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This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

The following caution label is located inside the apparatus.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Mass
Amplifier/Tuner/Tape/MD/CD section:

Approx. 5.6 kg

Design and specifications are subject to change 
without notice.

Amplifier/Tuner/Tape/MD/CD section:

Approx. 160  

× 217  ×  345 

mm

Dimensions (w/h/d) incl. projecting parts and controls 

3

························································ 10

········································································ 14

······························································ 16

3-1.

Top Panel Section ······················································· 17

3-2.

Cassette Mechanism Deck ········································· 18

3-3.

Front Panel Section ···················································· 18

3-4.

PANEL Board, HP Board, LED Board ······················ 19

3-5.

Back Panel Section ····················································· 20

3-6.

MAIN Board ······························································ 20

3-7.

MD Mechanism Deck (MDM-7S2D) ························ 21

3-8.

DIGITAL Board ························································· 21

3-9.

Holder Assy ································································ 22

3-10. BD (MD) Board ························································· 22
3-11. Motor Section ····························································· 23
3-12. Over Write Head (HR901) ········································· 23
3-13. Mini Disc Device (KMS-262E) ································· 24
3-14. POWER Board, Tuner (FM/AM) ······························· 24
3-15. REG Board, AMP Board ············································ 25
3-16. TRANS Board ···························································· 25
3-17. CD Mechanism Deck (CDM55A-30BBD61B) ········· 26
3-18. Cam (CDM55) ··························································· 26
3-19. Base Unit (BU-30BBD61B) ······································ 27
3-20. Optical Pick-Up (BU-30B Assy) ································ 27

···································································· 28

TAPE SECTION ·································································· 33
CD SECTION ······································································ 35
MD SECTION ····································································· 36

6-1.

Circuit Boards Location ············································· 47

6-2.

Block Diagrams
– CD Section – ··························································· 48
– MD Section – ·························································· 49
– USB Section – ························································· 50
– MAIN Section – ······················································ 51

6-3.

Printed Wiring Board – BD (CD) Board – ················· 52

6-4.

Schematic Diagram – BD (CD) Board – ··················· 53

6-5.

Printed Wiring Board – BD (MD) Board – ················ 54

6-6.

Schematic Diagram – BD (MD) Board (1/2) – ·········· 55

6-7.

Schematic Diagram – BD (MD) Board (2/2) – ·········· 56

6-8.

Printed Wiring Board – DIGITAL Board – ················ 57

6-9.

Schematic Diagram – DIGITAL Board (1/2) – ·········· 58

6-10. Schematic Diagram – DIGITAL Board (2/2) – ·········· 59
6-11. Printed Wiring Board – TC Board – ·························· 60
6-12. Schematic Diagram – TC Board – ····························· 61
6-13. Printed Wiring Board – MAIN Section – ··················· 62
6-14. Schematic Diagram – MAIN Section (1/2) – ············· 63
6-15. Schematic Diagram – MAIN Section (2/2) – ············· 64
6-16. Printed Wiring Board – HP Board – ·························· 65
6-17. Schematic Diagram – HP Board – ····························· 66
6-18. Printed Wiring Board – PANEL Section – ················· 67
6-19. Schematic Diagram – PANEL Section – ···················· 68
6-20. Printed Wiring Board

– REG Board / TRANS Board – ································ 69

6-21. Schematic Diagram – REG Board / TRANS Board – 70
6-22. Printed Wiring Board – AMP Board – ······················· 71
6-23. Schematic Diagram – AMP Board – ·························· 72
6-24. Printed Wiring Board – POWER Board – ·················· 73
6-25. Schematic Diagram – POWER Board – ···················· 74
6-26. IC Pin Function Description ······································ 84

7-1.

Overall Section ··························································· 90

7-2.

Front Panel Section ···················································· 91

7-3.

Chassis Section ·························································· 92

7-4.

MD Mechanism Deck Section-1 (MDM-7S2D) ········ 93

7-5.

MD Mechanism Deck Section-2 (MDM-7S2D) ········ 94

7-6.

CD Mechanism Deck Section
(CDM55A-30BBD61B) ············································· 95

7-7.

