Sony CMT-CP500MD / HCD-CP500MD Service Manual ▷ View online
4
HCD-CP500MD
SECTION 1
SERVICING NOTE
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
FOR CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
FOR MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
checking it for adjustment. It is feared that you will lose your sight.
This caution
label is
located inside
the unit.
label is
located inside
the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
5
HCD-CP500MD
DRAWING OUT THE TRAY DURING POWER OUT
CLEANING THE OPTICAL PICK-UP (CD PLAYER)
Tray
Move the cam block in the direction
of the arrow with a finger.
of the arrow with a finger.
CD mechanism deck
Optical pick-up block
Floating screw
Clean the lens block
with applicator.
with applicator.
6
HCD-CP500MD
SERVICE POSITION OF THE MD MECHANISM DECK
SERVICE POSITION OF THE CD MECHANISM DECK
MD mechanism deck
(MDM-7B)
(MDM-7B)
MD DIGITAL board
BD board
CN304
CN301
CN801
CN1001
MAIN board
CD mechanism deck
(CDM55F-K4BD43)
(CDM55F-K4BD43)
CN302
CN101
CN308
CN1
LOADING board
MAIN board
CD board
7
HCD-CP500MD
SERVICE POSITION OF THE TAPE MECHANISM DECK
Tape mechanism deck
CN301
CN303
