Sony CMT-HX30 / HCD-HX30 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio Business Group
Published by Sony Techno Create Corporation
HCD-HX30
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-073-01
2008C05-1
©
2008.03
AEP Model
Ver. 1.0 2008.03
Model Name Using Similar Mechanism
HCD-XH3
Base Unit Name
BU-K6BD90U-WOD
Optical Pick-up Block Name
KSM-213DCP
• HCD-HX30 is the amplifi er, USB, CD player and tuner
section in CMT-HX30.
• “WALKMAN” and “WALKMAN” logo are registered trademarks
of Sony Corporation.
• MICROVAULT is a trademark of Sony Corporation.
• ATRAC, ATRAC3, ATRAC3plus and is a trademark of Sony
Corporation.
• U.S. and foreign patents licensed from Dolby Laboratories.
of Sony Corporation.
• MICROVAULT is a trademark of Sony Corporation.
• ATRAC, ATRAC3, ATRAC3plus and is a trademark of Sony
Corporation.
• U.S. and foreign patents licensed from Dolby Laboratories.
• MPEG Layer-3 audio coding technology and patents licensed
from Fraunhofer IIS and Thomson.
from Fraunhofer IIS and Thomson.
Canadian model:
DIN power output (rated): 40 + 40
watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
European model:
DIN power output (rated): 40 + 40
watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference): 50 +
50 watts (6 ohms at 1 kHz, 10% THD)
watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference): 50 +
50 watts (6 ohms at 1 kHz, 10% THD)
Inputs:
AUDIO IN (stereo mini jack):
voltage 250 mV, impedance
47 kilohms
voltage 250 mV, impedance
47 kilohms
(USB) port: Type A, maximum
current 500 mA
Outputs:
PHONES (stereo mini jack): accepts
headphones of 8 ohms or more
SPEAKER: accepts impedance of
6 ohms
headphones of 8 ohms or more
SPEAKER: accepts impedance of
6 ohms
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32
32
− 320kbps, VBR
ATRAC: 48
− 352 kbps
(ATRAC3plus), 66/105/132 kbps
(ATRAC3)
WMA: 32
(ATRAC3)
WMA: 32
− 192 kbps, VBR
AAC: 48
− 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
ATRAC: 44.1 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
32/44.1/48 kHz
ATRAC: 44.1 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
CD player section
System: Compact disc and digital audio
system
Laser Diode Properties
system
Laser Diode Properties
Emission duration: continuous
Laser Output*: Less than 44.6μW
Laser Output*: Less than 44.6μW
This output is the value measurement
*
at a distance of 200mm from the
objective lens surface on the Optical
Pick-up Block with 7mm aperture.
objective lens surface on the Optical
Pick-up Block with 7mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section:
Tuning range
Tuning range
Canadian model:
87.5 – 108.0 MHz (100 kHz step)
European model:
87.5 – 108.0 MHz (50kHz step)
87.5 – 108.0 MHz (100 kHz step)
European model:
87.5 – 108.0 MHz (50kHz step)
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range:
Tuning range:
531 – 1,602 kHz (with 9 kHz tuning
interval)
interval)
Antenna: AM loop antenna, external
antenna terminal
Intermediate frequency: 450 kHz
antenna terminal
Intermediate frequency: 450 kHz
General
Power requirements:
220 – 240V AC, 50/60 Hz
Power consumption: 40 watts
Dimensions (w/h/d) (excl. speakers):
Approx. 285 × 120 × 215 mm
Mass (excl. speakers): 2.6 kg
Dimensions (w/h/d) (excl. speakers):
Approx. 285 × 120 × 215 mm
Mass (excl. speakers): 2.6 kg
change without notice.
