DOWNLOAD Sony CMT-M100MD / HCD-M10 Service Manual ↓ Size: 7.05 MB | Pages: 92 in PDF or view online for FREE

Model
CMT-M100MD HCD-M10
Pages
92
Size
7.05 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cmt-m100md-hcd-m10.pdf
Date

Sony CMT-M100MD / HCD-M10 Service Manual ▷ View online

5
HCD-M10
1. SERVICING  NOTES
······················································ 6
2. GENERAL
········································································ 10
3. DISASSEMBLY
······························································ 12
4. TEST  MODE
··································································· 22
5. ELECTRICAL  ADJUSTMENTS
······························ 27
6. DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION ····································· 41
6-2. BLOCK DIAGRAM – CD BOARD – ······························ 42
BLOCK DIAGRAM – MD BOARD – ····························· 43
BLOCK DIAGRAM – MAIN BOARD – ························· 44
BLOCK DIAGRAM – PANEL BOARD – ······················· 45
6-3. PRINTED WIRING BOARD – CD BOARD – ················ 46
6-4. SCHEMATIC DIAGRAM – CD BOARD – ····················· 47
6-5. PRINTED WIRING BOARD – BD BOARD – ················ 48
6-6. SCHEMATIC DIAGRAM – BD BOARD (1/2) – ············ 49
6-7. SCHEMATIC DIAGRAM – BD BOARD (2/2) – ············ 50
6-8. SCHEMATIC DIAGRAM – MAIN OARD (1/2) – ·········· 51
6-9. SCHEMATIC DIAGRAM
  – MAIN BOARD (2/2), LOADING BOARD – ················ 52
6-10. PRINTED WIRING BOARD
  –  MAIN BOARD,LOADING BOARD – ························· 53
6-11. PRINTED WIRING BOARD – MD DIGITAL BOARD –54
6-12. SCHEMATIC DIAGRAM – MD DIGITAL BOARD – ··· 55
6-13. PRINTED WIRING BOARD – TC BOARD – ················ 56
6-14 SCHEMATIC DIAGRAM – TC BOARD – ····················· 57
6-15. PRINTED WIRING BOARDS
  – PANEL BOARD, BL (AMBER), BL (WHITE),
     JACK BOARD – ······························································ 58
6-16 SCHEMATIC DIAGRAM
  – PANEL BOARD, BL (AMBER), BL (WHITE),
     JACK BOARD – ······························································ 59
6-17. PRINTED WIRING BOARD
   – AMP BOARD, POWER BOARD – ······························ 60
6-18. SCHEMATIC DIAGRAM – AMP BOARD – ·················· 61
6-19. SCHEMATIC DIAGRAM – POWER BOARD – ············ 62
6-20. IC PIN FUNCTION DESCRIPTION ································ 63
7. EXPLODED  VIEWS
····················································· 72
8. ELECTRICAL  PARTS  LIST
····································· 80
TABLE  OF  CONTENTS
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
0
 OR DOTTED LINE WITH
MARK 
0
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
CD
Cannot Edit
You tried to label a CD TEXT disc.
CD No Disc
There is no CD in the player.
Complete!
The editing operation of CD is completed.
Name Full
There are already 50 disc titles stored in the
system.
OVER
You  have reached the end of the CD while
pressing M during play or pause.
Step Full!
You  tried to programme 26 or more tracks (steps).
TAPE
Cannot SYNC!
There is no tape in the tape deck, or the tab has
been removed from the cassette.
No Tab
You  cannot record the tape because the tab has
been removed from the cassette.
No Tape
There is no tape in the tape deck.
6
HCD-M10
SECTION 1
SERVICING NOTE
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Note for Speaker Terminals
The negative speaker outputs are not grounded bevause of the
balanced transformerless circuit.
(If connecting them to ground, or each other, the circuit is broken)
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
FOR CD
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
FOR MD
NOTES  ON  LASER  DIODE  EMISSION  CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
This caution
label is
located inside
the unit.
• DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure :
1.
Press two buttons of   ENTER/START   and   OPEN/CLOSE
(CD section) simultaneously.
2.
The message “UNLOCKED” is displayed and the tray is
unlocked.
Note : When “LOCKED” is displayed, the tray lock is not released
    by turning power on/off with the  POWER  button.
Ver 1.2  2002.05
7
HCD-M10
DRAWING OUT THE TRAY DURING POWER OUT
tray
gear(B)
First turn the whole of cam block in the arrow 
A
 direction with fingers, 
then put out tray by turning gear (B) in the arrow 
B
 direction.
• Perform after removing front panel.
B
A
cam block
CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD
Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.
Details of the procedures are described in “Section 5  Electrical Adjustments”.
Note:
The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments.
When performing adjustments, use the specified values for adjustments.
• 0.9 mW power
Specified value : 0.80 to 0.96 mW
• 7.0 mW power
Specified value : 6.8 to 7.2 mW
Iop (at 7.0mW)
• Labeled on the optical pick-up
Iop value 
±
 10mA
• Unsatisfactory if displayed as “NG : XXXX”NG
(XXXX are arbitrary numbers)
• Unsatisfactory if displayed as “T=@@ (##) [NG]”
NG
(@@, ## are both arbitrary numbers)
Laser power check
(6-2 : See page 33)
Auto check
(6-4 : See page 34)
Temperature
compensation
offset check
(6-1 : See page 33)
Criteria for Determination
(Unsatisfactory if specified value is not satisfied)
• Clean the optical pick-up
• Adjust again
• Replace the optical pick-up
• Replace the optical pick-up
• Replace the optical pick-up
• Check for disconnection of the circuits around
D101 (BD board)
• Check the signals around IC101, IC151, CN102,
CN103 (BD board)
Measure if unsatisfactory
8
HCD-M10
JIG FOR CHECKING BD (MD) BOARD WAVEFORM
The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking items
to be performed are shown as follows.
GND : Ground
I+3V : For measuring Iop (Check the deterioration of the optical pick-up laser)
Iop
: For measuring Iop (Check the deterioration of the optical pick-up laser)
TE
: TRK error signal (Traverse adjustment)
VC
: Reference level for checking the signal
RF
: RF signal (Check jitter)
FE
: Focus error signal
I+3V
CN105
Iop
TE
VC
GND
FE
RF
I+3V
Iop
GND
TE
FE
VC
RF
I+3V
Iop
GND
TE
FE
VC
RF
1
7
for
MDM-7B4M
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