Sharp SM-SX100 (serv.man2) Service Manual ▷ View online
SM-SX100
– 17 –
EXPLANATION OF 1-BIT UNIT
1.
modulation 1-bit conversion circuit
The analog signals input from CNPA1 and CNPA2 are input from the terminals 17 and 20 of ICA1. At the input step of ICA1,
the signal input signal is regarded as the differential input signal, and the switching signal which is later called "dynamic
feedback" is attenuated and is regarded as the level-shifted negative feedback signal.
They are added, and is transmitted to the differential type primary integrator of the
the signal input signal is regarded as the differential input signal, and the switching signal which is later called "dynamic
feedback" is attenuated and is regarded as the level-shifted negative feedback signal.
They are added, and is transmitted to the differential type primary integrator of the
modulation 1-bit conversion circuit.
After they are integrated by the 2nd to 7th order integrator group, the integrated values of 2nd to 7th are added with the adder.
The added result is compared with Vdd/2 (=2.5 V) by the comparator, and is quantized. As the result, the 1-bit signal is gained.
Since the
The added result is compared with Vdd/2 (=2.5 V) by the comparator, and is quantized. As the result, the 1-bit signal is gained.
Since the
modulation circuit operates at 128fs (= 5.6448 MHz, fs = 44.1 kHz), the 1-bit signal exceeds the limit of the
switching speed of the power MOS-FET which is the switching element of the switching circuit of the later step.
Therefore, the signal is passed through the double width conversion circuit which doubles the pulse width to 64fs, and is output
from the terminals 2, 3, 5 and 6.
After the limiter is applied to the digital signal input from CNPA3 and CNPA4 at ZDA81 to ZDA84, it is directly transmitted to
the differential type primary integrator of the
Therefore, the signal is passed through the double width conversion circuit which doubles the pulse width to 64fs, and is output
from the terminals 2, 3, 5 and 6.
After the limiter is applied to the digital signal input from CNPA3 and CNPA4 at ZDA81 to ZDA84, it is directly transmitted to
the differential type primary integrator of the
modulation circuit from the feedback terminals 14, 15, 22 and 23. The signal
process hereafter is the same as that of the analog signal.
2. Switching logic circuit
The output signal of ICA1 is distributed to FET driver IC for the full bridge in the switching circuit by ICA2 and ICA3 of the logic
circuit IC.
circuit IC.
3. Level shift circuit
Though the output is L (0 V) or H (5 V) in ICA2 and ICA3, they shift the level from the reference voltage -32 V of the FET driver
IC to L (-32 V) and H (-22 V) with QA1 to QA8 and 1 kohms (RA45 to RA52) and 390 ohms (RA37 to RA44), and it is used as
the FET drive signal.
IC to L (-32 V) and H (-22 V) with QA1 to QA8 and 1 kohms (RA45 to RA52) and 390 ohms (RA37 to RA44), and it is used as
the FET drive signal.
4. FET driver circuit
In the bridge circuit composed using the N channel power MOS-FET, the source of the power MOS-FET of the high side
fluctuates in the potential in the output state, being the floating drive type.
Accordingly, the auxiliary power supply to supply the power to the gate becomes necessary. Here, the boot strap circuit is used
as the auxiliary power supply.
When H (-22 V) is supplied to the terminal No. 6 of FET driver IC (ICA4 to ICA7), the terminal No. 8 is driven to turn on FET
of the low side. As shown in the illustration of the boot strap circuit, the current
fluctuates in the potential in the output state, being the floating drive type.
Accordingly, the auxiliary power supply to supply the power to the gate becomes necessary. Here, the boot strap circuit is used
as the auxiliary power supply.
When H (-22 V) is supplied to the terminal No. 6 of FET driver IC (ICA4 to ICA7), the terminal No. 8 is driven to turn on FET
of the low side. As shown in the illustration of the boot strap circuit, the current
1
flows, and the electric charge is accumulated
in the boot strap capacitor C. In the practical circuit, it corresponds to CA36 to CA39 connected to the terminal 2.
