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E Model

2006E1678-1
© 2006.05

HCD-GB3 is the Amplifier, CD player, Tape
Deck and Tuner section in CMT-GB3.

Model Name Using Similar Mechanism

HCD-EC50

CD

Base Unit Name

BU-K6BD83S2-WOD

Section

Optical Pick-up Name

KSM-213DCP

TAPE

Model Name Using Similar Mechanism

HCD-EC50

Section

Tape Transport Mechanism Type

—

The following measured at AC 127 V, 60 Hz (Mexican model), AC 220 V, 
60 Hz (Argentine model), AC 120, 220 or 240 V, 60 Hz (Other models)

DIN power output (rated): 40 + 40 W (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 50 + 50 W (6 ohms at 1 kHz, 
10% THD)

Inputs

AUDIO IN (stereo mini jack): Sensitivity 700 mV, impedance 47 kilohms

Outputs

PHONES (stereo mini jack): Accepts headphones with an impedance of 8 
ohms or more
SPEAKER: Accepts impedance of 6 ohms

System: Compact disc and digital audio system
Laser Diode Properties

Emission duration: continuous
Laser Output*: Less than 44.6

µW

* This output is the value measurement at a distance of 200mm from the 

objective lens surface on the Optical Pick-up Block with 7mm aperture.

Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB

Recording system: 4-track 2-channel, stereo

FM stereo, FM/AM superheterodyne tuner
Antenna:

FM lead antenna
AM loop antenna

FM tuner section:

Tuning range: 87.5 – 108.0 MHz (50 kHz step)
Intermediate frequency: 10.7 MHz

AM tuner section:

Tuning range: 530 – 1,710 kHz (with 10 kHz tuning interval)
 

531 – 1,710 kHz (with 9 kHz tuning interval)

Intermediate frequency: 450 kHz

Power requirements

Mexican model: AC 127 V, 60 Hz
Argentine model: AC 220 V, 50/60 Hz
Other models: AC 120, 220 or 230 – 240 V, 50/60 Hz
Adjustable with voltage selector

Power consumption: 80 W
Dimensions (w/h/d) (excl. speakers): Approx. 200 

× 281.5 × 390.5 mm

Mass (excl. speakers):  Approx. 5.1 kg

Design and specifications are subject to change without notice.

2

................................................

3

...................................................................

4

3-1.

Disassembly Flow ...........................................................

6

3-2.

Side Panel (R), Side Panel (L) .........................................

7

3-3.

Top Panel Section ............................................................

7

3-4.

Mechanical Deck .............................................................

8

3-5.

Belt (MAIN), Belt (R/F) ..................................................

8

3-6.

Front Panel Section .........................................................

9

3-7.

PANEL Board ..................................................................

9

3-8.

JACK Board ..................................................................... 10

3-9.

MAIN Board, REG Board ............................................... 10

3-10. CD Mechanism Deck Section (BU-K6BD83S2) ............ 11
3-11. Optical Pick-up (KSM-213DCP), BD83S Board ............ 12
3-12. Belt (DLM3A) ................................................................. 13
3-13. DC Fan, Chassis (MAIN MOLD) ................................... 13
3-14. POWER Board, AMP Board ........................................... 14

............................................................... 15

......................... 16

.......................... 16

7-1.

Block Diagram — BD/DRIVER Section — .................. 22

7-2.

Block Diagram — TUNER Section — .......................... 23

7-3.

Block Diagram — MAIN Section — ............................. 24

0

0

7-4.

Printed Wiring Board — BD83S Board — .................... 25

7-5.

Schematic Diagram — BD83S Board — ....................... 26

7-6.

Printed Wiring Boards
— MAIN Board, REG Board — ..................................... 27

7-7.

Schematic Diagram
— MAIN Board (1/3), REG Board — ............................ 28

7-8.

Schematic Diagram — MAIN Board (2/3) — ............... 29

7-9.

Schematic Diagram — MAIN Board (3/3) — ............... 30

7-10. Printed Wiring Board — AMP Board — ....................... 31
7-11. Schematic Diagram — AMP Board — .......................... 32
7-12. Printed Wiring Board — PANEL Board — ................... 33
7-13. Schematic Diagram — PANEL Board — ...................... 34
7-14. Printed Wiring Boards

— POWER Board, JACK Board — ................................ 35

7-15. Schematic Diagram

— POWER Board, JACK Board — ................................ 36

8-1.

Overall Section ................................................................ 45

8-2.

Front Panel Section ......................................................... 46

8-3.

Chassis Section ................................................................ 47

8-4.

Top Panel Section ............................................................ 48

8-5.

CD Mechanism Deck Section (BU-K6BD83S2-WOD) . 49

.................................. 50

3

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of the soldering iron around 270 °C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 

°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.

This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.

Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.

Remove all discs to protect the CD mechanism.

Hold down CD 

u

 (play/pause) on the unit, and press 

?/1

 until “STANDBY” appears.

After “LOCK” appears, unplug the power cord.

4

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