and BD (CD) board (CN101))
3. Connect the CN1005 pin 3 (OUTSW) and pin 2 (GND) on the MD DIGITAL board with a lead wire.
4. Connect the connectors between MD DIGITAL board (CN1002) and BD (CD) board (CN101) with the extension tool (part No.: J-2501-
4. Connect the connectors between MD DIGITAL board (CN1002) and BD (CD) board (CN101) with the extension tool (part No.: J-2501-
075-A).
Note 1:
Under this condition, the CD can be played but the disc loading operation is disabled.
Note 2:
After checking, disconnect the lead wire connected in step 3.
9
HCD-PX333
JIG FOR CHECKING BD (MD) BOARD WAVEFORM
The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking items
to be performed are shown as follows.
to be performed are shown as follows.
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP : For measuring IOP (Check the deterioration of the optical pick-up laser)
GND : Ground
TE
IOP : For measuring IOP (Check the deterioration of the optical pick-up laser)
GND : Ground
TE
: Tracking error signal (Traverse adjustment)
FE
: Focus error signal
VC
: Reference level for checking the signal
RF
: RF signal (Check jitter)
I+3V
CN105
IOP
TE
VC
GND
FE
RF
I+3V
IOP
GND
TE
FE
VC
RF
IOP
GND
TE
FE
VC
RF
I+3V
IOP
GND
TE
FE
FE
VC
RF
1
7
for
MDM-7X2A
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