Sony CFD-ZW700 / CFD-ZW705 / CFD-ZW750 / CFD-ZW770 Service Manual ▷ View online
5-8. SCHEMATIC DIAGRAM — CONTROL SECTION — (for CFD-ZW750/ZW770) • Refer to page 25 for Note on Schematic Diagram.
• Refer to page 53 for IC Block Diagrams.
– 27 –
– 28 –
CFD-ZW750/ZW770
(Page 50)
(Page 24)
(Page 33, 43)
5-9. PRINTED WIRING BOARD — MAIN SECTION — (for CFD-ZW750) • Refer to page 16 for Circuit Boards Location.
CFD-ZW750/ZW770
– 29 –
– 30 –
1
A
B
C
D
E
F
G
H
I
J
2
3
4
5
6
7
8
9
10
11
12
13
S303
(HIGH-SPEED
DUBBING)
S304
(MD POWER)
S305
(MD PLAY)
1
6
M
S306
(MD PLAY)
S307
(MD POWER)
M301
(CAPSTAN/REEL)
A
8
1
B
+
–
PHONES
04
J302
SPEAKER
IMPEDANCE 3.2
Ω
(Page 35)
(Page 25)
(Page 36) (Page 36)
(Page 26)
(Page 21)
Note:
• X
: parts extracted from the component side.
• b
: Pattern from the side which enables seeing.
– 31 –
– 32 –
– 33 –
CFD-ZW750/ZW770
5-10. SCHEMATIC DIAGRAM — MAIN SECTION (1/2) — (for CFD-ZW750) • Refer to page 53 for IC Block Diagrams.
Note:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
•
C
: panel designation.
•
U
: B+ Line.
•
H
: adjustment for repair.
• Power voltage is dc 9 V and fed with regulated dc power
supply from battery terminal.
• Voltage is dc with respect to ground under no-signal
(detuned) condition.
no mark : FM
(
no mark : FM
(
) : PB (TAPE)
<
> : REC (TAPE)
[
] : CD STOP
(( )) : DUBBING
<< >> : HIGH-SPEED DUBBING
<< >> : HIGH-SPEED DUBBING
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Signal path.
F
: FM
E
: PB (DECK A)
d
: PB (DECK B)
a
: REC (DECK B)
J
: CD
IC1
H-11
IC2
H-10
IC301
G-6
IC302
D-7
IC304
C-7
IC305
H-4
Q1
F-10
Q101
C-6
Q201
C-6
Q301
F-6
Q302
F-6
Q303
F-6
Q304
F-7
Q305
F-4
Q306
G-4
Q307
G-4
Q308
F-4
Q309
F-4
Q310
F-4
Q311
F-9
Q312
F-9
Q313
E-9
Q314
E-9
Q315
H-7
Q316
F-8
Q317
F-8
Q318
F-8
Q319
F-8
Q320
C-11
Q321
E-7
Q322
E-8
Q324
C-11
Q325
C-11
Q327
D-11
Q328
D-11
Q329
D-11
Q330
D-9
Q331
B-9
Q332
E-8
Q333
B-9
Q336
I-5
Q337
I-5
Q338
D-8
Q339
D-9
Q340
G-4
D1
F-12
D2
F-12
D3
F-11
D4
C-12
D5
B-12
D6
H-12
D8
C-12
D9
C-12
D10
H-12
D301
E-7
D302
H-5
D303
I-5
D304
F-4
D305
F-4
D306
H-9
D307
H-9
D308
H-9
D309
H-8
D310
H-8
D311
E-8
D312
E-8
D313
C-11
D314
C-11
D315
C-10
D316
D-10
D317
D-10
D318
D-11
D319
C-11
D320
C-11
D321
D-10
D322
D-10
D323
D-9
D324
E-10
D325
B-8
D326
B-10
D328
D-10
D330
G-4
D331
B-9
D332
G-5
D333
D-6
D334
H-4
D335
H-5
D336
H-8
D337
I-8
D338
H-8
D339
H-8
D340
H-8
D341
H-5
• Semiconductor Location
Ref. No.
Location
Ref. No.
Location
(Page 50)
(Page 24)
(Page 27)
(Page 37)
– 34 –
– 35 –
– 36 –
CFD-ZW750/ZW770
5-11. PRINTED WIRING BOARDS — POWER SUPPLY SECTION — (for CFD-ZW750) • Refer to page 16 for Circuit Boards Location.
1
A
B
C
D
E
F
G
H
2
3
4
5
6
7
8
9
10
11
12
13
14
1 - 672 - 800
1 - 672 - 797
DRY BATTERY
SIZE " D "
(IEC DESIGNATION R20)
6PCS,9V
< POWER >
DRY BATTERY
SIZE " AA "
(IEC DESIGNATION R6)
3PCS,4.5V
< BACK UP >
HE301
ERASE HEAD
Note:
• X
: parts extracted from the component side.
• b
: Pattern from the side which enables seeing.
Ref. No.
Location
D901
E-4
D902
D-4
D903
F-4
D904
E-4
D906
G-5
D907
G-5
D908
G-5
• Semiconductor
Location
(Page 30)
(Page 30)
(Page 30)
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