Sony CMT-LX30IR / HCD-LX30IR Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-LX30iR
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-469-03
2009K05-1
©
2009.11
AEP Model
Australian Model
Chinese Model
Singapore Model
Korean Model
Thai Model
Ver. 1.2 2009.11
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM80BT-F4BD94UR-WOD
Base Unit Name
BU-F4BD94UR-WOD
Optical Pick-up Block Name
KSM-215CFP
• HCD-LX30iR is the amplifi er, USB, CD player,
tuner and iPod section in CMT-LX30iR.
iPod is a trademark of Apple Inc.,
registered in the U.S. and other
countries.
countries.
MPEG Layer-3 audio coding
technology and patents licensed from
Fraunhofer IIS and Thomson.
Fraunhofer IIS and Thomson.
Windows Media is a registered
trademark of Microsoft Corporation
in the United States and/or other
countries.
in the United States and/or other
countries.
European model:
DIN power output (rated):
4 + 4 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference):
5 + 5 watts (4 ohms at 1 kHz, 10%
THD)
Music power output (reference):
9 + 9 watts (4 ohms at 1 kHz, 10%
THD)
4 + 4 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference):
5 + 5 watts (4 ohms at 1 kHz, 10%
THD)
Music power output (reference):
9 + 9 watts (4 ohms at 1 kHz, 10%
THD)
Other models:
DIN power output (rated):
4 + 4 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference):
5 + 5 watts (4 ohms at 1 kHz, 10%
THD)
4 + 4 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference):
5 + 5 watts (4 ohms at 1 kHz, 10%
THD)
Inputs
AUDIO IN (stereo mini jack):
Voltage 775 mV, impedance
22 kilohms
22 kilohms
Outputs
PHONES (stereo mini jack):
accepts headphones with an
impedance of 8 ohms or more
impedance of 8 ohms or more
SPEAKER: accepts impedance of 4 ohms
USB section
Supported bit rate:
MP3 (MPEG 1 Audio Layer-3):
32 – 320 kbps, VBR
WMA: 32 – 192 kbps, VBR
AAC: 48 – 320 kbps
32 – 320 kbps, VBR
WMA: 32 – 192 kbps, VBR
AAC: 48 – 320 kbps
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
(USB) port:
Maximum current:
500 mA
500 mA
CD player section
System:
Compact disc and digital audio
system
system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
Laser Output*: Less than 44.6μW
a distance of 200mm from the objective
lens surface on the Optical Pick-up
Block with 7mm aperture.
lens surface on the Optical Pick-up
Block with 7mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section:
Tuning range:
87.5 – 108.0 MHz (50 kHz step)
Antenna: FM lead antenna
Intermediate frequency: 10.7 MHz
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range:
European model:
531 – 1,602 kHz (9 kHz step)
Australian model:
531 – 1,710 kHz (9 kHz step)
530 – 1,710 kHz (10 kHz step)
Other models:
531 – 1,602 kHz (9 kHz step)
530 – 1,610 kHz (10 kHz step)
531 – 1,602 kHz (9 kHz step)
Australian model:
531 – 1,710 kHz (9 kHz step)
530 – 1,710 kHz (10 kHz step)
Other models:
531 – 1,602 kHz (9 kHz step)
530 – 1,610 kHz (10 kHz step)
Antenna: AM loop antenna
Intermediate frequency: 450 kHz
Intermediate frequency: 450 kHz
General
Power requirements
European model: 230 V AC, 50/60 Hz
Australian model: 230 – 240 V AC,
50/60 Hz
Chinese, Korean, and Thai models:
220 V AC, 50/60 Hz
Other models: 220 – 240 V AC, 50/60
Hz
Australian model: 230 – 240 V AC,
50/60 Hz
Chinese, Korean, and Thai models:
220 V AC, 50/60 Hz
Other models: 220 – 240 V AC, 50/60
Hz
Power consumption: 28 watts
Dimensions (w/h/d) (excl. speakers):
Dimensions (w/h/d) (excl. speakers):
Approx. 200 × 221 × 205 mm
Mass (excl. speakers): Approx. 2.2 kg
change without notice.
iPod touch 2nd
generation
iPod nano 4th
generation
(video)
iPod touch 1st
generation
iPod nano 3rd
generation
(video)
iPod classic
iPod nano 2nd
generation
(aluminum)
iPod 5th
generation
(video)
iPod nano 1st
generation
iPod 4th
generation
(color display)
iPod 4th
generation
iPod mini
iPod section Compatible iPod models:
HCD-LX30iR
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classified as a CLASS 1
LASER product. This marking is located
on the rear exterior.
LASER product. This marking is located
on the rear exterior.
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 5
2-2. Panel (Back), Panel (Front) Block .................................. 5
2-3. PANEL
2-3. PANEL
Board
................................................................. 6
2-4. CD Mechanism Block
(CDM80BT-F4BD94UR-WOD) .................................... 6
2-5. MAIN
Board
................................................................... 7
2-6. Belt
(MOT)
..................................................................... 7
2-7. Base Unit (BU-F4BD94UR-WOD) ................................ 8
3.
