Sony AIR-SA10 / DAV-HDX277WC / DAVHDX576WF / DAV-HDX678WF / DAV-HDX975WF Service Manual ▷ View online
AIR-SA10
10
SECTION 4
TEST MODE
FACTORY SETTING
Procedure:
1. Press the [
Procedure:
1. Press the [
?/1
] button to turn the main power on.
2. Press three buttons of [
x
], [DISPLAY], and [
?/1
] simultane-
ously.
3. The messages “RESET” is displayed on the liquid crystal dis-
play and the main power is turned off.
4. The [S-AIR ID] switch is set to [A].
LIQUID CRYSTAL DISPLAY AND KEYS CHECK
Procedure:
1. Press the [
Procedure:
1. Press the [
?/1
] button to turn the main power on.
2. Press three buttons of [
x
], [DISPLAY], and [
N
] simultane-
ously.
3. Then all segments of liquid crystal display are turned on and
all LEDs are lighted.
4. Press the [DISPLAY] button, the model name and destination
are displayed on the liquid crystal display. (Example: “S-AIR
NA”)
NA”)
5. Press the [SLEEP] button, the model released date and version
of the micro computer are displayed on the liquid crystal dis-
play. (Example: “1220V104”)
play. (Example: “1220V104”)
6. Press the [CLOCK/TIMER MENU] button, the messages
“KEY0 0 0” is displayed on the liquid crystal display.
7. The following message are displayed by pressing the key that
corresponds.
Key
Message
?
/
1
KEY1 0 0
S-AIR CH
KEY2 0 0
N
KEY3 0 0
X
KEY0 0 1
CANCEL
x
KEY0 0 1
PRESET –
.
KEY0 0 2
PRESET +
>
KEY0 0 3
DISPLAY
KEY0 1 0
SLEEP
KEY0 2 0
CLOCK/TIMER MENU
KEY0 3 0
CLOCK/TIMER ENTER
KEY0 4 0
VOLUME –
KEY0 0 4
VOLUME +
KEY0 0 5
8. Press three buttons of [
x
], [DISPLAY], and [
N
] simultane-
ously.
9. Press the [
?/1
] button to turn the main power off.
GENERAL OPERATION CHECK
Note: EZW-RT10 is necessary. Check after inserting EZW-RT10 in
AIR-SA10.
Connection:
Base unit
(Test disc play)
Test disc:
YEDS-18
(Part No.: 3-702-101-01)
YEDS-18
(Part No.: 3-702-101-01)
S-AIR ID: C
AIR-SA10 EZW-RT10
Wireless
communication
Procedure:
1. Insert the EZW-RT10 in the AIR-SA10 and the [S-AIR ID]
1. Insert the EZW-RT10 in the AIR-SA10 and the [S-AIR ID]
switch is set to [A].
2. Press
the
[
?/1
] button to turn the main power on. (the [S-AIR]
indicator blinks)
3. The [S-AIR ID] switch is set to [C], the messages “LINKED”
is displayed on the liquid crystal display. (the [S-AIR] indica-
tor lights)
tor lights)
4. Confi rm sounding from the speaker.
5. Confi rm the volume changes if you press the [VOLUME +]
5. Confi rm the volume changes if you press the [VOLUME +]
and [VOLUME –] buttons.
6. Insert the headphone in the AIR-SA10 and confi rm sounding
from the headphone.
7. Press the [
X
] button and confi rm the sound stops.
8. Press the [
X
] button and confi rm sounding from the head-
phone.
9. Press the [
?/1
] button to turn the main power off.
10. Detach the EZW-RT10 from the AIR-SA10.
VIBRATION NOISE CHECK
Note: EZW-RT10 is necessary. Check after inserting EZW-RT10 in
AIR-SA10.
Connection:
Base unit
(Sweep disc play)
Sweep disc:
Disc where Sweep signal
from 100 Hz to 1 kHz
(20 seconds) was collected.
(Make it with free software
(The example: WaveGene). )
Disc where Sweep signal
from 100 Hz to 1 kHz
(20 seconds) was collected.
