DOWNLOAD Sony BDV-E500W / HCD-E500W Service Manual ↓ Size: 6.33 MB | Pages: 126 in PDF or view online for FREE

Model
BDV-E500W HCD-E500W
Pages
126
Size
6.33 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
bdv-e500w-hcd-e500w.pdf
Date

Sony BDV-E500W / HCD-E500W Service Manual ▷ View online

HCD-E500W
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
Part No.
Description
Layer
J-6090-199-A
BLX-104
Single Layer
J-6090-200-A
BLX-204
Dual Layer
3-702-101-01
CD (YEDS-18)
J-6090-088-A
HLX-504
Single Layer (NTSC)
J-6090-089-A
HLX-505
Dual Layer (NTSC)
J-6090-077-A
HLX-506
Single Layer (PAL)
J-6090-078-A
HLX-507
Dual Layer (PAL)
TEST  DISC
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Operation and Display:
1. BLX-104
Procedure:
1. Select 
23.976Hz/1080p.
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not.
4.  Check each outputs.
 Video:
 Composite/S 
Video/component/HDMI.
 Audio:
 Speaker 
out.
*  When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz) 
can use instead of 1080/24p.
 
However this is temporary correspondence.
2. BLX-204
Procedure:
1.  Select 1080i (59.94Hz or 50Hz).
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not (Check the picture 
and sound output).
3. CD (YEDS-18)
Procedure:
Check whether player can play back or not (Check the sound out-
put).
4.  HLX-504/505 (NTSC), HLX-506/507 (PAL)
Procedure:
1.  After displayed Main Menu, select “1.Video Signal”.
2.  Play “1.Color bar 100%” (Check the picture and sound out-
put).
3.  Return to Menu.
4.  Play “Demonstration 4:3” or “Demonstration 16:9” (Check the 
picture and sound output).
NOTE  THE  IC101,  IC102,  IC103,  IC202,  IC203,  IC307,  
IC308,  IC501,  IC502,  IC601,  IC602,  IC700  AND  IC701  
ON  THE  MB-124  BOARD  REPLACING
IC101, IC102, IC103, IC202, IC203, IC307, IC308, IC501, IC502, 
IC601, IC602, IC700 and IC701 on the MB-124 board cannot ex-
change with single. When these parts are damaged, exchange the 
entire mounted board.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1.  Press the [
?/1
] button to turn on the system.
2.  Press the [FUNCTION] button to select “BD/DVD”.
3.  Press the [
x
] and [
Z
] buttons simultaneously and hold down 
unit “UNLOCKED” displayed on the fluorescent indicator 
tube (around 5 seconds).
Note: When “LOCKED” is displayed, the disc tray lock is not released by 
turning power on/off with the [?/1] button.
ABOUT  THE  LENS  CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the 
trouble. 
HCD-E500W
5
MODEL  IDENTIFICATION
– Rear Chassis –
Part No.
Model
Part No.
US model
4-122-981-0[]
PX model
4-122-981-1[]
Canadian model
4-148-951-1[]
1 Remove the case.
 
(Illustration of disassembly is omitted.)
3
tray
2
clip etc.
HOW  TO  OPEN  THE  TRAY  WHEN  POWER  SWITCH  TURN  OFF
Ver. 1.1
HCD-E500W
6
lead wire
heat sink
MB-124  BOARD  SERVICE  POSITION
LEAD  WIRE  MUST  NOT  COME  IN  CONTACT  WITH  THE  HEAT  SINK
MB-124 board
HCD-E500W
7
MAIN board
Connect jig (extension cable J-2501-199-A) 
to the MAIN board (CN501)
800 
:/2 W
800 
:/2 W
– POWER Board (Conductor Side) –
C903
C934
MAIN  BOARD  SERVICE  POSITION
In checking the MAIN board, prepare jig (extension cable J-2501-199-A: 1 mm Pitch, 25 cores, Length 300 mm).
CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, for the electric shock prevention, connect the resistors to both ends of respective capacitors (C903 and C934) to 
discharge the capacitors (C903 and C934).
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Sony BDV-E500W / HCD-E500W Service Manual ▷ Download

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  • Here you can View online or download the Service Manual for the Sony BDV-E500W / HCD-E500W in PDF for free, which will help you to disassemble, recover, fix and repair Sony BDV-E500W / HCD-E500W Audio. Information contained in Sony BDV-E500W / HCD-E500W Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.