DOWNLOAD Sony CMT-HP8V / HCD-HP8V Service Manual ↓ Size: 6.29 MB | Pages: 80 in PDF or view online for FREE

Model
CMT-HP8V HCD-HP8V
Pages
80
Size
6.29 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cmt-hp8v-hcd-hp8v.pdf
Date

Sony CMT-HP8V / HCD-HP8V Service Manual ▷ View online

HCD-HP8V
E Model
SERVICE MANUAL
MICRO HI-FI COMPONENT SYSTEM
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
9-877-476-02
2004H16-1
© 2004.08
HCD-HP8V is the Amplifier, CD player, Tape
Deck and Tuner section in CMT-HP8V.
SPECIFICATIONS
Ver 1.1  2004.08
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM69BH-30BD62
Section
Base Unit Name
BU-30BD62
Optical Pick-up Name
A-MAX.3
TAPE
Model Name Using Similar Mechanism
HCD-EP515
Section
Tape Transport Mechanism Type
CMAL1Z234A
Tape deck section
Recording system
4-track 2-channel, stereo
Frequency response
50 – 13,000 Hz (
±3 dB), 
using Sony TYPE I 
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Middle Eastern model:
531 – 1,602 kHz 
(with the tuning interval 
set at 9 kHz)
Other models:
530 – 1,710 kHz 
(with the tuning interval 
set at 10 kHz)
531 – 1,602 kHz 
(with the tuning interval 
set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz 
Main unit
Amplifier section
The following measured at AC 120, 127, 220, 240 V 
50/60 Hz
DIN power output (rated): 60 + 60 watts (6 ohms at 1 
kHz, DIN)
Continuous RMS power output (reference):
60 + 60 watts (6 ohms at 1 
kHz, 10% THD)
Inputs
MD IN (phono jacks):
Sensitivity 250 mV, 
impedance 47 kilohms
MIC (phone jack):
Sensitivity 1 mV, 
impedance 10 kilohms
Outputs
PHONES (stereo minijack):
Accepts headphones of 8 
ohms or more
MD OUT (phono jack):
Impedance 1 kilohm
VIDEO OUT (phono jack):
Max. output level 1Vp-p, 
unbalanced, Sync 
negative, load impedance 
75 ohms
SPEAKER:
Accepts impedance of 6 to 
16 ohms.
CD player section
System
Compact disc and digital 
audio system
Laser
Semiconductor laser 
(
λ=780 nm)
Emission duration: 
continuous
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Wavelength
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Video color system format
NTSC, PAL
2
HCD-HP8V
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
0
 OR DOTTED LINE WITH
MARK 
0
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
General
Power requirements
Saudi Arabian model:
120 – 127/220 or 230 – 240 
V AC, 50/60 Hz
Adjustable with voltage 
selector
Other models:
120 V, 220 V or 230 – 240 
V AC, 50/60 Hz
Adjustable with voltage 
selector
Power consumption:
100 watts
Dimensions (w/h/d)
Approx. 199 
× 252 × 
   400 
mm
Mass
Approx. 7.5 kg
Supplied accessories:
Remote commander (1)
Batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Speaker pads (8)
Video cable (1)
Design and specifications are subject to change 
without notice.
3
HCD-HP8V
1. SERVICING NOTES
······················································· 4
2. GENERAL
·········································································· 6
3. DISASSEMBLY
3-1. Case (Side-L)(Side-R),
Tape Mechanism Deck (CMAL1Z234A) ······················ 9
3-2. Front Panel Section ······················································· 9
3-3. Panel Board ································································· 10
3-4. Back Panel Section ······················································ 10
3-5. MAIN Board ······························································· 11
3-6. PWR AMP Board, Power Transformer ······················· 11
3-7. CD Mechanism Deck (CDM69BH-30BD62) ············· 12
3-8. JACK Board, VMP Board ··········································· 12
3-9. Base Unit Section ························································ 13
3-10. Base Unit (BU-30BD62) ············································· 13
3-11. BD Board ····································································· 14
3-12. SW Board, Bracket (Top) Assy ··································· 15
3-13. CONNECTOR Board ·················································· 15
3-14. Motor (Stocker) Assy (Stocker)(M761) ······················ 16
