Sony AIR-SA10 / DAV-HDX277WC / DAVHDX576WF / DAV-HDX678WF / DAV-HDX975WF Service Manual ▷ View online
AIR-SA10
8
3-5. S-AIR RX-IF BOARD, KEY BOARD, MAIN BOARD
Note: This illustration is seeing top panel block from the inside.
two screws
(BVTP2.6)
RH two screws
(BVTP2.6)
screw
(BVTP2.6)
nine screws
(BVTP2.6)
RB KEY board
screw
(BVTP2.6)
flexible flat cable (13 core)
(CN003)
clamp (L35)
shield sheet (SAIR)
two solders
RT flexible flat cable (13 core)
(CN301)
RE four screws (BVTP2.6)
RG MAIN board
flexible flat cable (5 core)
(CN802)
RI holder (SAIR)
S-AIR RX-IF board
AIR-SA10
9
3-6. REG BOARD, POWER TRANSFORMER (PT901), POWER CORD
3-7. AMP BOARD, LCD BOARD
Note: This illustration is seeing front panel block from the inside.
four screws
(BVTP3
× 10)
REG board
Cut two cables tie.
Remove a solder.
(cable:
white)
Remove a solder.
(cable:
black)
four screws
(BVTP3
× 10)
power
transformer
(PT901)
(PT901)
POWER board
RB screw
(BVTP3
× 10)
RT coating clip
RE AC HOLDER board
RH power cord
RG ferrite core
Remove the solder.
Note: When installing the power code,
note the color of cable.
four screws
(BVTP2.6)
three screws
(BVTP2.6)
LCD board
AMP board
AIR-SA10
10
SECTION 4
TEST MODE
FACTORY SETTING
Procedure:
1. Press the [
Procedure:
1. Press the [
?/1
] button to turn the main power on.
2. Press three buttons of [
x
], [DISPLAY], and [
?/1
] simultane-
ously.
3. The messages “RESET” is displayed on the liquid crystal dis-
play and the main power is turned off.
4. The [S-AIR ID] switch is set to [A].
LIQUID CRYSTAL DISPLAY AND KEYS CHECK
Procedure:
1. Press the [
Procedure:
1. Press the [
?/1
] button to turn the main power on.
2. Press three buttons of [
x
], [DISPLAY], and [
N
] simultane-
ously.
3. Then all segments of liquid crystal display are turned on and
all LEDs are lighted.
4. Press the [DISPLAY] button, the model name and destination
are displayed on the liquid crystal display. (Example: “S-AIR
NA”)
NA”)
5. Press the [SLEEP] button, the model released date and version
of the micro computer are displayed on the liquid crystal dis-
play. (Example: “1220V104”)
play. (Example: “1220V104”)
6. Press the [CLOCK/TIMER MENU] button, the messages
“KEY0 0 0” is displayed on the liquid crystal display.
7. The following message are displayed by pressing the key that
corresponds.
Key
Message
?
/
1
KEY1 0 0
S-AIR CH
KEY2 0 0
N
KEY3 0 0
X
KEY0 0 1
CANCEL
x
KEY0 0 1
PRESET –
.
KEY0 0 2
PRESET +
>
KEY0 0 3
DISPLAY
KEY0 1 0
SLEEP
KEY0 2 0
CLOCK/TIMER MENU
KEY0 3 0
CLOCK/TIMER ENTER
KEY0 4 0
VOLUME –
KEY0 0 4
VOLUME +
KEY0 0 5
8. Press three buttons of [
x
], [DISPLAY], and [
N
] simultane-
ously.
9. Press the [
?/1
] button to turn the main power off.
GENERAL OPERATION CHECK
Note: EZW-RT10 is necessary. Check after inserting EZW-RT10 in
AIR-SA10.
Connection:
Base unit
(Test disc play)
Test disc:
YEDS-18
(Part No.: 3-702-101-01)
YEDS-18
(Part No.: 3-702-101-01)
S-AIR ID: C
AIR-SA10 EZW-RT10
Wireless
communication
Procedure:
1. Insert the EZW-RT10 in the AIR-SA10 and the [S-AIR ID]
1. Insert the EZW-RT10 in the AIR-SA10 and the [S-AIR ID]
switch is set to [A].
