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2011I33-1

© 

2011.09

•  HBD-EF200 is the Amplifi er,  Video,  HDMI, 

BD/DVD/Super Audio CD/CD System, USB, 
LAN and FM Tuner section in BDV-EF200.

Model Name Using Similar Mechanism

HBD-E280

Mechanism Type

BPX-6

Optical Pick-up Block Name

KEM-470AAA

POWER OUTPUT (rated)
Front L/Front R:

80 W + 80 W (at 3 ohms, 
1 kHz, 1% THD)

POWER OUTPUT (reference)
Front L/Front R:

115 W (per channel at 3 
ohms, 1 kHz)

Subwoofer:

120 W (at 3 ohms, 80 Hz)

Inputs (Analog)
AUDIO (AUDIO IN)

Sensitivity: 450/250 mV

Inputs (Digital)
TV (Audio Return Channel/OPTICAL)

Supported formats: LPCM 
2CH (up to 48 kHz), Dolby 
Digital, DTS

HDMI (IN 1)/HDMI (IN 2)

Supported formats: LPCM 
2CH (up to 96 kHz), Dolby 
Digital, DTS

Outputs

VIDEO: 1 Vp-p 75 ohms

Connector

Type A (19pin)

Signal format system

NTSC/PAL

 (USB) port:

Type A (For connecting 
USB memory, memory 
card reader, digital still 
camera, and digital video 
camera)

LAN (100) terminal

100BASE-TX Terminal

System

PLL quartz-locked digital 
synthesizer

Tuning range

87.5 MHz - 108.0 MHz (50 
kHz step)

Antenna (aerial)

FM wire antenna (aerial)

Antenna (aerial) terminals 75 ohms, unbalanced

Power requirements

220 V - 240 V AC, 
50/60 Hz

Power consumption

On: 95 W
Standby: 0.3 W (at the 
Power Saving mode) 

Dimensions (approx.)

400 mm × 65 mm × 315 
mm (w/h/d) incl. 
projecting parts

Mass (approx.)

3.2 kg

Design and specifications are subject to change 
without notice.

s Standby power consumption 0.3W. 
s Over 85% power efficiency of amplifier block is 

achieved with the full digital amplifier, S-Master.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

•  This system incorporates with Dolby* Digital and the DTS** Digital Surround System.

  *  Manufactured under license from Dolby Laboratories.
   

Dolby and the double-D symbol are trademarks of Dolby Laboratories.

  ** Manufactured under license under U.S. Patent #’s:
    5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 7,212,872; 7,333,929; 

7,392,195; 7,272,567 & other U.S. and worldwide patents issued & pending.

 

  DTS, DTS-HD and the Symbol are registered trademarks, & DTS-HD Master Audio, and 

the DTS logos are trademarks of DTS, Inc. Product includes software. © DTS, Inc. All 
Rights Reserved.

•  This system incorporates High-Defi nition Multimedia Interface (HDMI™) technology.
 

HDMI, the HDMI logo and High-Defi nition Multimedia Interface are trademarks or registered 
trademarks of HDMI Licensing LLC in the United States and other countries.

•  Java is a trademark of Oracle and/or its affi liates.
•  “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray Disc Association.
•  “Blu-ray Disc” is a trademark.
•  “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVD-R,” “DVD VIDEO,” and “CD” 

logos are trademarks.

•  “Blu-ray 3D” and “Blu-ray 3D” logo are trademarks of Blu-ray Disc Association.
•  “BRAVIA” is a trademark of Sony Corporation.
•  “AVCHD” and the “AVCHD” logo are trademarks of Panasonic Corporation and Sony Corpora-

tion.

• 

 , “XMB,” and “xross media bar” are trademarks of Sony Corporation and Sony Computer 

Entertainment Inc.

•  “PLAYSTATION” is a trademark of Sony Computer Entertainment Inc.
•  The Wi-Fi CERTIFIED™ Logo is a certifi cation mark of the Wi-Fi Alliance.
•  The Wi-Fi Protected Setup™ Mark is a mark of the Wi-Fi Alliance.
•  “Wi-Fi CERTIFIED™” and “Wi-Fi Protected Setup™” are trademarks of the Wi-Fi Alliance.
•  “PhotoTV HD” and the “PhotoTV HD” logo are trademarks of Sony Corporation.
•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thom-

son.

•  iPhone, iPod, iPod classic, iPod nano, and iPod touch are trademarks of Apple Inc., registered in 

the U.S. and other countries.

 

•  “Made for iPod,” and “Made for iPhone” mean that an electronic accessory has been designed 

to connect specifi cally to iPod or iPhone, respectively, and has been certifi ed by the developer 
to meet Apple performance standards. Apple is not responsible for the operation of this device 
or its compliance with safety and regulatory standards. Please note that the use of this accessory 
with iPod or iPhone may affect wireless performance.

•  Windows Media is either a registered trademark or trademark of Microsoft Corporation in the 

United States and/or other countries.

 

This product contains technology subject to certain intellectual property rights of Microsoft. 
Use or distribution of this technology outside of this product is prohibited without the appro-
priate license(s) from Microsoft. Content owners use Microsoft PlayReady™ content access 
technology to protect their intellectual property, including copyrighted content. This device 
uses PlayReady technology to access PlayReady-protected content and/or WMDRMprotected 
content. If the device fails to properly enforce restrictions on content usage, content owners 
may require Microsoft to revoke the device’s ability to consume PlayReady-protected content. 
Revocation should not affect unprotected content or content protected by other content access 
technologies. Content owners may require you to upgrade PlayReady to access their content. If 
you decline an upgrade, you will not be able to access content that requires the upgrade.

