Sony CMT-G1BIP / CMT-G1IP / HCD-G1BIP / HCD-G1IP Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-G1BiP/G1iP
SPECIFICATIONS
COMPACT DISC RECEIVER
9-893-206-01
2011F05-1
©
2011.06
AEP Model
HCD-G1BiP/G1iP
UK Model
HCD-G1BiP
Chinese Model
HCD-G1iP
Ver. 1.0 2011.06
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM77B-K6BD94D
Base Unit Name
BU-K6BD94D
Optical Pick-up Block Name
KSM-213DCP
• HCD-G1BiP is the Amplifi er, CD player, Tuner,
DAB/DAB+ tuner, iPod/iPhone and USB section
in CMT-G1BiP.
in CMT-G1BiP.
• HCD-G1iP is the Amplifi er, CD player, Tuner,
iPod/iPhone and USB section in CMT-G1iP.
Photo: HCD-G1BiP
Amplifier section
European model:
European model:
DIN power output (rated): 40 watts + 40 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 50 watts + 50 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference): 60 watts + 60 watts (6 ohms at 1 kHz, 10%
THD)
Continuous RMS power output (reference): 50 watts + 50 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference): 60 watts + 60 watts (6 ohms at 1 kHz, 10%
THD)
Chinese model:
DIN power output (rated): 35 watts + 35 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 45 watts + 45 watts (6 ohms at
1 kHz, 10% THD)
Continuous RMS power output (reference): 45 watts + 45 watts (6 ohms at
1 kHz, 10% THD)
Input
AUDIO IN (stereo mini jack): Sensitivity 700 mV, impedance 47 kilohms
AUDIO IN (stereo mini jack): Sensitivity 700 mV, impedance 47 kilohms
Outputs
SPEAKERS: Accepts impedance of 6 - 16 ohms
SPEAKERS: Accepts impedance of 6 - 16 ohms
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
System: Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 200mm from the
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 200mm from the
objective lens surface on the Optical Pick-up Block with 7mm aperture.
Frequency response: 20 Hz 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
AM tuner section:
AM tuner section:
Tuning range:
European
European
model:
531 — 1,602 kHz (with 9 kHz tuning interval)
Other
models:
530 — 1,610 kHz (with 10 kHz tuning interval)
531 — 1,602 kHz (with 9 kHz tuning interval)
Antenna: AM loop antenna
Intermediate frequency: 400 kHz
Intermediate frequency: 400 kHz
FM tuner section:
FM stereo, FM superheterodyne tuner
Tuning range:
Tuning range:
87.5 MHz — 108.0 MHz (50 kHz step)
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 200 kHz, 250 kHz, 300 kHz, 350 kHz, 400 kHz
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 200 kHz, 250 kHz, 300 kHz, 350 kHz, 400 kHz
DAB/DAB+ tuner section (G1BiP only)
FM stereo, DAB/FM superheterodyne tuner
Frequency range*
Band-III: 174.928 (5A) MHz — 239.200 (13F) MHz
* For details, see “DAB/DAB+ frequency table” below.
Antenna: DAB lead antenna
Antenna terminal: 75 ohms, F female
Frequency range*
Band-III: 174.928 (5A) MHz — 239.200 (13F) MHz
* For details, see “DAB/DAB+ frequency table” below.
Antenna: DAB lead antenna
Antenna terminal: 75 ohms, F female
DAB/DAB+ frequency table (Band-III)
Frequency
Label
Frequency
Label
174.928 MHz
5A
209.936 MHz
10A
176.640 MHz
5B
211.648 MHz
10B
178.352 MHz
5C
213.360 MHz
10C
180.064 MHz
5D
215.072 MHz
10D
181.936 MHz
6A
216.928 MHz
11A
183.648 MHz
6B
218.640 MHz
11B
185.360 MHz
6C
220.352 MHz
11C
187.072 MHz
6D
222.064 MHz
11D
188.928 MHz
7A
223.936 MHz
12A
190.640 MHz
7B
225.648 MHz
12B
192.352 MHz
7C
227.360 MHz
12C
194.064 MHz
7D
229.072 MHz
12D
195.936 MHz
8A
230.784 MHz
13A
197.648 MHz
8B
232.496 MHz
13B
199.360 MHz
8C
234.208 MHz
13C
201.072 MHz
8D
235.776 MHz
13D
202.928 MHz
9A
237.488 MHz
13E
204.640 MHz
9B
239.200 MHz
13F
206.352 MHz
9C
208.064 MHz
9D
* Frequencies are displayed to two decimal places on this system.