(Make it with free software
(The example: WaveGene). )
Wireless
communication
AIR-SA10 EZW-RT10
S-AIR ID: B
Procedure:
1. Insert the EZW-RT10 in the AIR-SA10 and the [S-AIR ID]
1. Insert the EZW-RT10 in the AIR-SA10 and the [S-AIR ID]
switch is set to [B].
2. Press the [
?/1
] button to turn the main power on.
3. Press the [VOLUME +] and [VOLUME –] buttons to set the
volume to “25”.
4. Press the [
N
] button, and hear sweep sound by all of the one
track. At this time, confi rm whether vibration noise has not
happened.
happened.
5. Press the [
?/1
] button to turn the main power off.
6. Detach the EZW-RT10 from the AIR-SA10.
SECTION 5
ELECTRICAL CHECK
AIR-SA10
AIR-SA10
11
11
SECTION 6
DIAGRAMS
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f :
internal
component.
•
C : panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
•
A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
Ω).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
AUDIO
• Abbreviation
CND : Canadian model
RU :
CND : Canadian model
RU :
Russian
model
For Printed Wiring Boards.
Note:
•
•
X : Parts extracted from the component side.
•
Y : parts extracted from the conductor side.
• f :
internal
component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Note:
The components identi-
fi
The components identi-
fi
ed by mark
0 or dotted
line with mark
0 are criti-
cal for safety.
Replace only with part
number specifi ed.
Replace only with part
number specifi ed.
Note:
Les composants identifi és
par une marque
Les composants identifi és
par une marque
0 sont
critiques pour la sécurité.
Ne les remplacer que par
une piéce portant le nu-
méro spécifi é.
Ne les remplacer que par
une piéce portant le nu-
méro spécifi é.
Caution:
Parts face side:
(Conductor Side)
Pattern face side:
(Component Side)
Parts face side:
(Conductor Side)
Pattern face side:
(Component Side)
Parts on the parts face side seen from
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
• Circuit Boards Location
TOP KEY board
MAIN board
S-AIR RX-IF board
POWER board
REG board
HP board
LCD board
AMP board
• Waveforms
– S-AIR RX-IF Board –
– S-AIR RX-IF Board –
8.5
μs
2.6 Vp-p
XB
IC801 UT (OSC2)
1 V/DIV, 2
μs/DIV
IC003 (1Y)
1 V/DIV, 20 ns/DIV
81.4 ns
3.6 Vp-p
IC008 (MCLK)
1 V/DIV, 20 ns/DIV
81.4 ns
4.5 Vp-p
RB
IC601 (XT2)
1 V/DIV, 10
μs/DIV
30.5
μs
3.2 Vp-p
RT
IC601 (X2)
1 V/DIV, 20 ns/DIV
62.5 ns
3.2 Vp-p
– MAIN Board –
– LCD Board –
Ver. 1.1
AIR-SA10
AIR-SA10
12
12
6-1. PRINTED WIRING BOARD - S-AIR RX-IF Board (Suffi x-11) -
•
: Uses unleaded solder.
• See page 11 for Circuit Boards Location.
CN003
CN001
X001
R017
IC008
C012
R003
R001
R032
R033
R012
C007
C006
R002
R007
R019
C004
C026
C010
R014
R016
R020
R088
R056
R057
R051
R055
R054
C015
C016
R029
C048
R048
R047
C047
C009
C008
R027
C022
C021
C023
C024
C013
IC003
C045
C046
C031
C032
C058
C059
R087
R085
R093
R090
R013
R015
R018
C017
R052
R053
R059
R058
R049
R050
C042
R092
R096
R094
1
8
5
4
1
10
20
1
20
2
19
11
1-875-850-
11
(11)
S-AIR RX-IF BOARD
(COMPONENT SIDE)
A1
MAIN BOARD
CN301
1-875-850-
11
(11)
S-AIR RX-IF BOARD
(CONDUCTOR SIDE)
WIRELESS
TRANSCEIVER
(EZW-RT10)
EZW-RT10
A
B
C
1
2
3
4
5
6
7
8
9
10
(Page 18)
CN003
CN001
X001
R017
IC008
C012
R003
R001
R032
R033
R012
C007
C006
R002
R007
R019
C004
C026
C010
R014
R016
R020
R088
R056
R057
R051
R055
R054
C015
C016
C018
R029
C048
R048
R047
C047
C009
C008
R027
C022
C021
C023
C024
C013
IC003
C045
C046
C031
C032
C058
C059
R087
R085
R093
R090
R013
R015
R018
C017
R052
R053
R059
R058
R049
R050
C042
R092
R096
R094
1
8
5
4
1
10
20
1
20
2
19
11
1-875-850-
12
(12)
S-AIR RX-IF BOARD
(COMPONENT SIDE)
A2
MAIN BOARD
CN301
1-875-850-
12
(12)
S-AIR RX-IF BOARD
(CONDUCTOR SIDE)
WIRELESS
TRANSCEIVER
(EZW-RT10)
EZW-RT10
A
B
C
1
2
3
4
5
6
7
8
9
10
(Page 18)
6-2. PRINTED WIRING BOARD - S-AIR RX-IF Board (Suffi x-12) -
•
: Uses unleaded solder.