When H (-22 V) is applied to the terminal 5, the terminal 3 is driven to turn on FET of the high side.
At this time, the electric charge accumulated at
When H (-22 V) is applied to the terminal 5, the terminal 3 is driven to turn on FET of the high side.
At this time, the electric charge accumulated at
1
is discharged, and the current
2
flows to charge Cgs of FET as shown in
the illustration of the boot strap circuit.
5. Power switching circuit
+32 V and -32 V are switched with the power MOS-FET (QA9 to QA16).
(When the impedance switch is a 4 ohms load, +24 V and -24 V are applied.)
(When the impedance switch is a 4 ohms load, +24 V and -24 V are applied.)
6. Low pass filter circuit
From the signal switched by the power switch circuit, the analog signal is picked out by the low pass filter composed of the 4th
order Butterworth type of the cutoff frequency 100 kHz.
order Butterworth type of the cutoff frequency 100 kHz.
7. Dynamic feedback circuit (feedback circuit)
The signal which is switched with the power switching circuit is divided by the resistors of the fixed type of 6.8 kohms (RA101,
RA102), semi-fixed type of 200 ohms (VRA1, VRA2) and the fixed type of 680 ohms (RA61 and RA62) on the variable side and
the fixed type of 6.8 kohms (RA103 and RA104) and the fixed type of 750 ohms (RA63 and RA64), and is attenuated to +5 V,
0 V.
RLYA1 turns on the relay when the impedance switch is a 8 ohms load to change the resistance division ratio.
The attenuated +5 V, 0 V signal is shifted to the level of Vdd/2 of the terminals 18 and 19 through the resistor (RA91 to RA94),
and is input to the feedback terminals 14, 15, 22 and 23 as the signal of +2.5 V and -2.5 V.
RA102), semi-fixed type of 200 ohms (VRA1, VRA2) and the fixed type of 680 ohms (RA61 and RA62) on the variable side and
the fixed type of 6.8 kohms (RA103 and RA104) and the fixed type of 750 ohms (RA63 and RA64), and is attenuated to +5 V,
0 V.
RLYA1 turns on the relay when the impedance switch is a 8 ohms load to change the resistance division ratio.
The attenuated +5 V, 0 V signal is shifted to the level of Vdd/2 of the terminals 18 and 19 through the resistor (RA91 to RA94),
and is input to the feedback terminals 14, 15, 22 and 23 as the signal of +2.5 V and -2.5 V.
SM-SX100
– 18 –
14/23
17/20
IN
15/22
NF(+)
NF(–)
NF(–)
-1
-1
Integrator/Adder
Group
Comparator
Double width
conversion
Input Step
Figure 18-1
MODULATION 1-BIT CONVERSION CIRCUIT
Vs
1
2
4
Q
1
Q
2
C
R
i
i
C
GS
X
point
Y point
Diode prevents
i
i
2
from
returning to Vs.
Q2 is turned on,
and the holding
gate voltage is
gained from C.
It is necessary to
periodically
charge C.
and the holding
gate voltage is
gained from C.
It is necessary to
periodically
charge C.
Figure 18-2 BOOT STRAP CIRCUIT
• Protect circuit
When the protect circuit is activated, the speaker relays RLY107 and RLY108 and the power relay RLY106 are turned off, and
the function switch key is not received.
When the power switch is turned off, it is once reset.
For detection, the overcurrent detection circuit and the output offset detection circuit are provided and the relays and so on are
controlled by the microcomputer.
the function switch key is not received.
When the power switch is turned off, it is once reset.
For detection, the overcurrent detection circuit and the output offset detection circuit are provided and the relays and so on are
controlled by the microcomputer.
• Current detection section (Fig. 19-1)
If any overcurrent flows in R256, the potential difference will be generated both ends of R256 to supply it to Pins 2 and 3 of IC201.