iPod/iPhone section
Compatible iPod/iPhone models:
Compatible iPod/iPhone models:
iPod touch 4th generation
iPod touch 3rd generation
iPod touch 2nd generation
iPod touch 1st generation
iPod nano 6th generation
iPod nano 5th generation (video camera)
iPod nano 4th generation (video)
iPod nano 3rd generation (video)
iPod nano 2nd generation (aluminum)
iPod classic
iPhone 4
iPhone 3G
iPhone 3GS
iPhone
iPod touch 3rd generation
iPod touch 2nd generation
iPod touch 1st generation
iPod nano 6th generation
iPod nano 5th generation (video camera)
iPod nano 4th generation (video)
iPod nano 3rd generation (video)
iPod nano 2nd generation (aluminum)
iPod classic
iPhone 4
iPhone 3G
iPhone 3GS
iPhone
“Made for iPod,” and “Made for iPhone” mean that an electronic accessory has
been designed to connect specifically to iPod or iPhone, respectively, and has
been certified by the developer to meet Apple performance standards. Apple
is not responsible for the operation of this device or its compliance with safety
and regulatory standards. Please note that the use of this accessory with iPod
or iPhone may affect wireless performance.
been designed to connect specifically to iPod or iPhone, respectively, and has
been certified by the developer to meet Apple performance standards. Apple
is not responsible for the operation of this device or its compliance with safety
and regulatory standards. Please note that the use of this accessory with iPod
or iPhone may affect wireless performance.
USB section
Supported bit rate:
Supported bit rate:
MP3 (MPEG 1 Audio Layer-3): 32 kbps 320 kbps, VBR
WMA: 48 kbps 192 kbps, VBR
AAC: 48 kbps 320 kbps
WMA: 48 kbps 192 kbps, VBR
AAC: 48 kbps 320 kbps
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
(USB) port: Type A, maximum current 1A
General
Power requirements:
Power requirements:
AC 220 V, 50/60 Hz
Chinese model:
AC 230 V, 50/60 Hz
European model:
Power consumption: 50 watts
Dimensions (W/H/D) (excl. speakers):
Dimensions (W/H/D) (excl. speakers):
Approx. 220 mm × 133 mm × 335 mm
Mass (excl. speakers): Approx. 5.3 kg
Design and specifications are subject to change without notice.
Standby power consumption: 0.5 W
HCD-G1BiP/G1iP
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 8
2-2. Case
................................................................................. 9
2-3. Panel
(CD
Tray)
.............................................................. 9
2-4. Panel (Front) Block ......................................................... 10
2-5. Panel (Rear) Block .......................................................... 11
2-6. MAIN
2-5. Panel (Rear) Block .......................................................... 11
2-6. MAIN
Board
................................................................... 12
2-7. Holder (CD Front) Block ................................................ 14
2-8. AMP Board Block ........................................................... 14
2-9. AMP
2-8. AMP Board Block ........................................................... 14
2-9. AMP
Board
..................................................................... 15
2-10. Power Transformer (T901) ............................................. 16
2-11. CD Mechanism Deck Block (CDM77B-K6BD94D) ..... 17
2-12. Belt .................................................................................. 17
2-13. Base Unit (BU-K6BD94D) ............................................. 18
2-14. Optical Pick-up Block (KSM-213DCP) ......................... 18
2-15. Holder (CD) Block .......................................................... 19
2-16. DCDC Board ................................................................... 19
2-11. CD Mechanism Deck Block (CDM77B-K6BD94D) ..... 17
2-12. Belt .................................................................................. 17
2-13. Base Unit (BU-K6BD94D) ............................................. 18
2-14. Optical Pick-up Block (KSM-213DCP) ......................... 18
2-15. Holder (CD) Block .......................................................... 19
2-16. DCDC Board ................................................................... 19
3.
