DOWNLOAD Sony CMT-GP7 / HCD-GP7 Service Manual ↓ Size: 5.03 MB | Pages: 60 in PDF or view online for FREE

Model
CMT-GP7 HCD-GP7
Pages
60
Size
5.03 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cmt-gp7-hcd-gp7.pdf
Date

Sony CMT-GP7 / HCD-GP7 Service Manual ▷ View online

HCD-GP7
AEP Model
 UK Model
SERVICE MANUAL
MICRO HI-FI COMPONENT SYSTEM
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-877-470-02
2003K16-1
© 2003.11
HCD-GP7 is the Amplifier, CD player, Tape
Deck and Tuner section in CMT-GP7.
SPECIFICATIONS
Ver 1.1  2003. 11
Main unit
Amplifier section
DIN power output (rated): 40 + 40 watts (6 ohms at 1 
kHz, DIN)
Continuous RMS power output (reference):
50 + 50 watts (6 ohms at 1 
kHz, 10% THD)
Inputs
MD (VIDEO) (phono jacks):
Sensitivity 450/250 mV, 
impedance 47 kilohms
Outputs
PHONES:
Accepts headphones with 
an impedance of 8 ohms or 
more
SPEAKER:
Accepts impedance of 6 to 
16 ohms.
CD player section
Laser
Semiconductor laser 
(
λ=780 nm)
Emission duration: 
continuous
Frequency response
20 Hz – 20 kHz
Wavelength
780 – 790 nm
Tape deck section
Recording system
4-track 2-channel, stereo
Frequency response
50 – 13,000 Hz (
±3 dB), 
using Sony TYPE I 
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
531 – 1,602 kHz 
(with the tuning interval 
set at 9 kHz)
Antenna
AM loop antenna, external
 
antenna terminal
Intermediate frequency
450 kHz 
General
Power requirements
230 V AC, 50/60 Hz
Power consumption
100 watts
0.3 watts (in Power Saving 
Mode)
Dimensions (w/h/d)
Approx. 190 
× 250 × 340 
mm incl. projecting parts 
and controls
Mass
Approx. 6.2 kg
Supplied accessories:
Remote (1)
R6 (size AA) batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Design and specifications are subject to change 
without notice.
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM55A-K6BD47S
Section
Base Unit Name
BU-K6BD71C
Optical Pick-up Name
KSM-213D
TAPE
Model Name Using Similar Mechanism
HCD-EP515
Section
Tape Transport Mechanism Type
CMAL1Z240A
2
HCD-GP7
1. SERVICING NOTES
······················································· 3
2. GENERAL
·········································································· 5
3. DISASSEMBLY
································································ 7
3-1. Top Case, MAIN Board, Back Panel Assy ···················· 8
3-2. Front Panel Assy, CD Mechanism Deck ······················· 9
3-3. PANEL Board, HP Board, VOL Board ······················· 10
3-4. TC Board, single cassette mechanism
(CMAL1Z240A) ························································· 10
3-5. CD Mechanism (CDM55A-K6BD47S) ······················ 11
3-6. THR Board, DC FAN ·················································· 11
3-7. SPEAKER Board, POWER-AMP Board ···················· 12
3-8. SUB-POWER Board, POWER Board ························· 12
3-9. LOADING Board ························································ 13
3-10. CD Board ····································································· 13
3-11. Tray (CDM55D) ·························································· 14
3-12. Optical Pick-Up (KSM-213D) ···································· 14
4. TEST MODE
···································································· 16
5. MECHANICAL ADJUSTMENTS
····························· 17
6. ELECTRICAL ADJUSTMENTS
······························· 17
7. DIAGRAMS
······································································ 22
Contents
CIRCUIT BOARD LOCATION ·········································· 23
7-1. Block Diagram — CD Section — ······························· 24
— TUNER/TAPE Section — ······································ 25
— AMP Section — ····················································· 26
— DISPLAY/POWER SUPPLY Section — ··············· 27
7-2. Printed Wiring Board — CD Section — ····················· 28
7-3. Schematic Diagram — CD Section — ························ 29
7-4. Printed Wiring Board — TC Section — ······················ 30
7-5. Schematic Diagram — TC Section — ························ 31
7-6. Printed Wiring Board — MAIN Section — ················ 32
7-7. Schematic Diagram — MAIN Section — ··················· 33
7-8. Printed Wiring Board — PANEL Section — ·············· 34
7-9. Schematic Diagram — PANEL Section — ················· 35
7-10. Printed Wiring Board — POWER AMP Section — ··· 36
7-11. Schematic Diagram — POWER AMP Section — ······ 37
7-12. Printed Wiring Board — POWER Section — ············· 38
7-13. Schematic Diagram — POWER Section — ··············· 38
8. EXPLODED VIEWS
8-1. Over All Section ·························································· 47
8-2. Front Panel Section ····················································· 48
8-3. Chassis Section ···························································· 49
8-4. CD Mechanism Section ··············································· 50
8-5. KSM-213D ·································································· 51
9. ELECTRICAL PARTS LIST
······································· 52
TABLE OF CONTENTS
Ver 1.1  2003.11
3
HCD-GP7
SECTION 1
SERVICING NOTES
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
This appliance is classified as a CLASS 1 LASER product.
This label is located on the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
0
 OR DOTTED LINE WITH
MARK 
0
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
CAUTION : Not to Contact with the heat Sink.
MAIN board 
heat sink
Lead pin
Secure the respective cables firmly with the lead pins 
so as not to contact them with the heat sink.
4
HCD-GP7
Service Position of the Tape Cassette Mechanism Deck
Service Position of the CD Mechanism Deck
MAIN board 
Tape Cassette Mechanism Deck
(CMAL1Z240A)
 
MAIN board 
CD Mechanism Deck
(CDM55A-K6BD47S)
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Sony CMT-GP7 / HCD-GP7 Service Manual ▷ Download

  • DOWNLOAD Sony CMT-GP7 / HCD-GP7 Service Manual ↓ Size: 5.03 MB | Pages: 60 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony CMT-GP7 / HCD-GP7 in PDF for free, which will help you to disassemble, recover, fix and repair Sony CMT-GP7 / HCD-GP7 Audio. Information contained in Sony CMT-GP7 / HCD-GP7 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.