Sony CDP-XA50ES Service Manual ▷ View online
CDP-XA50ES
AEP Model
E Model
SERVICE MANUAL
COMPACT DISC PLAYER
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM32BB-12B (BLACK)
CDM32BN-12B (GOLD)
CDM32BN-12B (GOLD)
Base Unit Name
BU-12B
Optical Pick-up Name
KSS-273B/J1N
SPECIFICATIONS
Photo: Black
– Continued on next page –
9-960-813-12
Sony Corporation
2003F05-1
Home Audio Company
C
2003.06 Published by Sony Engineering Corporation-
Ver 1.1 2003.06
– 2 –
TABLE OF CONTENTS
1.
SERVICING NOTES
1-1.
How to Open the Disc Tray When Power Switch
Turns Off .......................................................................... 3
Turns Off .......................................................................... 3
1-2.
Preparation for Adjustment and Measurement ................ 3
2.
GENERAL
................................................................... 4
3.
DISASSEMBLY
.......................................................... 15
4.
TEST MODE
4-1.
AF Mode .......................................................................... 20
4-2.
ADJ Mode ....................................................................... 21
4-3.
CLV-S Mode .................................................................... 21
5.
ELECTRICAL ADJUSTMENTS
......................... 22
6.
DIAGRAMS
6-1.
Printed Wiring Boards — SERVO Section — ................. 25
6-2.
Schematic Diagram — SERVO Section — ..................... 27
6-3.
Schematic Diagram — AUDIO Section — ..................... 32
6-4.
Printed Wiring Boards — AUDIO Section — ................. 37
6-5.
Printed Wiring Boards — PANEL Section — ................. 39
6-6.
Schematic Diagram — PANEL Section — ..................... 41
6-7.
Printed Wiring Boards
— POWER SUPPLY Section — ..................................... 44
— POWER SUPPLY Section — ..................................... 44
6-8.
Schematic Diagram
— POWER SUPPLY Section — ..................................... 47
— POWER SUPPLY Section — ..................................... 47
6-9.
IC Pin Function Description ............................................ 54
7.
EXPLODED VIEWS
................................................ 60
8.
ELECTRICAL PARTS LIST
................................ 66
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED
LINE WITH MARK
!
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
MODEL IDENTIFICATION
– BACK PANEL –
4-986-742-
AEP Model
: 1
π
(CED)
Singapore Model : 2
π
(SP)
– 3 –
SECTION 1
SERVICING NOTES
1-1.
HOW TO OPEN THE DISC TRAY WHEN
POWER SWITCH TURNS OFF
POWER SWITCH TURNS OFF
Insert a tapering driver into the aperture of the unit bottom, and
turn in the direction of arrow (to OUT direction).
turn in the direction of arrow (to OUT direction).
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
ing repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The following caution label is located inside the unit.
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
procedures other than those specified herein may
result in hazardous radiation exposure.
[SERVO BOARD] – Conductor side –
IC91
IC101
+5 V
IC261
1
1-2.
PREPARATION FOR ADJUSTMENT AND
MEASUREMENT
MEASUREMENT
Perform connecting the IC261 pin 2 of SERVO board to the line
of +5V because this unit does not work without the stabilizer struc-
turally.
of +5V because this unit does not work without the stabilizer struc-
turally.
tray
tapering driver
*
To close the disc tray, turn the tapering
driver in the reverse direction (to IN di-
rection).
driver in the reverse direction (to IN di-
rection).
2
– 4 –
SECTION 2
GENERAL
This section is e
xtr
acted
acted
from instr
uction man
ual.