If the output signal from Pin 1 of the output of IC201 is supplied to the comparator IC201 (Pins 5 to 7) (through the time constant
circuit) and reaches the level of the specified value or more, the comparator will be activated to set H at Pin 7. Then, the
transistors Q201 and Q202 will be turned on, and the signal of H level will be supplied to Pin 27 of the microcomputer IC904.
Thus, the protect will be activated.
If the output signal from Pin 1 of the output of IC201 is supplied to the comparator IC201 (Pins 5 to 7) (through the time constant
circuit) and reaches the level of the specified value or more, the comparator will be activated to set H at Pin 7. Then, the
transistors Q201 and Q202 will be turned on, and the signal of H level will be supplied to Pin 27 of the microcomputer IC904.
Thus, the protect will be activated.
• Offset detection section (Fig. 19-2)
If any potential difference is generated between the terminals of the speaker (L+ and L- as an example), the potential which
drives Q651 and Q653 will stand at the terminal connected section of the emitter of Q651 or the base of Q653, and either will
be turned on. (Pin 1 of IC651 as reference)
(If + level is established, Q653 will be turned on, and if - level is established, Q651 will be turned on.)
If Q651, Q653 or Q652, Q654 are turned on, Q201 will be activated like the said current detection to supply the signal of H level
to Pin 27 of the microcomputer IC904.
drives Q651 and Q653 will stand at the terminal connected section of the emitter of Q651 or the base of Q653, and either will
be turned on. (Pin 1 of IC651 as reference)
(If + level is established, Q653 will be turned on, and if - level is established, Q651 will be turned on.)
If Q651, Q653 or Q652, Q654 are turned on, Q201 will be activated like the said current detection to supply the signal of H level
to Pin 27 of the microcomputer IC904.
SM-SX100
– 19 –
Figure 19-1 OVERCURRENT DETECTION CIRCUIT
4
1
3
2
5
6
7
8
From OFF-SET Detection Section
R256
Detection
Resistor
Detection
Resistor
R228
10K
(VRN)
R227
100K
100K
(VRN)
C614
0.01
R202
47K
(VRN)
C201
0.01
Q202
2SC2412 KR
Q210
2SC2412 KR
Q208
2SC2412 KR
D202
DA119
R203
100K
100K
(VRN)
R204
10K
(VRN)
R233
100K
100K
R206
100K
100K
(VRN)
D203
DA119
R205
10K
(VRN)
Q201
2SA1037 KR
R201
100K
100K
(VRN)
D204
DA119
D206
DA119
R214
10K
(VRN)
R213
10K
(VRN)
R211
4.7K
(VRN)
R210
47K
(VRN)
R209
4.7K
(VRN)
R208
4.7K
(VRN)
C205
0.01
C204
0.01
C203
0.01
C219
10/25
R212
4.7K
(VRN)
C218
10/25
R180
2.7K
(VRN)
R179
100K
100K
(VRN)
Q116
2SC2412KR
2SC2412KR
D107
DA119
RLY106
R207
47K
(VRN)
C202
0.01
C313
0.01
R217
100K
100K
(VRN)
C207
0.01
To
µ
-com
CNP106 Pin 12
IC904
Pin 27
+
–
+
–
MAIN PWB-A1(3/3)
1
4
3
2
7
5
6
8
C655
0.01
C654
0.01
R659
47K
R658
22K
R657
22K
R661
10K
C653
47/50
IC651
NJM4558M
MOTOR DRIVER
+32V
+B
MAIN-A
+15V
–15V
–32V
+32V
R660
4.7K
R652
15K
R654
15K
R656
10K
C652
33/50
D652
DA119
D651
DA119
R653
15K
R651
15K
C651
33/50
R655
10K
Q652
2SC2412KR
Q653
2SC2412KR
Q651
2SC2412KR
Q654
2SC2412KR
–15V
–B
–B
–B
–B
–B
+B
–32V
+15V
+B
+B
+B
P39 9 - H,12 - C,12 - G
TO MAIN SECTION
L+
L–
R+
R–
A
3
4
6
5
4
6
5
B
C
E
C
E
D
Figure 19-2
SM-SX100
– 20 –
WIRING PROCESS DIAGRAM
1
- -
+ +
+ +
- -
Check the wiring process.