Desing and specifications are subject to
Amplifier section
HCD-HX30
2
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 4
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 6
3-2. Panel
(Top)
...................................................................... 7
3-3. Front Panel Block ........................................................... 7
3-4. MAIN
3-4. MAIN
Board
................................................................... 8
3-5. SWITCHING POWER Board/SUB POWER Board ...... 8
3-6. Loading Mechanism Block ............................................. 9
3-7. Base
3-6. Loading Mechanism Block ............................................. 9
3-7. Base
Unit
......................................................................... 9
3-8. Belt
.................................................................................. 10
3-10. OP Base Assy (KSM-213D) ........................................... 10
4.
TEST MODE
............................................................ 11
5.
ELECTRICAL CHECKS
...................................... 13
6. DIAGRAMS
6-1. Block Diagram - CD SERVO Section - .......................... 15
6-2. Block Diagram - MAIN Section - ................................... 16
6-3. Block Diagram - AMP Section - ..................................... 17
6-4. Block
6-2. Block Diagram - MAIN Section - ................................... 16
6-3. Block Diagram - AMP Section - ..................................... 17
6-4. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 18
6-5. Printed Wiring Boards - CD Section - ............................ 20
6-6. Schematic Diagram - CD Section - ................................. 21
6-7. Printed Wiring Boards - USB Section - .......................... 22
6-8. Schematic Diagram - USB Section - .............................. 23
6-9. Printed Wiring Board - MAIN Section - ......................... 24
6-10. Schematic Diagram - MAIN Section (1/3) - ................... 25
6-11. Schematic Diagram - MAIN Section (2/3) - ................... 26
6-12. Schematic Diagram - MAIN Section (3/3) - ................... 27
6-13. Printed Wiring Board - AMP Section - ........................... 28
6-14. Schematic Diagram - AMP Section - .............................. 29
6-15. Printed Wiring Boards - OUTPUT Section - .................. 30
6-16. Schematic Diagram - OUTPUT Section - ...................... 30
6-17. Printed Wiring Boards - PANEL Section - ..................... 32
6-18. Schematic Diagram - PANEL Section - .......................... 33
6-19. Printed Wiring Boards - POWER SUPPLY Section - .... 34
6-20. Schematic Diagram - POWER SUPPLY Section - ......... 35
6-6. Schematic Diagram - CD Section - ................................. 21
6-7. Printed Wiring Boards - USB Section - .......................... 22
6-8. Schematic Diagram - USB Section - .............................. 23
6-9. Printed Wiring Board - MAIN Section - ......................... 24
6-10. Schematic Diagram - MAIN Section (1/3) - ................... 25
6-11. Schematic Diagram - MAIN Section (2/3) - ................... 26
6-12. Schematic Diagram - MAIN Section (3/3) - ................... 27
6-13. Printed Wiring Board - AMP Section - ........................... 28
6-14. Schematic Diagram - AMP Section - .............................. 29
6-15. Printed Wiring Boards - OUTPUT Section - .................. 30
6-16. Schematic Diagram - OUTPUT Section - ...................... 30
6-17. Printed Wiring Boards - PANEL Section - ..................... 32
6-18. Schematic Diagram - PANEL Section - .......................... 33
6-19. Printed Wiring Boards - POWER SUPPLY Section - .... 34
6-20. Schematic Diagram - POWER SUPPLY Section - ......... 35
7.
EXPLODED VIEWS
7-1. Panel
Section
................................................................... 48
7-2. Chassis
(Top)
Section
..................................................... 49
7-3. Panel Key Section ........................................................... 50
7-4. Front Panel Section ......................................................... 51
7-5. Main
7-4. Front Panel Section ......................................................... 51
7-5. Main
Section
................................................................... 52
7-6. Chassis
Section
............................................................... 53
7-7. Loading Mechanism Section ......................................... 54
7-8. Base Unit Section (BU-K6BD90U-WOD) .................... 55
7-8. Base Unit Section (BU-K6BD90U-WOD) .................... 55
8.
ELECTRICAL PARTS LIST
.............................. 56
TABLE OF CONTENTS
This appliance is classifi ed as a CLASS 1
LASER product. This marking is located
on the rear exterior.
LASER product. This marking is located
on the rear exterior.
