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2012C33-1

© 

2012.03

Model Name Using Similar Mechanism

NEW

CD Mechanism Type

CDM77B-K6BD94DC

Base Unit Name

BU-K6BD94DC

Optical Pick-up Block Name

KSM-213DCP

•  HCD-G2BNiP is compact disc receiver in CMT-G2BNiP.
•  HCD-G2NiP is compact disc receiver in CMT-G2NiP.

Photo: HCD-G2BNiP

40 watts + 40 watts (6 ohms at 1 kHz, 1% THD)

50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)

 60 watts + 60 watts (6 ohms at 1 kHz, 10% THD)

40 watts + 40 watts (6 ohms at 1 kHz, 1% THD)

50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)

IEEE 802.11 b/g (WEP 64 bit, WEP 128 bit, 
WPA/WPA2-PSK (AES), WPA/WPA2-PSK 
(TKIP))

2.4 GHz

Compact disc and digital audio system

Emission Duration: Continuous
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 

200mm from the objective lens surface on the Optical 
Pick-up Block with 7mm aperture.

20 Hz – 20 kHz

More than 90 dB

More than 90 dB

European model:
531 kHz – 1,602 kHz (with 9 kHz tuning interval)
Other models:
530 kHz – 1,710 kHz (with 10 kHz tuning interval)
531 kHz – 1,710 kHz (with 9 kHz tuning interval)

AM loop antenna

 400 kHz

FM stereo, FM superheterodyne tuner

87.5 MHz – 108.0 MHz (50 kHz step)

FM lead antenna

75 ohms unbalanced

200 kHz, 250 kHz, 300 kHz, 350 kHz, 400 kHz

FM stereo, DAB/FM superheterodyne tuner

Band-III: 
174.928 (5A) MHz – 239.200 (13F) MHz

DAB/FM lead antenna

MP3 (MPEG 1 Audio Layer-3): 32 kbps – 
320 kbps, VBR
WMA: 48 kbps – 192 kbps, VBR
AAC: 48 kbps – 320 kbps

MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz

75 ohms unbalanced

174.928 MHz

5A

176.640 MHz

5B

178.352 MHz

5C

180.064 MHz

5D

181.936 MHz

6A

183.648 MHz

6B

185.360 MHz

6C

187.072 MHz

6D

188.928 MHz

7A

190.640 MHz

7B

192.352 MHz

7C

194.064 MHz

7D

195.936 MHz

8A

197.648 MHz

8B

199.360 MHz

8C

201.072 MHz

8D

202.928 MHz

9A

204.640 MHz

9B

206.352 MHz

9C

208.064 MHz

9D

209.936 MHz

10A

211.648 MHz

10B

213.360 MHz

10C

215.072 MHz

10D

216.928 MHz

11A

218.640 MHz

11B

220.352 MHz

11C

222.064 MHz

11D

223.936 MHz

12A

225.648 MHz

12B

227.360 MHz

12C

229.072 MHz

12D

230.784 MHz

13A

232.496 MHz

13B

234.208 MHz

13C

235.776 MHz

13D

237.488 MHz

13E

239.200 MHz

13F

75 ohms, F female

Sensitivity 700 mV, impedance 47 kilohms

Accepts impedance of 6 ohms – 16 ohms

Type A, maximum current 1 A

10BASE-T/100BASE-TX

European models:
AC 220 V – 230 V, 50/60Hz
Australian model:
AC 230 V – 240 V, 50/60 Hz

50 watts

Approx. 220 mm × 141 mm × 335 mm

Approx. 5.6 kg

Design and specifications are subject to change 
without notice.

Standby power consumption: 0.5 W

iPod touch

4th generation

iPod touch

3rd generation

iPod touch

2nd generation

iPod touch

1st generation

iPod nano

6th generation

iPod nano

5th generation

(video camera)

iPod nano

4th generation

(video)

iPod nano

3rd generation

(video)

iPod nano

2nd generation

(aluminum)

iPod classic

iPhone

iPhone 3G

iPhone 4

iPhone 3GS

Note:
Be sure to keep your PC used for service and 
checking of this unit always updated with the 
latest version of your anti-virus software.
In case a virus affected unit was found during 
service, contact your Service Headquarters. 

  .............................................   3

2-1. Disassembly 

Flow 

...........................................................  10

2-2. Case 

Block 

......................................................................  11

2-3.  Wireless LAN Module (MOD1) .....................................   11
2-4. Panel 

(CD 

Tray) 

..............................................................  12

2-5.  Panel (Front) Block .........................................................   13
2-6.  Panel (Rear) Block ..........................................................   14
2-7. MAIN 

Board 

...................................................................  15

2-8. NET 

Board 

......................................................................  16

2-9.  Holder (CD Front) Block ................................................   16
2-10.  AMP Board Block ...........................................................   17
2-11. AMP Board .....................................................................   18
2-12. Power Transformer (T901) .............................................   19
2-13.  CD Mechanism Deck Block 

