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2009B00-1

© 

2009.02

Model Name Using Similar Mechanism

NEW

Base Unit Name

BU-K6BD90-WOD

Optical Pick-up Block Name

KSM-213DCP

•  HCD-BX10 is the amplifi er, CD player and 

tuner section in CMT-BX10.

•  HCD-BX20 is the amplifi er, CD player and 

tuner section in CMT-BX20.

•  HCD-BX50BT is the amplifi er, bluetooth, CD 

player and tuner section in CMT-BX50BT.

Photo: HCD-BX50BT

• The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc.

and any use of such marks by Sony Corporation is under license. Other
trademarks and trade names are those of their respective owners.

• MPEG Layer-3 audio coding technology and patents licensed from

Fraunhofer IIS and Thomson.

DIN power output (rated):
18 + 18 W (6 ohms at 1 kHz, DIN)

DIN power output (rated):
18 + 18 W (6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference): 25 + 25 W (6 ohms 
at 1 kHz, 10% THD)

Inputs

Inputs

AUDIO IN (stereo mini jack): voltage 250 mV, impedance 47 
kilohms

Outputs

Outputs

PHONES (stereo mini jack): accepts headphones of 8 ohms or
more
SPEAKER: accepts impedance of 6 to 16 ohms

System: Compact disc and digital audio system
Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 200mm

from the objective lens surface on the Optical Pick-up Block
with 7mm aperture.

Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB

Continuous RMS power output (reference): 25 + 25 watts
(6 ohms at 1 kHz, 10% THD)

AUDIO IN (stereo mini jack): voltage250mV, impedance 47 
kilohms

PHONES (stereo mini jack): accepts headphones of 8 ohms or
more
SPEAKER: accepts impedance of 6 ohms

Communication system: Bluetooth Standard version 2.0
Output: Bluetooth Standard Power Class 2

Maximum communication range: Line of sight approx. 10 m

1)

Frequency band: 2.4 GHz band (2.4000 GHz – 2.4835GHz)

Modulation method: FHSS

Compatible Bluetooth profiles 

2)

:

A2DP (Advanced Audio Distribution Profile)

AVRCP (Audio Video Remote Control Profile)

1)

The actual range will vary depending on factors such as
obstacles between devices, magnetic filds around a microwave 
oven, static electricity, reception sensitivity, antenna’s
performance, operating system, software application, etc.

2)

Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.

Supported codecs:

Receive: SBC (Sub Band Codec), MP3
Transmit: SBC (Sub Band Codec)

DIN power output (rated):
12 + 12 W (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 15 + 15 W (6 ohms 
at 1 kHz, 10% THD)

Inputs

AUDIO IN (stereo mini jack): voltage 250 mV, impedance 
47 kilohms

Outputs

PHONES (stereo mini jack): accepts headphones of 8 ohms or 
more
SPEAKER: accepts impedance of 6 to 16 ohms

Power requirements:

Taiwan model: 120 V AC, 50/60 Hz
Mexican model: 120 V AC, 60 Hz
Argentina model: 220 V AC, 50/60 Hz
Korean, Chinese models: 220 V AC, 50/60 Hz

Australian model: 230 – 240 V AC, 50/60 Hz

HCD-BX10: 45 watts

HCD-BX20/BX50BT: 56 watts

Power consumption:

Dimensions (w/h/d) (excl. speakers): Approx. 215 × 140 × 298 mm
M

Design and specifications are subject to change without notice.

ass (excl. speakers):Approx. 3.9 kg

FM stereo, FM/AM superheterodyne tuner
FM tuner section:

Tuning range: 87.5 – 108.0 MHz (50 kHz step)
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz

AM tuner section:

Tuning range:

Latin American model:
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)

Australian model:
531 – 1,710 kHz (with 10 kHz tuning interval)
530 – 1,710 kHz (with 9 kHz tuning interval)

Antenna: AM loop antenna, external antenna terminal
Intermediate frequency: 450 kHz

Other models:
531 – 1,602 kHz (with 9 kHz tuning interval)
530 – 1,610 kHz (with 10 kHz tuning interval)

Other models: 120 V, 220 V, 230 – 240 V AC, 50/60 Hz, 
adjustable with voltage selector

DIN power output (rated): 
15 + 15 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 20 + 20 watts 
(6 ohms at 1 kHz, 10% THD)

  .............................................   3

  ..................................................................   5

3-1. Disassembly 

Flow 

...........................................................   7

3-2.  Panel (Side L/R) ..............................................................   8
3-3.  Top Panel Block ..............................................................   8
3-4.  TOP KEY Board, Panel Top ...........................................   9
3-5.  Front Panel Block ...........................................................   9
3-6.  Rear Panel Block ............................................................   10
3-7. Panel 

