Sony CMT-M100MD / HCD-M10 Service Manual ▷ View online
4
HCD-M10
Self-diagnosis display (continued)
Complete!
The editing operation of MDs is completed.
Disc Full!
There is no time remaining on the MD.
Eject
The MD deck is ejecting the MD.
Group Full!
An attempt was made to create a new group in
excess of the maximum number of groups, or there
are insufficient characters for updating the group
management information.
excess of the maximum number of groups, or there
are insufficient characters for updating the group
management information.
Impossible
• You tried to make an impossible editing
operation.
• You cannot combine or erase the tracks due to
the system limitations of MDs.
• You cannot specify the division point at the
beginning or end of a track.
Incomplete!
Adjustment of the recording level after recording
or Fade-in and Fade-out procedures have failed
since the system was either subject to vibration or
there is a damaged or dirty disc in the tray. Place
the system in a stable place to minimize shock and
vibration. Do not use damaged or dirty discs.
or Fade-in and Fade-out procedures have failed
since the system was either subject to vibration or
there is a damaged or dirty disc in the tray. Place
the system in a stable place to minimize shock and
vibration. Do not use damaged or dirty discs.
Initialize
The power was off for a long time, so the system is
initializing itself.
initializing itself.
Name Full
There is no more space to store track, disc or group
titles.
titles.
No Change
While attempting to change the recording level
after recording, you pressed ENTER/YES without
actually changing the recording level, so no change
was made.
after recording, you pressed ENTER/YES without
actually changing the recording level, so no change
was made.
No Disc
There is no disc in the MD deck.
OVER
You have reached the end of the MD while
pressing M during playing pause.
pressing M during playing pause.
Step Full!
You tried to programme 26 or more tracks (steps).
Push STOP!
You pressed PLAY MODE/DIRECTION (or
PLAY MODE on the remote) during play.
PLAY MODE on the remote) during play.
—Rehearsal—
The MD is playing the specified dividing point for
confirmation during the A-B Erase Function and
the Divide Function.
confirmation during the A-B Erase Function and
the Divide Function.
S.F Edit!
You attempted to perform another operation while
in S.F Edit (changing the recording level after
recording, Fade-in, Fade-out) mode.
in S.F Edit (changing the recording level after
recording, Fade-in, Fade-out) mode.
S.F Edit NOW
You pressed =/1 while in S.F Edit (changing the
recording level after recording, Fade-in, Fade-out)
mode.
recording level after recording, Fade-in, Fade-out)
mode.
Smart Space
The signal was input again after silence continued
for 3 or more but less than 30 seconds during
digital recording.
for 3 or more but less than 30 seconds during
digital recording.
Text Protect
There is CD TEXT information which cannot be
recorded on the MD.
recorded on the MD.
TOC Reading
The MD deck is reading the TOC information of
the MD.
the MD.
TOC Writing
The MD deck is writing the information of
recorded or edited contents.
recorded or edited contents.
Track End
You have reached the end of the track while
adjusting the dividing point during the Divide
Function.
adjusting the dividing point during the Divide
Function.
Tr Protect
You attempted to erase a protected track.
5
HCD-M10
1. SERVICING NOTES
······················································ 6
2. GENERAL
········································································ 10
3. DISASSEMBLY
······························································ 12
4. TEST MODE
··································································· 22
5. ELECTRICAL ADJUSTMENTS
······························ 27
6. DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION ····································· 41
6-2. BLOCK DIAGRAM – CD BOARD – ······························ 42
6-2. BLOCK DIAGRAM – CD BOARD – ······························ 42
BLOCK DIAGRAM – MD BOARD – ····························· 43
BLOCK DIAGRAM – MAIN BOARD – ························· 44
BLOCK DIAGRAM – PANEL BOARD – ······················· 45
BLOCK DIAGRAM – MAIN BOARD – ························· 44
BLOCK DIAGRAM – PANEL BOARD – ······················· 45
6-3. PRINTED WIRING BOARD – CD BOARD – ················ 46
6-4. SCHEMATIC DIAGRAM – CD BOARD – ····················· 47
6-5. PRINTED WIRING BOARD – BD BOARD – ················ 48
6-6. SCHEMATIC DIAGRAM – BD BOARD (1/2) – ············ 49
6-7. SCHEMATIC DIAGRAM – BD BOARD (2/2) – ············ 50
6-8. SCHEMATIC DIAGRAM – MAIN OARD (1/2) – ·········· 51
6-9. SCHEMATIC DIAGRAM
6-4. SCHEMATIC DIAGRAM – CD BOARD – ····················· 47
6-5. PRINTED WIRING BOARD – BD BOARD – ················ 48
6-6. SCHEMATIC DIAGRAM – BD BOARD (1/2) – ············ 49
6-7. SCHEMATIC DIAGRAM – BD BOARD (2/2) – ············ 50
