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2011F05-1

© 

2011.06

•  HBD-B1 is main unit in BDV-B1.

Model Name Using Similar Mechanism

NEW

Mechanism Type

VBP02

Optical Pick-up Block Name

TRV-BD412VH04R

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0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

      

      

Blu-ray Disc™, Blu-ray™, Blu-ray 3D™,  
BD-Live™, BONUSVIEW™ and the logos are 
trademarks of the Blu-ray Disc Association.

“DVD Logo” is a trademark of DVD Format/
Logo Licensing Corporation.

Java is a trademark of Oracle and/or its 
affiliates.

This system incorporates High-Definition 
Multimedia Interface (HDMI™) technology. 
HDMI, the HDMI logo and High-Definition 
Multimedia Interface are trademarks or 
registered trademarks of HDMI Licensing 
LLC in the United States and other countries.

Manufactured under license from Dolby 
Laboratories. Dolby and the double-D symbol 
are trademarks of Dolby Laboratories.

Manufactured under license under U. S. Patent 
#’s: 5,451,942; 5,956,674; 5,974,380; 5,978,762; 
6,226,616; 6,487,535; 7,392,195; 7,272,567; 
7,333,929; 7,212,872 & other U.S. and worldwide 
patents issued & pending. DTS and the Symbol 
are registered trademarks, & DTS-HD, DTS-
HD Master Audio | Essential and the DTS 
logos are trademarks of DTS, Inc. Product 
includes software. © DTS, Inc. All Rights 
Reserved.

 “x.v.Color” is a trademark of Sony 
Corporation.

“AVCHD” and the “AVCHD” logo are 
trademarks of Panasonic Corporation and 
Sony Corporation.

DivX®, DivX Certified® and associated logos 
are  trademark of DivX, Inc., and are used 
under license.

MPEG-4 VISUAL
THIS PRODUCT IS LICENSED UNDER 
THE MPEG-4 VISUAL PATENT 
PORTFOLIO LICENSE FOR THE 
PERSONAL AND NON-COMMERCIAL 
USE OF A CONSUMER FOR DECODING 
VIDEO IN COMPLIANCE WITH THE 
MPEG-4 VISUAL STANDARD (“MPEG-
4 VIDEO”) THAT WAS ENCODED BY A 
CONSUMER ENGAGED IN A PERSONAL 
AND NON-COMMERCIAL ACTIVITY 
AND/OR WAS OBTAINED FROM A 
VIDEO PROVIDER LICENSED BY MPEG 
LA TO PROVIDE MPEG-4 VIDEO.

NO LICENSE IS GRANTED OR SHALL 
BE IMPLIED FOR ANY OTHER 
USE. ADDITIONAL INFORMATION 
INCLUDING THAT RELATING TO 
PROMOTIONAL, INTERNAL AND 
COMMERCIAL USES AND LICENSING 
MAY BE OBTAINED FROM MPEG LA, 
LLC. SEE HTTP://WWW.MPEGLA.COM

MPEG-4 AVC and VC-1
THIS PRODUCT IS LICENSED UNDER 
THE AVC PATENT PORTFOLIO LICENSE 
AND VC-1 PATENT PORTFOLIO LICENSE 
FOR THE PERSONAL AND NON-
COMMERCIAL USE OF A CONSUMER 
TO DECODE VIDEO IN COMPLIANCE 
WITH THE AVC STANDARD (“AVC 
VIDEO”) AND/OR THE VC-1 STANDARD 
(“VC-1 VIDEO”) THAT WAS ENCODED 
BY A CONSUMER ENGAGED IN A 
PERSONAL AND NON-COMMERCIAL 
ACTIVITY AND/OR WAS OBTAINED 
FROM A VIDEO PROVIDER LICENSED 
TO PROVIDE AVC VIDEO AND/OR VC-1 
VIDEO. NO LICENSE IS GRANTED OR 
SHALL BE IMPLIED FOR ANY OTHER 
USE.