•  All other trademarks are trademarks of their respective owners.
•  Other system and product names are generally trademarks or registered trademarks of the manu-

facturers. ™ and ® marks are not indicated in this document.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

This appliance is classified as a 
CLASS 3R LASER product. 
Visible and invisible laser radiation 
is emitted when the laser protective 
housing is opened, so be sure to 
avoid direct eye exposure.

This marking is located on the laser 
protective housing inside the 
enclosure.

This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.

  .............................................   4

2-1. Disassembly 

Flow 

...........................................................  11

2-2.  How To Bend Flexible Flat Cable ..................................   11
2-3. Case 

(E0) 

.........................................................................  12

2-4. Loading 

Panel 

.................................................................  12

2-5. Front 

Panel 

Assy 

.............................................................  13

2-6.  BD Drive (BPX-6) ..........................................................   13
2-7. MB-141 

Board 

................................................................  14

2-8. AMP 

Board 

.....................................................................  15

2-9.  Switching Regulator (SWR1) .........................................   16
2-10.  Optical Pick-up Block (KEM-470AAA), 

Wire (Flat Type) ..............................................................   17

TEST  MODE 

 ............................................................   18

ELECTRICAL  CHECK 

 .........................................   26

5-1.  Block Diagram - SERVO Section - ................................   27
5-2.  Block Diagram - MEMORY Section - ............................   28
5-3.  Block Diagram - HDMI Section - ...................................   29
5-4.  Block Diagram - MAIN Section - ...................................   30
5-5.  Block Diagram - AMP Section - .....................................   31
5-6.  Block Diagram - POWER SUPPLY Section - ................   32
5-7.  Printed Wiring Board - MB-141 Board (Side A) - ..........   34
5-8.  Printed Wiring Board - MB-141 Board (Side B) - ..........   35
5-9.  Schematic Diagram - MB-141 Board (1/12) - ................   36

5-10.  Schematic Diagram - MB-141 Board (2/12) - ................   37
5-11.  Schematic Diagram - MB-141 Board (3/12) - ................   38
5-12.  Schematic Diagram - MB-141 Board (4/12) - ................   39
5-13.  Schematic Diagram - MB-141 Board (5/12) - ................   40
5-14.  Schematic Diagram - MB-141 Board (6/12) - ................   41
5-15.  Schematic Diagram - MB-141 Board (7/12) - ................   42
5-16.  Schematic Diagram - MB-141 Board (8/12) - ................   43
5-17.  Schematic Diagram - MB-141 Board (9/12) - ................   44
5-18.  Schematic Diagram - MB-141 Board (10/12) - ..............   45
5-19.  Schematic Diagram - MB-141 Board (11/12) - ..............   46
5-20.  Schematic Diagram - MB-141 Board (12/12) - ..............   47
5-21. Printed Wiring Board 

- AMP Board (Component Side) - ..................................   48

5-22. Printed Wiring Board 

- AMP Board (Conductor Side) - ....................................   49

5-23.  Schematic Diagram - AMP Board (1/2) - .......................   50
5-24.  Schematic Diagram - AMP Board (2/2) - .......................   51
5-25.  Schematic Diagram - INPUT/OUTPUT Section - ..........   52
5-26.  Schematic Diagram - DISPLAY Board - ........................   53
5-27. Printed Wiring Boards 

- PANEL, INPUT/OUTPUT Section - ............................   54

6-1.  Case, Front Panel Section ...............................................   76
6-2.  Power Block Section .......................................................   77
6-3. Chassis 

Section 

...............................................................  78

6-4.  BD Drive Section (BPX-6) .............................................   79

  ..............................   80

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

J-6090-199-A

BLX-104

Single Layer

J-6090-200-A

BLX-204

Dual Layer

J-2501-307-A

CD (HLX-A1)

J-2501-305-A

HLX-513

Single Layer (NTSC)

J-2501-306-A

HLX-514

Dual Layer (NTSC)

J-6090-077-A

HLX-506

Single Layer (PAL)

J-6090-078-A

HLX-507

Dual Layer (PAL)

Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-

989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.

1. BLX-104
Procedure:
1. Select 

23.976Hz/1080p.

2.  Play “4.Motion picture”.
3.  Check whether player can play back or not.
4.  Check each outputs.
 Video:
 Composite/S 

Video/component/HDMI.

 Audio:
 Speaker 

out.

*  When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz) 

can use instead of 1080/24p.

 

However this is temporary correspondence.

2. BLX-204
Procedure:
1.  Select 1080i (59.94Hz or 50Hz).
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not (Check the picture 

and sound output).

Procedure:
Check whether player can play back or not (Check the sound out-
put).

4.  HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1.  After displayed Main Menu, select “1.Video Signal”.
2.  Play “1.Color bar 100%” (Check the picture and sound out-

put).

3.  Return to Menu.
4.  Play “Demonstration 4:3” or “Demonstration 16:9” (Check the 

picture and sound output).

IC501  AND  IC702  ON  THE  MB-141  BOARD
IC101, IC304, IC307, IC501 and IC702 on the MB-141 board 
cannot exchange with single. When these parts are damaged, ex-
change the complete mounted board.

NOTE  OF  REPLACING  THE  IC106,  IC107,  IC206  AND  
IC207  ON  THE  MB-141  BOARD
Replacement of IC106, IC107, IC206 and IC207 on the MB-141 
board used in this unit requires a special tool.

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn on the system.

2.  Press the [FUNCTION] button to select “BD/DVD”.
3.  Press the [

x

] and [

Z

] buttons simultaneously and hold down 

unit “DEMO OFF” displayed on the fluorescent indicator tube 
(around 5 seconds).

Note: When “DEMO LOCK” is displayed, the disc tray lock is not re-

leased by turning power on/off with the [?/1] button.

ABOUT  THE  LENS  CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the 
trouble.