TEST MODE
............................................................ 20
4.
ELECTRICAL CHECK
......................................... 21
5. DIAGRAMS
5-1. Block Diagram - CD, USB, PANEL Section -................ 23
5-2. Block Diagram - TUNER, AUDIO IN,
5-2. Block Diagram - TUNER, AUDIO IN,
HEADPHONE OUTPUT Section - ................................ 24
5-3. Block
Diagram
- AMP, SPEAKER OUTPUT Section - .......................... 25
5-4. Block Diagram - POWER SUPPLY Section - ................ 26
5-5. Printed Wiring Board - BD94D Board - ......................... 28
5-5. Printed Wiring Board - BD94D Board - ......................... 28
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
iPhone, iPod, iPod classic, iPod nano, and iPod touch
are trademarks of Apple Inc., registered in the U.S. and
other countries.
MPEG Layer-3 audio coding technology and patents
are trademarks of Apple Inc., registered in the U.S. and
other countries.
MPEG Layer-3 audio coding technology and patents
Windows Media is either a registered trademark or
States and/or other countries.
distribution of such technology outside of this product
All other trademarks and registered trademarks are of
their respective holders. In this manual,
their respective holders. In this manual,
™
and
®
marks
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as a CLASS 1
LASER product. This marking is located
on the rear exterior.
LASER product. This marking is located
on the rear exterior.
5-6. Schematic Diagram - BD94 Board - ............................... 29
5-7. Printed Wiring Board - TUNER Board - ........................ 30
5-8. Schematic Diagram - TUNER Board - ........................... 30
5-9. Printed Wiring Board - DAB Board (G1BiP) - ............... 31
5-10. Schematic Diagram - DAB Board (G1BiP) - ................. 31
5-11. Printed Wiring Board - MAIN Board (Side A) - ............ 32
5-12. Printed Wiring Board - MAIN Board (Side B) - ............ 33
5-13. Schematic Diagram - MAIN Board (1/3) - ..................... 34
5-14. Schematic Diagram - MAIN Board (2/3) - ..................... 35
5-15. Schematic Diagram - MAIN Board (3/3) - ..................... 36
5-16. Schematic Diagram - AMP Section - .............................. 37
5-17. Printed Wiring Board - AMP Section (1/2) - .................. 38
5-18. Printed Wiring Boards - AMP Section (2/2) - ................. 39
5-19. Printed Wiring Boards
5-7. Printed Wiring Board - TUNER Board - ........................ 30
5-8. Schematic Diagram - TUNER Board - ........................... 30
5-9. Printed Wiring Board - DAB Board (G1BiP) - ............... 31
5-10. Schematic Diagram - DAB Board (G1BiP) - ................. 31
5-11. Printed Wiring Board - MAIN Board (Side A) - ............ 32
5-12. Printed Wiring Board - MAIN Board (Side B) - ............ 33
5-13. Schematic Diagram - MAIN Board (1/3) - ..................... 34
5-14. Schematic Diagram - MAIN Board (2/3) - ..................... 35
5-15. Schematic Diagram - MAIN Board (3/3) - ..................... 36
5-16. Schematic Diagram - AMP Section - .............................. 37
5-17. Printed Wiring Board - AMP Section (1/2) - .................. 38
5-18. Printed Wiring Boards - AMP Section (2/2) - ................. 39
5-19. Printed Wiring Boards
- HP/JOG1/JOG2/USB Boards - .................................... 40
5-20. Schematic Diagram - HP/JOG1/JOG2/USB Boards - .... 41
5-21. Printed Wiring Board - FL Board - ................................. 42
5-22. Schematic Diagram - FL Board - .................................... 43
5-23. Printed Wiring Boards - POWER Section - .................... 44
5-24. Schematic Diagram - POWER Section - ........................ 45
5-21. Printed Wiring Board - FL Board - ................................. 42
5-22. Schematic Diagram - FL Board - .................................... 43
5-23. Printed Wiring Boards - POWER Section - .................... 44
5-24. Schematic Diagram - POWER Section - ........................ 45
6.
