Sony CMT-F3MD / HCD-F3MD Service Manual ▷ View online
4
TABLE OF CONTENTS
SELF-DIAGNOSIS FUNCTION
.....................................
2
1.
SERVICING NOTES
...............................................
5
2.
GENERAL
................................................................... 16
3.
DISASSEMBLY
......................................................... 18
4.
TEST MODE
............................................................... 26
5.
ELECTRICAL ADJUSTMENTS
MD Section ..................................................................... 30
CD Section ...................................................................... 38
CD Section ...................................................................... 38
6.
DIAGRAMS
6-1. Block Diagram – CD SERVO Section – ....................... 39
6-2. Block Diagram – MD SERVO Section (1/2) – ............. 40
6-3. Block Diagram – MD SERVO Section (2/2) – ............. 41
6-4. Block Diagram – MAIN Section – ................................ 42
6-5. Note for Printed Wiring Boards and
6-2. Block Diagram – MD SERVO Section (1/2) – ............. 40
6-3. Block Diagram – MD SERVO Section (2/2) – ............. 41
6-4. Block Diagram – MAIN Section – ................................ 42
6-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 43
6-6. Printed Wiring Board – BD (CD) Board – .................... 44
6-7. Schematic Diagram – BD (CD) Board – ....................... 45
6-8. Schematic Diagram – BD (MD) Board (1/2) – ............. 46
6-9. Schematic Diagram – BD (MD) Board (2/2) – ............. 47
6-10. Printed Wiring Board – BD (MD) Board – ................... 48
6-11. Schematic Diagram – BD SW (MD) Board – ............... 49
6-12. Printed Wiring Board – BD SW (MD) Board – ............ 49
6-13. Schematic Diagram – LOADING (CD) Board – .......... 49
6-14. Printed Wiring Board – LOADING (CD) Board – ....... 49
6-15. Printed Wiring Board – MD DIGITAL Board – ........... 50
6-16. Schematic Diagram – MD DIGITAL Board – .............. 51
6-17. Printed Wiring Board – MAIN Board – ........................ 52
6-18. Schematic Diagram – MAIN Board (1/3) – .................. 53
6-19. Schematic Diagram – MAIN Board (2/3) – .................. 54
6-20. Schematic Diagram – MAIN Board (3/3) – .................. 55
6-21. Printed Wiring Boards – AMP/SP Boards – .................. 56
6-22. Schematic Diagram – AMP/SP Boards – ...................... 57
6-23. Printed Wiring Board – PANEL Board – ...................... 58
6-24. Schematic Diagram – PANEL Board – ........................ 59
6-25. Printed Wiring Board – POWER Board – ..................... 60
6-26. Schematic Diagram – POWER Board – ........................ 61
6-27. IC Pin Function Description ........................................... 70
6-7. Schematic Diagram – BD (CD) Board – ....................... 45
6-8. Schematic Diagram – BD (MD) Board (1/2) – ............. 46
6-9. Schematic Diagram – BD (MD) Board (2/2) – ............. 47
6-10. Printed Wiring Board – BD (MD) Board – ................... 48
6-11. Schematic Diagram – BD SW (MD) Board – ............... 49
6-12. Printed Wiring Board – BD SW (MD) Board – ............ 49
6-13. Schematic Diagram – LOADING (CD) Board – .......... 49
6-14. Printed Wiring Board – LOADING (CD) Board – ....... 49
6-15. Printed Wiring Board – MD DIGITAL Board – ........... 50
6-16. Schematic Diagram – MD DIGITAL Board – .............. 51
6-17. Printed Wiring Board – MAIN Board – ........................ 52
6-18. Schematic Diagram – MAIN Board (1/3) – .................. 53
6-19. Schematic Diagram – MAIN Board (2/3) – .................. 54
6-20. Schematic Diagram – MAIN Board (3/3) – .................. 55
6-21. Printed Wiring Boards – AMP/SP Boards – .................. 56
6-22. Schematic Diagram – AMP/SP Boards – ...................... 57
6-23. Printed Wiring Board – PANEL Board – ...................... 58
6-24. Schematic Diagram – PANEL Board – ........................ 59
6-25. Printed Wiring Board – POWER Board – ..................... 60
6-26. Schematic Diagram – POWER Board – ........................ 61
6-27. IC Pin Function Description ........................................... 70
7.
EXPLODED VIEWS
................................................ 80
8.
ELECTRICAL PARTS LIST
............................... 86
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The following caution label is located inside the unit.
5
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
For CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
For MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
checking it for adjustment. It is feared that you will lose your sight.
CLEANING OBJECTIVE LENS OF OPTICAL PICK-UP
• In cleaning the objective lens of optical pick-up, be sure the
following below.
1. In cleaning the lens, do not apply an excessive force.
As the optical pick-up is vulnerable, application of excessive
force could damage the lens holder.
force could damage the lens holder.
2. In cleaning, do not use a cleaner other than exclusive cleaning
liquid (KK-91 or isopropyl alcohol).
3. Wipe the objective lens spirally from center toward outside.
(See Figure A)
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
MODEL IDENTIFICATION
— Back panel —
(Figure A)
4. Eject the disk, if loaded.
5. Disconnect the power cord from the socket to shut off the power
5. Disconnect the power cord from the socket to shut off the power
supply.
6. When cleaning the objective lens of optical pick-up in CD,
refer to “HOLDER (BU) ASS’Y” on page 24 for removing
HOLDER (BU) ASS’Y.
HOLDER (BU) ASS’Y.
PART No.
Model
Part No.
Hong Kong model
4-229-548-1[]
Korean model
4-232-128-0[]
Taiwan model
4-232-129-0[]
6
DRAWING OUT THE TRAY WHEN THE POWER IS OFF
CLEANING THE OPTICAL PICK-UP (CD PLAYER)
tray (CDM)
Move the cam block in the direction
of arrow
of arrow
A
with a finger.
A
CD mechanism deck
floating screw
(PTPWH M2.6)
(PTPWH M2.6)
optical pick-up block
Clean the lens block
with a cotton bud.
with a cotton bud.
7
SERVICE POSITION OF THE MD MECHANISM
DECK
DECK
SERVICE POSITION OF THE CD MECHANISM
DECK
DECK
MD mechanism deck
CD mechanism deck
SERVICE POSITION OF THE POWER BOARD
MAIN board
POWER board
CN993
CN802
Extension cable (4P)
(J-2501-042-A)
(J-2501-042-A)
Extension cable (3P)
(J-2501-045-A)
(J-2501-045-A)
AMP board