6-8. SCHEMATIC DIAGRAM – MAIN OARD (1/2) – ·········· 51
6-9. SCHEMATIC DIAGRAM
– MAIN BOARD (2/2), LOADING BOARD – ················ 52
6-10. PRINTED WIRING BOARD
– MAIN BOARD,LOADING BOARD – ························· 53
6-11. PRINTED WIRING BOARD – MD DIGITAL BOARD –54
6-12. SCHEMATIC DIAGRAM – MD DIGITAL BOARD – ··· 55
6-13. PRINTED WIRING BOARD – TC BOARD – ················ 56
6-14 SCHEMATIC DIAGRAM – TC BOARD – ····················· 57
6-15. PRINTED WIRING BOARDS
6-12. SCHEMATIC DIAGRAM – MD DIGITAL BOARD – ··· 55
6-13. PRINTED WIRING BOARD – TC BOARD – ················ 56
6-14 SCHEMATIC DIAGRAM – TC BOARD – ····················· 57
6-15. PRINTED WIRING BOARDS
– PANEL BOARD, BL (AMBER), BL (WHITE),
JACK BOARD – ······························································ 58
JACK BOARD – ······························································ 58
6-16 SCHEMATIC DIAGRAM
– PANEL BOARD, BL (AMBER), BL (WHITE),
JACK BOARD – ······························································ 59
JACK BOARD – ······························································ 59
6-17. PRINTED WIRING BOARD
– AMP BOARD, POWER BOARD – ······························ 60
6-18. SCHEMATIC DIAGRAM – AMP BOARD – ·················· 61
6-19. SCHEMATIC DIAGRAM – POWER BOARD – ············ 62
6-20. IC PIN FUNCTION DESCRIPTION ································ 63
6-19. SCHEMATIC DIAGRAM – POWER BOARD – ············ 62
6-20. IC PIN FUNCTION DESCRIPTION ································ 63
7. EXPLODED VIEWS
····················································· 72
8. ELECTRICAL PARTS LIST
····································· 80
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
CD
Cannot Edit
You tried to label a CD TEXT disc.
CD No Disc
There is no CD in the player.
Complete!
The editing operation of CD is completed.
Name Full
There are already 50 disc titles stored in the
system.
system.
OVER
You have reached the end of the CD while
pressing M during play or pause.
pressing M during play or pause.
Step Full!
You tried to programme 26 or more tracks (steps).
TAPE
Cannot SYNC!
There is no tape in the tape deck, or the tab has
been removed from the cassette.
been removed from the cassette.
No Tab
You cannot record the tape because the tab has
been removed from the cassette.
been removed from the cassette.
No Tape
There is no tape in the tape deck.
6
HCD-M10
SECTION 1
SERVICING NOTE
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Note for Speaker Terminals
The negative speaker outputs are not grounded bevause of the
balanced transformerless circuit.
(If connecting them to ground, or each other, the circuit is broken)
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
FOR CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
FOR MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
checking it for adjustment. It is feared that you will lose your sight.
This caution
label is
located inside
the unit.
label is
located inside
the unit.
• DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Releasing Procedure :
1.
1.
Press two buttons of ENTER/START and OPEN/CLOSE
(CD section) simultaneously.
(CD section) simultaneously.
2.
The message “UNLOCKED” is displayed and the tray is
unlocked.
unlocked.
Note : When “LOCKED” is displayed, the tray lock is not released
by turning power on/off with the POWER button.
Ver 1.2 2002.05
7
HCD-M10
DRAWING OUT THE TRAY DURING POWER OUT
tray
gear(B)
First turn the whole of cam block in the arrow
A
direction with fingers,
then put out tray by turning gear (B) in the arrow
B
direction.
• Perform after removing front panel.
B
A
cam block
CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD
Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.
Details of the procedures are described in “Section 5 Electrical Adjustments”.
Details of the procedures are described in “Section 5 Electrical Adjustments”.
Note:
The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments.
When performing adjustments, use the specified values for adjustments.
When performing adjustments, use the specified values for adjustments.
• 0.9 mW power
Specified value : 0.80 to 0.96 mW
• 7.0 mW power
Specified value : 6.8 to 7.2 mW
Iop (at 7.0mW)
• Labeled on the optical pick-up
Iop value
±
10mA
• Unsatisfactory if displayed as “NG : XXXX”NG
(XXXX are arbitrary numbers)
• Unsatisfactory if displayed as “T=@@ (##) [NG]”
NG
(@@, ## are both arbitrary numbers)
Laser power check
(6-2 : See page 33)
Auto check
(6-4 : See page 34)
Temperature
Temperature
compensation
offset check
(6-1 : See page 33)
Criteria for Determination
(Unsatisfactory if specified value is not satisfied)
(Unsatisfactory if specified value is not satisfied)
• Clean the optical pick-up
• Adjust again
• Replace the optical pick-up
• Replace the optical pick-up
• Replace the optical pick-up
• Check for disconnection of the circuits around
D101 (BD board)
• Check the signals around IC101, IC151, CN102,
CN103 (BD board)
Measure if unsatisfactory