EXPLODED VIEWS
6-1. Overall
Section
............................................................... 57
6-2. Front Panel Section ......................................................... 58
6-3. Rear Panel Section .......................................................... 59
6-4. MAIN Board Section ...................................................... 60
6-5. Chassis
6-3. Rear Panel Section .......................................................... 59
6-4. MAIN Board Section ...................................................... 60
6-5. Chassis
Section
............................................................... 61
6-6. CD Mechanism Deck Section
(CDM77B-K6BD94D) ................................................... 62
7.
ELECTRICAL PARTS LIST
.............................. 63
HCD-G1BiP/G1iP
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. Press two buttons of [
x
] and [
Z
] for 5 seconds.
3. The message “UNLOCKED” is displayed on the fl uorescent
indicator tube and the disc tray is unlocked.
Note: When “LOCKED”is displayed, the disc tray lock is not released by
turning power on/off with the [
?/1] button.
NOTE OF REPLACING THE MOTOR BOARD
When the MOTOR board is damaged, exchange the entire
LOADING (BK) ASSY.
When the MOTOR board is damaged, exchange the entire
LOADING (BK) ASSY.
NOTE OF REPLACING THE IC107, Q1101, Q1102,
Q2101 AND Q2102 ON THE AMP BOARD
IC107, Q1101, Q1102, Q2101 and Q2102 on the AMP board can-
not exchange with single. When these parts are damaged, exchange
the entire mounted board.
Q2101 AND Q2102 ON THE AMP BOARD
IC107, Q1101, Q1102, Q2101 and Q2102 on the AMP board can-
not exchange with single. When these parts are damaged, exchange
the entire mounted board.
MODEL IDENTIFICATION
– Rear Panel –
PART No.
Model
Part No.
HCD-G1iP: AEP model
4-275-268-0
[]
HCD-G1iP: Chinese model
4-275-268-1
[]
HCD-G1BiP: AEP and UK models
4-275-268-2
[]
PRECAUTIONS FOR DISASSEMBLY AND ASSEMBLY
Many of the internal parts in this unit use iron plates. Be careful not
to injure your hands while carrying out disassembly or assembly
procedures.
Many of the internal parts in this unit use iron plates. Be careful not
to injure your hands while carrying out disassembly or assembly
procedures.
PRECAUTIONS FOR OPERATION CHECKS
If checking operations with the power on, be sure to connect the
GND wires (earth terminals) connected to the AMP board and
MAIN board to ground.
The units may fail to operate and parts may become damaged if
the GND wires are not connected properly. Be sure to connect the
GND wires before checking either board.
If the GND wire (earth terminal) is not long enough to reach when
the circuit board is removed, use alligator clips or a similar part to
extend the length to enable connection to ground.
If checking operations with the power on, be sure to connect the
GND wires (earth terminals) connected to the AMP board and
MAIN board to ground.
The units may fail to operate and parts may become damaged if
the GND wires are not connected properly. Be sure to connect the
GND wires before checking either board.
If the GND wire (earth terminal) is not long enough to reach when
the circuit board is removed, use alligator clips or a similar part to
extend the length to enable connection to ground.
AMP board
MAIN board
alligator clips
GND wire
Note: Connect the alligator clips surely with this position.
HCD-G1BiP/G1iP
4
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
MAIN BOARD SERVICE POSITION
1
Insert the hard metal fittings of L character type 6 cm
or more in the hole of the chassis.
2
Push the lever in the direction
of the arrow
A.
6 cm or more
hole
lever
3
– Rear bottom view –
– Bottom view –
A
MAIN board
AMP board
lug wire
alligator clips
Note: Connect the alligator clips surely with this position.