ADDITIONAL INFORMATION MAY BE 
OBTAINED FROM MPEG LA, L.L.C. SEE 
HTTP://WWW. MPEGLA.COM

MPEG Layer-3 audio coding technology and 
patents licensed from Fraunhofer IIS and 
Thomson.

Windows Media is either a registered 
trademark or trademark of Microsoft 
Corporation in the United States and/or other 
countries.

This product contains technology subject to 
certain intellectual property rights of Microsoft. 
Use or distribution of this technology outside 
of this product is prohibited without the 
appropriate license(s) from Microsoft.

All other trademarks are trademarks of their 
respective owners.

 

This appliance is 
classified as a CLASS 1 
LASER product. This 

marking is located on the rear of the unit.

  .............................................   4

2-1. Disassembly 

Flow 

...........................................................   6

2-2. Stand 

Base 

Assy 

..............................................................   6

2-3.  Panel Center Assy (TPA1) ..............................................   7
2-4. FRONT 

Board 

.................................................................   7

2-5. Panel 

Front 

Assy 

.............................................................   8

2-6.  Audio Deck Assembly (VBP02) .....................................   9
2-7.  Case Assembly (Speaker Unit) (Rch) (SP2) ...................   9
2-8.  Case Assembly (Speaker Unit) (Lch) (SP1) ...................   10
2-9. JACK 

Board 

....................................................................  10

2-10.  Chassis (Front) Block .....................................................   11
2-11. AMP+SMPS Board.........................................................  12
2-12.  Chassis (Main) Block ......................................................   12
2-13. MAIN Board ...................................................................   13

 ..........................   14

4-1.  Schematic Diagram - MAIN Board (1/10) - ...................   16
4-2.  Schematic Diagram - MAIN Board (2/10) - ...................   17
4-3.  Schematic Diagram - MAIN Board (3/10) - ...................   18
4-4.  Schematic Diagram - MAIN Board (4/10) - ...................   19

4-5.  Schematic Diagram - MAIN Board (5/10) - ...................   20
4-6.  Schematic Diagram - MAIN Board (6/10) - ...................   21
4-7.  Schematic Diagram - MAIN Board (7/10) - ...................   22
4-8.  Schematic Diagram - MAIN Board (8/10) - ...................   23
4-9.  Schematic Diagram - MAIN Board (9/10) - ...................   24
4-10.  Schematic Diagram - MAIN Board (10/10) - .................   25
4-11.  Printed Wiring Board - MAIN Board - ...........................   26
4-12.  Printed Wiring Boards - FRONT, JACK Boards - ..........   27
4-13.  Schematic Diagram - JACK Board - ..............................   28
4-14.  Schematic Diagram - FRONT Board - ...........................   29
4-15.  Schematic Diagram - AMP+SMPS Board (1/4) - ...........   30
4-16.  Schematic Diagram - AMP+SMPS Board (2/4) - ...........   31
4-17.  Schematic Diagram - AMP+SMPS Board (3/4) - ...........   32
4-18.  Schematic Diagram - AMP+SMPS Board (4/4) - ...........   33
4-19.  Printed Wiring Board - AMP+SMPS Board - .................   34

5-1.  Front Panel Section .........................................................   35
5-2. Speaker 

Section 

...............................................................  36

5-3.  Rear Case Section ...........................................................   37
5-4.  Mechanism Deck Section (VBP02) ................................   38

  ..............................   39

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.

• AMP+SMPS 

board

 

C900, C952, C953, C962

:/2 W) 

:/10 W) 

:/10 W) 

:/10 W) 

NOTE  THE  PARTS  ON  THE  EACH  BOARDS  REPAIR-
ING
The mount parts on each boards installed in this set cannot ex-
change with single excluding a part of parts.
Refer to ELECTRICAL PARTS LIST (page 39) for parts that can 
be exchanged.
When the each mount parts that have not been described to ELEC-
TRICAL PARTS LIST are damaged, exchange the entire mounted 
board.
Printed wiring board and schematic diagram have been described 
to this service manual is for the reference.