(CDM77B-K6BD94DC) .................................................   20

2-14. Belt ..................................................................................   20
2-15.  Base Unit (BU-K6BD94DC) ..........................................   21
2-16.  Optical Pick-up Block (KSM-213DCP) .........................   21
2-17.  Holder (CD) Block ..........................................................   22
2-18. DCDC Board ...................................................................   22

TEST  MODE 

 ............................................................   23

ELECTRICAL  CHECK 

 .........................................   24

5-1.  Block Diagram - CD/USB/PANEL Section - .................   25
5-2.  Block Diagram - TUNER/NETWORK Section - ...........   26
5-3.  Block Diagram - AMP Section - .....................................   27
5-4.  Block Diagram - POWER SUPPLY Section - ................   28
5-5.  Printed Wiring Board - BD94DC Board - ......................   30

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

5-6.  Schematic Diagram - BD94DC Board - .........................   31
5-7.  Printed Wiring Board - TUNER Board - ........................   32
5-8.  Schematic Diagram - TUNER Board - ...........................   32
5-9.  Printed Wiring Board - DAB Board (G2BNiP) - ............   33
5-10.  Schematic Diagram - DAB Board (G2BNiP) - ..............   33
5-11.  Printed Wiring Boards - NETWORK Section - ..............   34
5-12.  Schematic Diagram - NETWORK Section - ..................   35
5-13.  Printed Wiring Board - MAIN Board (Side A) - ............   36
5-14.  Printed Wiring Board - MAIN Board (Side B) - ............   37
5-15.  Schematic Diagram - MAIN Board (1/3) - .....................   38
5-16.  Schematic Diagram - MAIN Board (2/3) - .....................   39
5-17.  Schematic Diagram - MAIN Board (3/3) - .....................   40
5-18.  Schematic Diagram - AMP Section - ..............................   41
5-19.  Printed Wiring Board - AMP Section (1/2) - ..................   42
5-20.  Printed Wiring Boards - AMP Section (2/2) - .................   43
5-21. Printed Wiring Boards 

- HP/JOG1/JOG2/USB Boards - .....................................   44

5-22.  Schematic Diagram - HP/JOG1/JOG2/USB Boards - ....   45
5-23.  Printed Wiring Board - FL-NET Board - ........................   46
5-24.  Schematic Diagram - FL-NET Board - ...........................   47
5-25.  Printed Wiring Boards - POWER SUPPLY Section - ....   48
5-26.  Schematic Diagram - POWER SUPPLY Section - .........   49

6-1. Overall 

Section 

...............................................................  62

6-2.  Front Panel Section .........................................................   63
6-3.  Rear Panel Section ..........................................................   64
6-4.  MAIN Board Section ......................................................   65
6-5. Chassis 

Section 

...............................................................  66

6-6.  CD Mechanism Deck Section 

(CDM77B-K6BD94DC) .................................................   67

  ..............................   68

This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

s

PARTY STREAMING and PARTY STREAMING 
logo are trademarks of Sony Corporation.

s

VAIO and VAIO Media are registered trademarks of 
Sony Corporation.

s

MPEG Layer-3 audio coding technology and patents 
licensed from Fraunhofer IIS and Thomson.

s

Microsoft, Windows, Windows Vista, Windows 7™, 
Windows Media are trademarks or registered 
trademarks of Microsoft Corporation in the United 
States and/or other countries.

s

Mac and Macintosh are trademarks of Apple Inc.

s

AirPlay, the AirPlay logo, iPhone, iPod, iPod classic, 
iPod nano, and iPod touch are trademarks of Apple Inc., 
registered in the U.S. and other countries.

s

“Made for iPod,” and “Made for iPhone” mean that an 
electronic accessory has been designed to connect 
specifically to iPod or iPhone, respectively, and has 
been certified by the developer to meet Apple 
performance standards. Apple is not responsible for the 
operation of this device or its compliance with safety 
and regulatory standards. Please note that the use of this 
accessory with iPod or iPhone may affect wireless 
performance.

s

Apple is not responsible for the operation of this device 
or its compliance with safety and regulatory standards.

s

“

” is a mark of the Wi-Fi Alliance.

s

DLNA®, the DLNA Logo and DLNA CERTIFIED™ 
are trademarks, service marks, or certification marks of 
the Digital Living Network Alliance.

s

Wake-on-LAN is a trademark of International Business 
Machines Corporation in the United States.

s

This product is protected by certain intellectual 
property rights of Microsoft Corporation. Use or 
distribution of such technology outside of this product 
is prohibited without a license from Microsoft or an 
authorized Microsoft subsidiary.

s

The system names and product names indicated in this 
manual are generally the trademarks or registered 
trademarks of the manufacturer.

s

In this manual, Microsoft Windows XP Home Edition, 
Microsoft Windows XP Professional and Microsoft 
Windows XP Media Center Edition are referred to as 
Windows XP.

s

In this manual, Microsoft Windows Vista Home Basic, 
Microsoft Windows Vista Home Premium, Microsoft 
Windows Vista Business and Microsoft Windows Vista 
Ultimate are referred to as Windows Vista.

s

In this manual, Microsoft Windows 7 Starter, Microsoft 
Windows 7 Home Premium, Microsoft Windows 7 
Professional, Microsoft Windows 7 Ultimate are 
referred to as Windows 7.

s

™ and ® marks are omitted in this manual.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press two buttons of [

x

] and [

Z

] for 5 seconds.