TEST MODE
............................................................
9
4. ELECTRICAL
ADJUSTMENTS
........................ 11
5. DIAGRAMS
5-1. Block Diagram - CD, TUNER Section - ........................ 12
5-2. Block Diagram - USB Section - ..................................... 13
5-3. Block Diagram - MAIN Section - ................................... 14
5-4. Printed Wiring Board - CD Board - ................................ 16
5-5. Schematic Diagram - CD Board - ................................... 17
5-6. Printed Wiring Boards - USB Section - .......................... 18
5-7. Schematic Diagram - USB Section - .............................. 19
5-8. Printed Wiring Boards - MAIN Section - ....................... 20
5-9. Schematic Diagram - MAIN Section (1/3) - ................... 21
5-10. Schematic Diagram - MAIN Section (2/3) - ................... 22
5-11. Schematic Diagram - MAIN Section (3/3) - ................... 23
5-12. Printed Wiring Boards - PANEL Section - ..................... 24
5-13. Schematic Diagram - PANEL Section - .......................... 25
5-14. Printed Wiring Boards
5-2. Block Diagram - USB Section - ..................................... 13
5-3. Block Diagram - MAIN Section - ................................... 14
5-4. Printed Wiring Board - CD Board - ................................ 16
5-5. Schematic Diagram - CD Board - ................................... 17
5-6. Printed Wiring Boards - USB Section - .......................... 18
5-7. Schematic Diagram - USB Section - .............................. 19
5-8. Printed Wiring Boards - MAIN Section - ....................... 20
5-9. Schematic Diagram - MAIN Section (1/3) - ................... 21
5-10. Schematic Diagram - MAIN Section (2/3) - ................... 22
5-11. Schematic Diagram - MAIN Section (3/3) - ................... 23
5-12. Printed Wiring Boards - PANEL Section - ..................... 24
5-13. Schematic Diagram - PANEL Section - .......................... 25
5-14. Printed Wiring Boards
- AUDIO IN/OUT, KEY, POWER SUPPLY Section - ... 26
5-15. Schematic Diagram
- AUDIO IN/OUT, KEY, POWER SUPPLY Section - ... 27
6.
EXPLODED VIEWS
6-1. Panel (Back) Section ....................................................... 38
6-2. Panel (Front) Section ...................................................... 39
6-3. Stage (Top) Section ......................................................... 40
6-4. MAIN Board Section ...................................................... 41
6-5. CD Mechanism Section
6-2. Panel (Front) Section ...................................................... 39
6-3. Stage (Top) Section ......................................................... 40
6-4. MAIN Board Section ...................................................... 41
6-5. CD Mechanism Section
(CDM80BT-F4BD94UR-WOD) .................................... 42
6-6. Base Unit Section (BU-F4BD94UR-WOD) ................... 43
7.
ELECTRICAL PARTS LIST
.............................. 44
TABLE OF CONTENTS
Ver. 1.1
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HCD-LX30iR
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE DRIVER BOARD
When the DRIVER board is damaged, exchange the entire
CDM80BT.
When the DRIVER board is damaged, exchange the entire
CDM80BT.
RELEASING THE DISC SLOT LOCK
The disc slot lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc slot lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?
/1] button to turn the power on.
2. Press the [FUNCTION +] button to select CD function.
3. While pressing the [ENTER] button, press the [Z] button for
3. While pressing the [ENTER] button, press the [Z] button for
more 5 seconds.
4. The message “UNLOCKED” is displayed on the liquid crystal
display and the disc slot is unlocked.
Note: When “LOCKED” is displayed on the liquid crystal display, the slot
lock is not released by turning power on/off with the [?/1] button.
LEAD WIRE SETTING
PT-AC board
Note:
Bundle the lead wire so as not to
touch the power transformer.
Please rotate the pully in the direction of the arrow
after removing mechanism deck, and eject the disc.
after removing mechanism deck, and eject the disc.
– CD mechanism block bottom view –
disc
CD mechanism block
HOW TO EJECT THE DISC WHEN POWER SWITCH TURNS OFF
Note: Please take out the CD mechanism block from a set refer to DISASSEMBLY (from Page 5).
HCD-LX30iR
4
NOTE OF REPLACING IC453 ON THE PANEL BOARD
IC453 on the PANEL board has been changed in the midway of production.
Sheet (RM) is not installed in former type.
Sheet (RM) is installed in new type.
When replacing IC453 on the PANEL board, refer to the table below.
IC453 on the PANEL board has been changed in the midway of production.
Sheet (RM) is not installed in former type.
Sheet (RM) is installed in new type.
When replacing IC453 on the PANEL board, refer to the table below.
Former type
New type
IC453
IC453
SHEET (RM)
Ref. No.
Part No.
Description
Ref. No.
Part No.
Description
IC453
6-600-684-01 IC NJL22H400B
IC453
6-600-766-01 IC PNA4823M01S0
70
4-159-924-01 SHEET (RM)
Ver. 1.2