Sony CMT-CPX1 / HCD-CPX1 (serv.man2) Service Manual ▷ View online
2
HCD-CPX1
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2 V AC range are suitable. (See Fig. A)
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2 V AC range are suitable. (See Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
Ω
0.15
µ
F
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
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HCD-CPX1
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
4
2.
GENERAL
Location of Controls .......................................................
8
Setting the Clock .............................................................
9
3.
DISASSEMBLY
3-1. Disassembly Flow ........................................................... 10
3-2. Case ................................................................................. 11
3-3. Front Panel Section ......................................................... 11
3-4. TC Board, Mechanical Deck .......................................... 12
3-5. MAIN Board ................................................................... 12
3-6. Tuner Unit ....................................................................... 13
3-7. CD Mechanism Deck (CDM55A-K6BD44S) ................ 13
3-8. Loading Board ................................................................. 14
3-9. Cam (CDM55) ................................................................ 14
3-10. Base Unit (BU-K6BD44S) ............................................. 15
3-11. Motor Gear Assy (Sled) (M102), BD Board .................. 15
3-12. Optical Pick-up (KSS-213D) .......................................... 16
3-2. Case ................................................................................. 11
3-3. Front Panel Section ......................................................... 11
3-4. TC Board, Mechanical Deck .......................................... 12
3-5. MAIN Board ................................................................... 12
3-6. Tuner Unit ....................................................................... 13
3-7. CD Mechanism Deck (CDM55A-K6BD44S) ................ 13
3-8. Loading Board ................................................................. 14
3-9. Cam (CDM55) ................................................................ 14
3-10. Base Unit (BU-K6BD44S) ............................................. 15
3-11. Motor Gear Assy (Sled) (M102), BD Board .................. 15
3-12. Optical Pick-up (KSS-213D) .......................................... 16
4.
TEST MODE
.............................................................. 17
5.
ELECTRICAL ADJUSTMENTS
Deck Section ................................................................... 19
CD Section ...................................................................... 20
CD Section ...................................................................... 20
6.
DIAGRAMS
6-1. Block Diagram – CD Servo Section – ........................... 21
6-2. Block Diagram – TUNER/TAPE DECK Section – ...... 22
6-3. Block Diagram – MAIN Section – ................................ 23
6-4. Block Diagram
6-2. Block Diagram – TUNER/TAPE DECK Section – ...... 22
6-3. Block Diagram – MAIN Section – ................................ 23
6-4. Block Diagram
– DISPLAY/POWER SUPPLY Section – ...................... 24
6-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
6-6. Printed Wiring Board – BD Board – ............................. 26
6-7. Schematic Diagram – BD Board – ................................ 27
6-8. Printed Wiring Board – TC Board – .............................. 28
6-9. Schematic Diagram – TC Board – ................................. 29
6-10. Printed Wiring Boards
6-7. Schematic Diagram – BD Board – ................................ 27
6-8. Printed Wiring Board – TC Board – .............................. 28
6-9. Schematic Diagram – TC Board – ................................. 29
6-10. Printed Wiring Boards
– LOADING/MAIN Boards – ....................................... 31
6-11. Schematic Diagram – MAIN Board (1/2) – .................. 32
6-12. Schematic Diagram
6-12. Schematic Diagram
– LOADING/MAIN (2/2) Boards – ............................... 33
6-13. Printed Wiring Board – AMP Board – .......................... 34
6-14. Schematic Diagram – AMP Board – ............................. 35
6-15. Printed Wiring Boards
6-14. Schematic Diagram – AMP Board – ............................. 35
6-15. Printed Wiring Boards
– BACK LIGHT/LCD/SWITCH Boards – .................... 36
6-16. Schematic Diagram
– BACK LIGHT/LCD/SWITCH Boards – ................... 37
6-17. Printed Wiring Boards
– HP/SP OUT/POWER Boards – .................................. 38
6-18. Schematic Diagram
– HP/SP OUT/POWER Boards – ................................. 39
6-19. IC Pin Function Description ........................................... 44
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 47
7-2. Front Panel Section-1 ...................................................... 48
7-3. Front Panel Section-2 ...................................................... 49
7-4. Lid (TC) Section ............................................................. 50
7-5. Chassis Section-1 ............................................................ 51
7-6. Chassis Section-2 ............................................................ 52
7-7. Chassis Section-3 ............................................................ 53
7-8. CD Mechanism Deck Section
7-2. Front Panel Section-1 ...................................................... 48
7-3. Front Panel Section-2 ...................................................... 49
7-4. Lid (TC) Section ............................................................. 50
7-5. Chassis Section-1 ............................................................ 51
7-6. Chassis Section-2 ............................................................ 52
7-7. Chassis Section-3 ............................................................ 53
7-8. CD Mechanism Deck Section
(CDM55A-K6BD44S) .................................................... 54
7-9. Base Unit (BU-K6BD44S) ............................................. 55
8.
ELECTRICAL PARTS LIST
............................... 56
4
HCD-CPX1
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
NOTE ON INSTALLING AND REMOVING THE TAPE MECHANICAL DECK
To prevent four screws of +BVTP 3
× 8 TYPE 2 TT (B), that fix the mechanical deck to the front panel, from being magnetized, must not
use a magnetic screwdriver.
screw +BVTP 3
×
8 TYPE 2 TT (B)
screw +BVTP 3
×
8 TYPE 2 TT (B)
non-magnetic screwdriver
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Part No.
Model Name
Part No.
US and Canadian models
4-244-015-1
[]
Singapore model
4-244-015-2
[]
Australian model
4-244-015-3
[]
Korean model
4-244-015-4
[]
5
HCD-CPX1
TAPE MECHANICAL DECK SERVICE POSITION
Set up the service position with putting an insulator under the mechanical deck as the figure shown below.
tape mechanical deck
insulator
CD MECHANISM DECK SERVICE POSITION
Set up the service position for the CD mechanism deck with disassembling the entire set as the figure shown below.
AMP section
CD mechanism deck
main board
front panel