(Rear) 

....................................................................  10

3-8.  AMP Board Block ...........................................................   11
3-9.  POWER Board Block .....................................................   11
3-10. MAIN Board ...................................................................   12
3-11.  Loading Mechanism Block .............................................   12
3-12. Base Unit .........................................................................   13
3-13. Belt ..................................................................................   13
3-14.  OP Base Assy (KSM-213D) ...........................................   14

TEST  MODE 

 ............................................................   15

ELECTRICAL  CHECKS 

 ......................................   17

6-1.  Block Diagram - CD SERVO Section - ..........................   19
6-2.  Block Diagram - TUNER/BLUETOOTH Section - .......   20
6-3.  Block Diagram - MAIN Section - ...................................   21
6-4. Block 

Diagram 

 

- PANEL/POWER SUPPLY Section - ............................   22

6-5.  Printed Wiring Boards - CD Section - ............................   24
6-6.  Schematic Diagram - CD Board - ...................................   25
6-7. Printed 

Wiring 

Boards 

 

- BLUETOOTH Section (BX50BT) - .............................   26

6-8. Schematic 

Diagram 

 

- BLUETOOTH Section (BX50BT) - .............................   27

6-9.  Printed Wiring Boards - MAIN Section - .......................   28
6-10.  Schematic Diagram - MAIN Section (1/3) - ...................   29
6-11.  Schematic Diagram - MAIN Section (2/3) - ...................   30
6-12.  Schematic Diagram - MAIN Section (3/3) - ...................   31
6-13. Printed Wiring Boards 
 

- AMP/HEADPHONE Section - .....................................   32

6-14.  Schematic Diagram - AMP/HEADPHONE Section - ....   33
6-15.  Printed Wiring Boards - PANEL Section - .....................   34
6-16.  Schematic Diagram - PANEL Section - ..........................   35
6-17.  Printed Wiring Boards - POWER Section - ....................   36
6-18.  Schematic Diagram - POWER Section - ........................   37

7-1. Panel 

Section 

...................................................................  44

7-2.  Top Panel Section ...........................................................   45
7-3.  Front Panel Section .........................................................   46
7-4.  MAIN Board Section ......................................................   47
7-5.  POWER Board Section ...................................................   48
7-6.  Loading Mechanism Section ..........................................   49
7-7.  Base Unit Section (BU-K6BD90-WOD)  .......................   50

  ..............................   51

Notes on chip component replacement
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Flexible Circuit Board Repairing
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.

This appliance is classifi ed as a 
CLASS 1 LASER product.
This marking is located on the 
rear or bottom exterior.

仲♡⏰∄㉣⢋䗨䒌㆛旈⡺

㚐堩仒⯂ᷲ2䯟㼤₭濃DMBTT!2!

MBTFS濄ḋ␥Ɂ㚐㝫䫢ằᷲ倰曆⡺⡗
ᵮɁ

The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

HCD-BX50BT: SP

3-295-840-0[]

HCD-BX50BT: AUS

3-295-841-0[]

HCD-BX50BT: TW

3-295-842-0[]

HCD-BX50BT: KR

3-295-843-0[]

HCD-BX50BT: CH

3-295-844-0[]

HCD-BX10: SP

3-295-851-0[]

HCD-BX10: AUS

3-295-852-0[]

HCD-BX10: KR

3-295-854-0[]

HCD-BX20: E2, E51

3-295-858-0[]

HCD-BX20: AR

3-295-862-0[]

HCD-BX10: TH

3-879-687-0[]

• Abbreviation
 AR  : 

Argentina 

model

 AUS : 

Australian 

model

 CH  : 

Chinese 

model

  E2 

: 120V AC area in E model

  E51 

: Chilean and Peruvian models

  KR 

: Korean model

  SP 

: Singapore model

 TH  : 

Thai 

model

 TW  : 

Taiwan 

model

ANTITHEFT  UNLOCK  MODE
Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press the [FUNCTION] button to select “CD”.
3.  Press two buttons of [

x/

CANCEL] and [

A

] for 5 seconds.

4.  The message “UNLOCKED” is displayed on the fl uorescent 

indicator tube and the disc tray is unlocked.

Note:  When “LOCKED” is displayed, the tray lock is not released by 

turning power on/off with the [?/1] button.

NOTE  OF  REPLACING  THE  IC904  ON  THE  BT BOARD
IC904 on the BT board cannot exchange with single. When IC904 
on the BT board is damaged, exchange the entire mounted board.

Note:  Please insert a screwdriver after removing the panel (side L).
 

About disassembly of the panel (side L), please refer to “3-2. Panel (Side L/R)” (page 8).