Any lead CNP101 (4P), CNP102 (3P) or CMP109 (6P)
does not interfere with the cement resistor or heat sink plate.
does not interfere with the cement resistor or heat sink plate.
CNP109
Heat Sink
Cement
Resistor
Resistor
The cement resistor falls down 90 degrees toward the chassis.
On CNP101(4P) and CNP102(3P) leads, the sag is processed on the
new panel side to avoid the cement resistor.
new panel side to avoid the cement resistor.
The sag of CNP101(4P) and CNP102(3P) is
processed with the nylon band bundle.
processed with the nylon band bundle.
Nylon Band
Line process clamper
Side view of bottom chassis
Pin 9 lead form the 1-bit unit is inserted to
(CNP109), and the sag of the lead is
processed as shown.
(CNP109), and the sag of the lead is
processed as shown.
Pin 9 lead form the 1-bit unit is inserted to
(CNP109), and the sag of the lead is
processed as shown.
(CNP109), and the sag of the lead is
processed as shown.
Pin 9 Lead
CNP109
Pin 9 Lead
CNP109
or
Pin 3 lead from the 1-bit unit is inserted to the upper clamp of the
power shield, and Pin 4 lead is inserted to the lower clamp.
power shield, and Pin 4 lead is inserted to the lower clamp.
CNP101
CNP102
Figure 20-1
1
1
1
1
-
+
-
+
1
-
+
-
+
Press SP lead into the clearance between
case and PWB along the chassis.
Collect the sag of the lead toward the arrow
side.
It must not interfere with the lag set screw of
A section.
case and PWB along the chassis.
Collect the sag of the lead toward the arrow
side.
It must not interfere with the lag set screw of
A section.
When processing the line, recheck whether
the lead from 1 bit (3 places) and the lead
connector from the main volume are securely
pushed in.
the lead from 1 bit (3 places) and the lead
connector from the main volume are securely
pushed in.
Press it into the clearance between
PWB and case. CNP107 and CNP108
leads must be present on the volume lead.
PWB and case. CNP107 and CNP108
leads must be present on the volume lead.
Nylon Band
CNP109
Pin 9 Lead
Nylon Band
Pin 9 Lead
CNP109
Reinsert Pin 9 lead from 1 bit to (CNP109),
process the sag of the lead as shown, and
insert the nylon band into the digital PWB hole.
Then, bundle it.
After processing, push in the lead under the
PWB (arrow direction).
After processing the line, check whether
CNP109 gets off or not.
process the sag of the lead as shown, and
insert the nylon band into the digital PWB hole.
Then, bundle it.
After processing, push in the lead under the
PWB (arrow direction).
After processing the line, check whether
CNP109 gets off or not.
Reinsert Pin 9 lead from 1 bit to (CNP109),
process the sag of the lead as shown, and
insert the nylon band into the digital PWB hole.
Then, bundle it.
After processing, push in the lead under the
PWB (arrow direction).
After processing the line, check whether
CNP109 gets off or not.
process the sag of the lead as shown, and
insert the nylon band into the digital PWB hole.
Then, bundle it.
After processing, push in the lead under the
PWB (arrow direction).
After processing the line, check whether
CNP109 gets off or not.
or
A
1BIT UNIT
Nylon
Band
Band
CNP601
Bundle the main volume lead on
the main volume hardware as shown.
After bundling, verify that CNP601
does not get off.
the main volume hardware as shown.
After bundling, verify that CNP601
does not get off.
Insert pin 3 lead from 1 bit to the
free line process clamp on the
upper part of the power shield.
free line process clamp on the
upper part of the power shield.
Figure 20-2
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