2. Press
the
[
?/1
] button to turn the main power on. (the [S-AIR]
indicator blinks)
3. The [S-AIR ID] switch is set to [C], the messages “LINKED”
is displayed on the liquid crystal display. (the [S-AIR] indica-
tor lights)
tor lights)
4. Confi rm sounding from the speaker.
5. Confi rm the volume changes if you press the [VOLUME +]
5. Confi rm the volume changes if you press the [VOLUME +]
and [VOLUME –] buttons.
6. Insert the headphone in the AIR-SA10 and confi rm sounding
from the headphone.
7. Press the [
X
] button and confi rm the sound stops.
8. Press the [
X
] button and confi rm sounding from the head-
phone.
9. Press the [
?/1
] button to turn the main power off.
10. Detach the EZW-RT10 from the AIR-SA10.
VIBRATION NOISE CHECK
Note: EZW-RT10 is necessary. Check after inserting EZW-RT10 in
AIR-SA10.
Connection:
Base unit
(Sweep disc play)
Sweep disc:
Disc where Sweep signal
from 100 Hz to 1 kHz
(20 seconds) was collected.
(Make it with free software
(The example: WaveGene). )
Disc where Sweep signal
from 100 Hz to 1 kHz
(20 seconds) was collected.
(Make it with free software
(The example: WaveGene). )
Wireless
communication
AIR-SA10 EZW-RT10
S-AIR ID: B
Procedure:
1. Insert the EZW-RT10 in the AIR-SA10 and the [S-AIR ID]
1. Insert the EZW-RT10 in the AIR-SA10 and the [S-AIR ID]
switch is set to [B].
2. Press the [
?/1
] button to turn the main power on.
3. Press the [VOLUME +] and [VOLUME –] buttons to set the
volume to “25”.
4. Press the [
N
] button, and hear sweep sound by all of the one
track. At this time, confi rm whether vibration noise has not
happened.
happened.
5. Press the [
?/1
] button to turn the main power off.
6. Detach the EZW-RT10 from the AIR-SA10.
SECTION 5
ELECTRICAL CHECK
AIR-SA10
AIR-SA10
11
11
SECTION 6
DIAGRAMS
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f :
internal
component.
•
C : panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
•
A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
Ω).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
AUDIO
• Abbreviation
CND : Canadian model
RU :
CND : Canadian model
RU :
Russian
model
For Printed Wiring Boards.
Note:
•
•
X : Parts extracted from the component side.
•
Y : parts extracted from the conductor side.
• f :
internal
component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Note:
The components identi-
fi
The components identi-
fi
ed by mark
0 or dotted
line with mark
0 are criti-
cal for safety.
Replace only with part
number specifi ed.
Replace only with part
number specifi ed.
Note:
Les composants identifi és
par une marque
Les composants identifi és
par une marque
0 sont
critiques pour la sécurité.
Ne les remplacer que par
une piéce portant le nu-
méro spécifi é.
Ne les remplacer que par
une piéce portant le nu-
méro spécifi é.
Caution:
Parts face side:
(Conductor Side)
Pattern face side:
(Component Side)
Parts face side:
(Conductor Side)
Pattern face side:
(Component Side)
Parts on the parts face side seen from
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
• Circuit Boards Location
TOP KEY board
MAIN board
S-AIR RX-IF board
POWER board
REG board
HP board
LCD board
AMP board
• Waveforms
– S-AIR RX-IF Board –
– S-AIR RX-IF Board –
8.5
μs
2.6 Vp-p
XB
IC801 UT (OSC2)
1 V/DIV, 2
μs/DIV
IC003 (1Y)
1 V/DIV, 20 ns/DIV
81.4 ns
3.6 Vp-p
IC008 (MCLK)
1 V/DIV, 20 ns/DIV
81.4 ns
4.5 Vp-p
RB
IC601 (XT2)
1 V/DIV, 10
μs/DIV
30.5
μs
3.2 Vp-p
RT
IC601 (X2)
1 V/DIV, 20 ns/DIV
62.5 ns
3.2 Vp-p
– MAIN Board –
– LCD Board –
Ver. 1.1
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