Sharp LC-17SH1E (serv.man3) Service Manual ▷ View online
B-1
Masking Tape
(Cotton Tape)
(Cotton Tape)
DISASSEMBLY INSTRUCTIONS
1.
REMOVAL
IC
Put Masking Tape (cotton tape) around the Flat Package
IC to protect other parts from any damage.
(Refer to Fig. 1-1.)
IC to protect other parts from any damage.
(Refer to Fig. 1-1.)
1.
Fig. 1-1
NOTE
REMOVAL AND INSTALLATION OF
FLAT PACKAGE IC
FLAT PACKAGE IC
Some ICs on the PCB are affixed with glue, so be
careful not to break or damage the foil of each IC
leads or solder lands under the IC when removing it.
careful not to break or damage the foil of each IC
leads or solder lands under the IC when removing it.
NOTE
Masking is carried out on all the parts located within
10 mm distance from IC leads.
10 mm distance from IC leads.
Blower type IC
desoldering machine
desoldering machine
IC
Heat the IC leads using a blower type IC desoldering
machine. (Refer to Fig. 1-2.)
machine. (Refer to Fig. 1-2.)
2.
Fig. 1-2
NOTE
Do not rotate or move the IC back and forth , until IC
can move back and forth easily after desoldering the
leads completely.
can move back and forth easily after desoldering the
leads completely.
When IC starts moving back and forth easily after
desoldering completely, pickup the corner of the IC using
tweezers and remove the IC by moving with the IC
desoldering machine. (Refer to Fig. 1-3.)
desoldering completely, pickup the corner of the IC using
tweezers and remove the IC by moving with the IC
desoldering machine. (Refer to Fig. 1-3.)
3.
Blower type IC
desoldering
machine
desoldering
machine
IC
Fig. 1-3
Tweezers
Peel off the Masking Tape.
4.
Absorb the solder left on the pattern using the Braided
Shield Wire. (Refer to Fig. 1-4.)
Shield Wire. (Refer to Fig. 1-4.)
5.
NOTE
Do not move the Braided Shield Wire in the vertical
direction towards the IC pattern.
direction towards the IC pattern.
Braided Shield Wire
Soldering Iron
Fig. 1-4
IC pattern
B-2
DISASSEMBLY INSTRUCTIONS
Supply soldering
from upper position
to lower position
from upper position
to lower position
IC
Supply the solder from the upper position of IC leads
sliding to the lower position of the IC leads.
(Refer to Fig. 1-6.)
sliding to the lower position of the IC leads.
(Refer to Fig. 1-6.)
2.
Fig. 1-6
Soldering Iron
Solder
IC
Absorb the solder left on the lead using the Braided
Shield Wire. (Refer to Fig. 1-7.)
Shield Wire. (Refer to Fig. 1-7.)
3.
Fig. 1-7
Soldering Iron
Braided Shield Wire
NOTE
Do not absorb the solder to excess.
IC
When bridge-soldering between terminals and/or the
soldering amount are not enough, resolder using a Thin-
tip Soldering Iron. (Refer to Fig. 1-8.)
soldering amount are not enough, resolder using a Thin-
tip Soldering Iron. (Refer to Fig. 1-8.)
4.
Fig. 1-8
Thin-tip Soldering Iron
NOTE
When the IC leads are bent during soldering and/or
repairing, do not repair the bending of leads. If the
bending of leads are repaired, the pattern may be
damaged. So, always be sure to replace the IC in this
case.
repairing, do not repair the bending of leads. If the
bending of leads are repaired, the pattern may be
damaged. So, always be sure to replace the IC in this
case.
Finally, confirm the soldering status on four sides of the
IC using a magnifying glass.
Confirm that no abnormality is found on the soldering
position and installation position of the parts around the
IC. If some abnormality is found, correct by resoldering.
IC using a magnifying glass.
Confirm that no abnormality is found on the soldering
position and installation position of the parts around the
IC. If some abnormality is found, correct by resoldering.
5.
Solder temporarily
Soldering Iron
INSTALLATION
Take care of the polarity of new IC and then install the
new IC fitting on the printed circuit pattern. Then solder
each lead on the diagonal positions of IC temporarily.
(Refer to Fig. 1-5.)
new IC fitting on the printed circuit pattern. Then solder
each lead on the diagonal positions of IC temporarily.
(Refer to Fig. 1-5.)
1.
Fig. 1-5
Solder temporarily
C-1
SERVICE MODE LIST
This unit provided with the following SERVICE MODES so you can repair, examine and adjust easily.
To enter the Service Mode, press both set key and remote control key for more than 2 seconds.
To enter the Service Mode, press both set key and remote control key for more than 2 seconds.
Set Key
Remocon Key
Operations
VOL. (-) MIN
1
Initialization of the factory.
NOTE: Do not use this for the normal servicing.
NOTE: Do not use this for the normal servicing.
If you set a factory initialization, the memories are reset such as the channel setting,
and the POWER ON total hours.
and the POWER ON total hours.