3-15. Motor (Roller) Assy (Roller)(M781) ··························· 16
3-16. Motor (Mode) Assy (Mode)(M771) ···························· 17
3-17. Rubber Roller (Slider) Assy ········································ 17
3-18. Timing Belt (Front/Rear) ············································· 18
3-19. Cam (Gear) ·································································· 18
3-20. SENSOR Board ··························································· 19
4. ASSEMBLY
4-1. How to Install the Cam (Eject Lock) ···························· 20
4-2. How to Install the Cam (GEAR) ··································· 20
4-3. How to Install the Gear (MODE C) ······························ 21
4-4. How to Install the Gear (MODE CAM) ······················· 21
4-5. How to Install the Rotary Encoder (S702),
Gear (STOCKER COMMUNICATION) ····················· 22
4-6. How to Install the Stocker Assy ···································· 22
5. TEST MODE
···································································· 23
6. MECHANICAL ADJUSTMENTS
····························· 24
7. ELECTRICAL ADJUSTMENTS
······························· 25
8. DIAGRAMS
······································································ 28
8-1. Block Diagram — CD SERVO Section — ················· 30
— AUDIO/VIDEO Section — ···································· 31
— MAIN Section — ··················································· 32
8-2. Printed Wiring Boards — BD Section — ··················· 33
8-3. Schematic Diagram — BD Section — ························ 34
8-4. Printed Wiring Boards — VMP Section (1/2) — ········ 35
8-5. Printed Wiring Boards — VMP Section (2/2) — ········ 36
8-6. Schematic Diagram — VMP Section (1/2) — ············ 37
8-7. Schematic Diagram — VMP Section (2/2) — ············ 38
8-8. Printed Wiring Boards — Changer Section — ··········· 39
8-9. Schematic Diagram — Changer Section — ················ 40
8-10. Printed Wiring Boards — Main Section — ················· 41
8-11. Schematic Diagram — Main Section — ····················· 42
8-12. Printed Wiring Boards — Front Section — ················ 43
8-13. Schematic Diagram — Front Section — ····················· 44
8-14. Printed Wiring Boards
— PWR AMP/Power Section — ································· 45
8-15. Schematic Diagram
— PWR AMP/Power Section — ································· 46
8-16. IC Block Diagrams ······················································ 47
8-17. IC Pin Function Description ········································ 50
9. EXPLODED VIEWS
9-1. Case, Top Panel Section ·············································· 57
9-2. Front Panel Section ····················································· 58
9-3. Chassis Section-1 ························································ 59
9-4. Chassis Section-2 ························································ 60
9-5. CD Mechanism Section-1 (CDM69BH-30BD62) ······ 61
9-6. CD Mechanism Section-2 (CDM69BH-30BD62) ······ 62
9-7. CD Mechanism Section-3 (CDM69BH-30BD62) ······ 63
9-8. CD Mechanism Section-4 (CDM69BH-30BD62) ······ 64
9-9. CD Mechanism Section-5 (CDM69BH-30BD62) ······ 65
9-10. CD Mechanism Section-6 (CDM69BH-30BD62) ······ 66
9-11. Base Unit Section (BU-30BD62) ································ 67
10.ELECTRICAL PARTS LIST
······································· 68
TABLE OF CONTENTS
4
HCD-HP8V
SECTION 1
SERVICING NOTES
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
This appliance is classified as a CLASS 1 LASER product.
This label is located on the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Page of 80
Display

Sony CMT-HP8V / HCD-HP8V Service Manual ▷ Download

  • DOWNLOAD Sony CMT-HP8V / HCD-HP8V Service Manual ↓ Size: 6.29 MB | Pages: 80 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony CMT-HP8V / HCD-HP8V in PDF for free, which will help you to disassemble, recover, fix and repair Sony CMT-HP8V / HCD-HP8V Audio. Information contained in Sony CMT-HP8V / HCD-HP8V Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.