3.  The message “UNLOCKED” is displayed on the fl uorescent 

indicator tube and the disc tray is unlocked.

Note: When “LOCKED”is displayed, the disc tray lock is not released by 

turning power on/off with the [?/1] button.

NOTE  OF  REPLACING  THE  MOTOR  BOARD
When the MOTOR board is damaged, exchange the LOADING 
(BK) ASSY.

NOTE  OF  REPLACING  THE  IC107,  Q1101,  Q1102,  
Q2101  AND  Q2102  ON  THE  AMP  BOARD
IC107, Q1101, Q1102, Q2101 and Q2102 on the AMP board can-
not exchange with single. When these parts are damaged, exchange 
the complete mounted board.

NOTE  OF  REPLACING  THE  CN5003  ON  THE  NET  
BOARD
CN5003 on the NET board cannot exchange with single. When 
this part is damaged, exchange the complete mounted board.

HCD-G2NiP: AEP model

4-275-277-0[]

HCD-G2BNiP: AEP and UK models

4-275-277-1[]

HCD-G2BNiP: Australian model

4-275-277-2[]

PRECAUTIONS  FOR  DISASSEMBLY  AND  ASSEMBLY
Many of the internal parts in this unit use iron plates. Be careful not 
to injure your hands while carrying out disassembly or assembly 
procedures. 

PRECAUTIONS  FOR  OPERATION  CHECKS
If checking operations with the power on, be sure to connect the 
GND wires (earth terminals) connected to the AMP board and 
MAIN board to ground. 
The units may fail to operate and parts may become damaged if 
the GND wires are not connected properly. Be sure to connect the 
GND wires before checking either board. 
If the GND wire (earth terminal) is not long enough to reach when 
the circuit board is removed, use alligator clips or a similar part to 
extend the length to enable connection to ground. 

Note: Connect the alligator clips surely with this position.

NOTE  OF  REPLACING  THE  WIRELESS  LAN  MODULE 
(MOD1)
When replacing the wireless LAN module (MOD1), MAC address 
is changed. Print the following explanation, cut it, and hand over 
it to the customer with the unit, when returning the unit that the 
repair is completed to the customer.

MAC address of the main unit has been changed by this repair.
When using the MAC address fi ltering function of connection destina-
tion access point equipment, set it again..

CHECKING  METHOD  OF  NETWORK  OPERATION
It is necessary to check the network operation, when replacing the 
wireless LAN module (MOD1). Check the operation of wireless 
and wired LAN, according to the following method.

1.  Checking Method of Wireless LAN Operation
Check that access point is recognized surely.

Necessary Equipment:
Wireless access point with router function (AP)

Procedure:
1.  Turn the [FUNCTION] knob to select the HOME NETWORK, 

MUSIC SERVICES or AirPlay function.

2.  Press the [M]/[m] buttons to select “Network,” then press the 

[ENTER] button.

3.  Press the [M]/[m] buttons to select “Settings,” then press the 

[ENTER] button.

4.  Press the [M]/[m] buttons to select “Wireless LAN Settings,” 

then press the [ENTER] button.

Note: If “Change Setting?” appears, select “OK,” then press the [ENTER] 

button.

5.  Press the [M]/[m] buttons to select “Access Point Scan,” then 

press the [ENTER] button.

6.  The system starts searching for access points, and displays a 

list of up to 20 available network name (SSID).

7.  Check that access point (SSID) is displayed on the searching 

result.

Note: Refer to the instruction manual about details of the setting method.

2.  Checking method of wired LAN operation
Check that access point is recognized surely.

Procedure:
1.  Connect the main unit to the router or the hub, etc. with the 

network (LAN) cable.

2.  Turn the [FUNCTION] knob to select the HOME NETWORK, 

MUSIC SERVICES or AirPlay function.

3.  Press the [M]/[m] buttons to select “Network,” then press the 

[ENTER] button.

4.  Press the [M]/[m] buttons to select “Settings,” then press the 

[ENTER] button.

5.  Press the [M]/[m] buttons to select “Wired LAN Settings,” 

then press the [ENTER] button.

6.  On the IP setting, press the [M]/[m] buttons to select “Auto,” 

then press the [ENTER] button.

7.  On the proxy setting, press the [M]/[m] buttons to select “Do 

Not Use,” then press the [ENTER] button.

8.  Press the [M]/[m] buttons to select “OK,” then press the 

[ENTER] button.

9.  Perform the server settings.
10. Press the [OPTIONS] buttons to select “Network,” then press 

the [ENTER] button.

11. Press the [OPTIONS] buttons to select “Information,” then 

press the [ENTER] button.

12. Check that IP address can be acquired.

Note: Refer to the instruction manual about details of the setting method.