Base Unit Section (BU-30BBD61B) ························· 96

······································· 97

4

This system has a Self-diagnosis display 
function to let you know if there is a system 
malfunction. The display shows a code made up 
of three or five letters and a message alternately 
to show you the problem. To solve the problem 
refer to the following list. If any problem 
persists, consult your nearest Sony dealer. 

The MD is protected against erasure.

c Remove the MD and slide the tab to close the slot 

(page 15).

You tried to record a CD with a format that the 
system does not support, such as a CD-ROM.

c Remove the disc and turn off the system once, 

then turn it on again.

Recording could not be performed properly.

c Move the system to a stable place, and start 

recording over from the beginning.

The MD is dirty or scratched, or the MD does not 
meet the standards.

c Replace the MD and start recording over from the 

beginning.

The MD deck cannot read the disc information 
properly.

c Remove the MD once, then insert it again.

The MD deck cannot read the disc information 
properly.

c Replace the MD.

c Erase all the recorded contents of the MD using 

the All Erase Function (page 29).

The sound source is a copy of a commercially 
available music software or CD-R.

cThe Serial Copy Management System prevents 

making a digital copy (page 64). In addition, you 
cannot copy from a CD-R.

No component is connected to the DIGITAL 
OPTICAL IN jack, or you tried to record from th e 
digital component which is not connected correctly. 

cConnect the optional digital component correctly 

to the DIGITAL OPTICAL IN jack using the 
digital optical cable (not supplied) (page 52).

The power of the connected component is not turned 
on.

cCheck if the power of the connected digital 

component is on. Refer to the operating 
instructions supplied with the component.

The digital optical cable is disconnected, or the 
power of the connected component is turned off 
while recording the digital audio from the 
component connected to the DIGITAL OPTICAL 
IN jack.

cConnect the digital optical cable, or turn on the 

power of the connected component.

The component has internal problem.

cConsult your nearest Sony dealer.

There is a problem with the laser pickup.

cThe laser pickup may be damaged. Consult your 

nearest Sony dealer.

There is a problem with loading.

cConsult your nearest Sony dealer.

5

One of the following messages may appear or 
flash in the display during operation.

You tried to label a CD-TEXT di sc.

There is no disc in the player.

There are already 50 disc titles stored in the system.

You have reached the end of the disc while pressing 
M during playback or pause.

You tried to program 26 or more tracks (steps).

All the tracks on an MD are registered into groups.

The MD deck is pausing the recording because 
silence continued for 30 seconds or more during 
digital recording.

The inserted recordable MD is new, or all tracks on 
the MD have been erased.

• A pre-mastered MD is in the deck.

• You tried to edit in Program or Shuffle Play mode.

• The track is recorded in MDLP mode.

• A pre-mastered MD is in the deck.

• The function is switched to MD or PC.

• There is no disc in the MD deck, or the MD is 

protected against erasure.

• There is no time remaining on the MD.

The editing operation of the MD is completed.

There is no time remaining on the MD.

The MD deck is ejecting the MD. 

An attempt was made to create a new group in 
excess of the maximum number of groups, or there 
are insufficient characters for updating the group 
management information.

• You tried to make an impossible editing 

operation.

• You cannot perform Net MD operations during 

timer playback.

• You cannot combine or erase the tracks due to the 

system limitations of MDs.

Adjustment of the recording level after recording or 
Fade-in and Fade-out procedures have failed since 
the system was either subject to vibration or there is 
a damaged or dirty disc in the tray. 

The power was off for a long time, so the system is 
initializing itself.

There is no more space to store track, disc or group 
titles.

While attempting to change the recording level after 
recording, you pressed ENTER/YES without 
actually changing the recording level, so no change 
was made.

There is no disc in the MD deck.

You have reached the end of the MD while pressing 
M during pause mode.

You pressed an invalid button during playback. 

The MD is playing the specified point for 
confirmation during the A-B Erase Function and the 
Divide Function (pages 30 and 33).

A reading failure has occurred, and the system is 
trying to read the data again.

You attempted to perform another operation while 
in S.F Edit (changing the recording level after 
recording, Fade-in, Fade-out) mode.