• See page 11 for Circuit Boards Location.
Note: Refer to the Servicing Notes “S-AIR RX-IF BOARD DISCRIMINATION” (page 3) for how
to distinguish Suffi x-11 and Suffi x-12.
Ver. 1.1
AIR-SA10
AIR-SA10
13
13
6-3. SCHEMATIC DIAGRAM - S-AIR RX-IF Board -
• See page 11 for Waveforms. • See page 21 for IC Block Diagrams.
(SUFFIX-11)
(SUFFIX-12)
(SUFFIX-12)
(SUFFIX-11) (SUFFIX-12)
R094
R001
R002
R003
R096
R087
R085
R093
R090
R092
C042
R088
R020
R018
C031
C032
R007
C017
R033
R032
C006
C007
X001
R013
R012
R015
R014
R016
C010
C026
R017
C013
C012
C008
C009
C015
C018
C004
(SUFFIX-12)
(SUFFIX-12)
(SUFFIX-12)
(SUFFIX-12)
(SUFFIX-11)
(SUFFIX-11)
(SUFFIX-11)
(SUFFIX-11)
R051
R027
CN003
R029
R047
R048
C045
C046
R049
R050
C047
C021
C023
C024
C022
R059
R058
R057
R056
R055
R054
C059
C058
R053
R052
IC003
IC008
R018
CN001
R019
R007
C048
10k
100
100
100
10k
100
100
10k
10k
R020
100
10k
0.1
100k
100p
100p
100
10p
10
10
39p
33p
12.288MHz
1M
1k
R019
100
100k
100
100k
0.01
0.01
1k
10
0.1
10
0.1
10
0.01
C016
0.1
10p
10k
0
13P
0
47k
47k
1000p
1000p
100
220
0
10
10
0.1
0.1
100
100
10k
10k
1k
10k
100p
100p
10k
10k
TC7WHU04FK
T5RSOYF
WM8728
SEDS/RV
SEDS/RV
100
20P
0
A5V
R-CH
AGND
L-CH
GND
DAC-SL
DAC-DA
INT
3.3V
GND
RESN
I2C_SDA
I2C_SCL
SDOUT_C
SDOUT_A
GND
BCK
SDOUT_B
LRCK
I2C_SDA
SDOUT_D
RSEN
I2C_SCL
LINK_IND
CONNECT
DEBUG_TXD
INT
A1
A0
AUDIO_CLK
GND
VCC-3.3V
GND
GND
VCC
LATI2S
SCK
SDI
DEM
MUTEB
MOD
E
CSBIWL
VREF
P
VREFN
VMID
VOUTL
LRCIN
DIN
BCKIN
MCL
K
ZERO
DGND
DVDD
VOU
TR
AGN
D
AVDD
D/A CONVERTER
(EZW-RT10)
WIRELESS
TRANSCEIVER
EZW-RT10
CLOCK BUFFER
(Page 20)
Ver. 1.1
Note: Refer to the Servicing Notes “S-AIR RX-IF BOARD DISCRIMINATION” (page 3) for how
to distinguish Suffi x-11 and Suffi x-12.
Click on the first or last page to see other AIR-SA10 / DAV-HDX277WC / DAVHDX576WF / DAV-HDX678WF / DAV-HDX975WF service manuals if exist.