HCD-HX30
3
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SECTION 1
SERVICING NOTES
RELEASING THE ANTITHEFT LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. While pressing the [
x/
CANCEL] button, press the [
Z
] but-
ton unit “UNLOCKED” displayed on the fl uorescent indicator
tube (around 5 seconds) .
tube (around 5 seconds) .
Note:
When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the [
?/1] button.
HOW TO OPEN THE TRAY WHEN POWER SWITCH
TURN OFF
TURN OFF
Note:
Please resolve it to the state of the fi gure below referring to 3-2.
Panel (Top) and 3-3. Front Panel Block of DISASSEMBLY.
Slide the boss.
mechanism deck
USB board
HCD-HX30
4
SECTION 2
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
Unit
Front panel
Top panel
Remote
/ (power) button
Press to turn on the system.
Lights up when the system is turned off.
STANDBY indicator
RB
RT
RE
RG
RH
RI
RK
RL
RM
X
XB
XT
XE
R
USB MEMORY indicator
Lights up when an optional USB device
(Digital music player or USB storage
media) is connected.
(Digital music player or USB storage
media) is connected.
Remote sensor
Unit: VOLUME control
Remote: VOLUME +/− button
Turn or press to adjust the volume.
AUDIO IN jack
Connect to an optional audio
component.
component.
PHONES jack
Connect the headphones.
; (open/close) button
Press to open or close the disc tray.
(USB) port
Connect to an optional USB device
(Digital music player or USB storage
media).
(Digital music player or USB storage
media).
Playback buttons and function
buttons
Unit: USB
buttons
Unit: USB
V (play/pause)
button
Press to select the USB function.
Press to start or pause playback of an
optional USB device (Digital music
player or USB storage media).
Press to start or pause playback of an
optional USB device (Digital music
player or USB storage media).
Remote: USB button
Press to select the USB function.
Unit: CD
V (play/pause)
button
Press to select the CD function.
Press to start or pause playback of a disc.
Press to start or pause playback of a disc.
Remote: CD button
Press to select the CD function.
Remote:
/ (play) button,
9 (pause) button
Press to start or pause playback.
TUNER/BAND button
Press to select the TUNER function.
Press to select FM or AM reception
mode.
Press to select FM or AM reception
mode.
Unit: AUDIO IN button
Press to select the AUDIO IN function.
FUNCTION button
Press to select the function.
Unit:
Y/CANCEL (stop/cancel)
button
Remote:
Remote:
Y (stop) button
Press to stop playback.
Press to cancel search.
Press to cancel search.
SEARCH button
Press to enter or exit search mode.
ENTER button
Press to enter the settings.
Press to select a track od file.
/ (go back/go forward)
button
button
Unit: TUNE +/− (tuning) button
Remote: +/− (tuning) button
Remote: +/− (tuning) button
Press to tune in the desired station.
+/− (select folder) button
Press to select a folder.
Press to find a point in a track or file.
N/. (rewind/fast forward)
button
button
PLAY MODE/TUNING MODE
button
button
Press to select the play mode of a CD,
MP3 disc or an optional USB device
(Digital music player or USB storage
media).
Press to select the tuning mode.
MP3 disc or an optional USB device
(Digital music player or USB storage
media).
Press to select the tuning mode.
Press to select the sound effect.
Sound buttons
Unit: DSGX button
Remote: EQ button
Unit: DSGX button
Remote: EQ button
DISPLAY button
Press to change the information on the
display.
display.
CLOCK/TIMER SELECT button
CLOCK/TIMER SET button
CLOCK/TIMER SET button
Press to set the clock and the Play Timer.
REPEAT/FM MODE button
Press to listen to a disc, a single track or
file repeatedly.
Press to select the FM reception mode
(monaural or stereo).
file repeatedly.
Press to select the FM reception mode
(monaural or stereo).
Battery compartment lid
CLEAR button
Press to delete a pre-programmed track
or file.
or file.
TUNER MEMORY button
Press to preset the radio station.
SLEEP button
Press to set the Sleep Timer.