VOL. (-) MIN
6
POWER ON total hours is displayed on the screen.
Refer to the "CONFIRMATION OF HOURS USED".
Refer to the "CONFIRMATION OF HOURS USED".
Can be checked of the INITIAL DATA of MEMORY IC.
Refer to the "WHEN REPLACING EEPROM (MEMORY) IC".
Refer to the "WHEN REPLACING EEPROM (MEMORY) IC".
VOL. (-) MIN
Display of the Adjustment MENU on the screen.
Refer to the "ELECTRICAL ADJUSTMENT" (On-Screen Display Adjustment).
Refer to the "ELECTRICAL ADJUSTMENT" (On-Screen Display Adjustment).
9
CONFIRMATION OF HOURS USED
POWER ON total hours can be checked on the screen. Total hours are displayed in 16 system of notation.
NOTE: If you set a factory initialization, the total hours is reset to "0".
1.
2.
2.
3.
Set the VOLUME to minimum.
Press both VOL. DOWN button on the set and Channel
button (6) on the remote control for more than 2 seconds.
After the confirmation of using hours, turn off the power.
Press both VOL. DOWN button on the set and Channel
button (6) on the remote control for more than 2 seconds.
After the confirmation of using hours, turn off the power.
ADDRESS
DATA
INIT 000 00
LCD ON 0010
OEC7127_001
FIG. 1
Initial setting content of MEMORY IC.
POWER ON total hours.
= (16 x 16 x 16 x thousands digit value)
+ (16 x 16 x hundreds digit value)
+ (16 x tens digit value)
+ (ones digit value)
+ (16 x 16 x hundreds digit value)
+ (16 x tens digit value)
+ (ones digit value)
MICON Version
C-2
WHEN REPLACING EEPROM (MEMORY) IC
00
81
C0
80
70
82
84
42
EF
+0
+1
+2
+3
+4
+5
+6
+7
+8
+9
+A
+B
+C
+D
+E
+F
INI
07
00
00
EA
01
12
10
00
AA
00
01
50
29
24
73
4D
03
10
40
00
00
00
00
00
00
00
00
00
00
00
00
15
00
00
00
00
00
00
F4
30
00
80
00
F3
000
010
00
99
00
00
00
14
0A
020
00
00
00
00
00
00
030
00
00
00
00
00
00
040
00
00
00
00
00
00
0E
07
B3
30
00
00
00
00
00
00
00
00
00
00
00
00
40
46
65
6A
050
00
00
00
00
00
00
00
060
49
54
63
67
2A
2D
30
36
40
44
48
4C
50
55
5A
60
62
62
64
64
65
65
66
66
67
6A
6B
6B
6C
6C
6D
6D
6E
6E
6E
2A
30
33
36
40
44
48
4C
50
070
33
5A
5C
5C
5E
5E
60
080
67
68
68
69
69
6A
090
6F
6F
70
70
71
71
0A0
2D
55
5A
5A
5C
5C
5E
5E
60
62
62
64
64
65
65
66
0B0
60
66
67
67
68
68
69
69
6A
6B
6B
6C
6C
6D
6D
6E
71
71
00
00
00
00
00
14
0A
10
A4
D4
C1
3C
F6
8C
5C
62
A0
A0
00
00
00
00
00
00
00
00
00
0C0
6A
6E
6E
6F
6F
70
70
0D0
01
00
2C
13
74
6C
0E0
16
16
A0
A0
16
16
0F0
00
00
00
00
00
00
00
31
28
90
08
08
20
80
80
80
20
04
04
02
00
00
00
00
01
00
600
F0
7F
7F
7F
F1
6E
80
610
00
00
00
00
00
00
38
20
90
10
08
60
80
80
80
28
04
04
02
00
00
00
00
01
00
41
F0
60
80
08
08
20
80
80
80
620
30
80
80
80
F1
6E
B8
630
00
00
00
00
00
00
640
7F
7F
7F
F1
6E
80
Main Micon side EEPROM (IC104) initial setting
If a service repair is undertaken where it has been required to change the MEMORY IC, the following steps should be taken to
ensure correct data settings while making reference to TABLE 1 and 2.
ensure correct data settings while making reference to TABLE 1 and 2.
ADDRESS
DATA
INIT 000 00
LCD ON 0010
OEC7127_001
FIG. 1
Table 1
20
04
02
00
00
00
00
01
00
53
F0
70
40
08
08
20
80
80
80
650
04
00
00
00
00
00
00
660
7F
7F
7F
F1
6E
80
20
04
02
00
00
00
00
01
00
67
F0
A0
2C
10
08
60
80
80
80
670
04
00
00
00
00
00
00
680
80
80
80
F1
6E
B8
---
28
04
04
02
00
00
00
00
01
00
690
00
00
00
00
00
00
67
F0
A0
3B
10
08
60
80
80
80
6A0
80
80
80
F1
6E
B8
28
04
04
02
00
00
00
00
01
00
6B0
00
00
00
00
00
00
6C0
6D0
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
FF
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